William J Hollywood

US Patent:

59085304, Jun 1, 1999

Filed:

May 18, 1995

Appl. No.:

8/443956

Inventors:

Jon A. Hoshizaki - Cupertino CA
Roger O. Williams - Fremont CA
James D. Buhler - Shingle Springs CA
Charles A. Reichel - Fremont CA
William K. Hollywood - San Carlos CA
Richard De Geus - Cupertino CA
Lawrence L. Lee - Mountain View CA

Assignee:

Obsidian, Inc. - Fremont CA

International Classification:

B24B 3700

US Classification:

156345

Abstract:

An apparatus for polishing wafers, preferably by chemical mechanical polishing. The apparatus includes a table defining a planar polishing surface adapted to contain a polishing medium and a wafer carrier assembly adapted to hold a wafer against the polishing surface. The wafer carrier assembly includes a wafer carrier and prevents rotation of the wafer carrier with respect to the polishing table even when the wafer carrier is moved in a circular or orbital path on the polishing surface. Polishing is carried out relative movement between the wafer carrier and the polishing surface in any direction within the plane of the polishing surface. The relative movement can be accomplished by moving the wafer carrier, the polishing table, or a combination of movements of the wafer carrier and polishing table.

US Patent:

57599181, Jun 2, 1998

Filed:

Aug 13, 1996

Appl. No.:

8/689741

Inventors:

Jon A. Hoshizaki - Cupertino CA
Roger O. Williams - Fremont CA
James D. Buhler - Shingle Springs CA
Charles A. Reichel - Fremont CA
William K. Hollywood - San Carlos CA
Richard de Geus - Cupertino CA
Lawrence L. Lee - Mountain View CA

Assignee:

Obsidian, Inc. - Fremont CA

International Classification:

B24B 100

US Classification:

438692

Abstract:

A method and apparatus is disclosed for polishing the face of a semiconductor wafer. The wafer is held in position by a tooling head and is contacted by an abrasive pad. A table is provided on to which the abrasive pad is fixedly attached, both of which move in directions parallel to the face of the wafer being polished. A controller controls the motion of the table according to a predetermined polishing pattern and is capable of maintaining a constant velocity between the wafer and the abrasive pad. The tooling head includes a circular platen and a retention ring peripherally oriented about the outer edge of the platen which resists lateral forces on the wafer caused by engagement of the face of the wafer with the polishing surface. An adjustable coupling is mounted to the platen and the ring, and serves to adjustably position during polishing the height of the ring relative to the face of the wafer as well as to rigidly support during polishing the position of the retaining ring. A flexible disk is fixedly mounted between a support post and the platen and oriented substantially parallel to the face of the platen.

US Patent:

59388846, Aug 17, 1999

Filed:

Jul 25, 1997

Appl. No.:

8/900750

Inventors:

Jon A. Hoshizaki - Cupertino CA
Roger O. Williams - Fremont CA
James D. Buhler - Shingle Springs CA
Charles A. Reichel - Fremont CA
William K. Hollywood - San Carlos CA
Richard de Geus - Cupertino CA
Lawrence L. Lee - Mountain View CA

Assignee:

Obsidian, Inc. - Fremont CA

International Classification:

B24B 3700

US Classification:

156345

Abstract:

A method and apparatus is disclosed for polishing the face of a semiconductor wafer. The wafer is held in position by a tooling head and is contacted by an abrasive pad. A table is provided on to which the abrasive pad is fixedly attached, both of which move in directions parallel to the face of the wafer being polished. A controller controls the motion of the table according to a predetermined polishing pattern and is capable of maintaining a constant velocity between the wafer and the abrasive pad. The tooling head includes a circular platen and a retention ring peripherally oriented about the outer edge of the platen which resists lateral forces on the wafer caused by engagement of the face of the wafer with the polishing surface. An adjustable coupling is mounted to the platen and the ring, and serves to adjustably position during polishing the height of the ring relative to the face of the wafer as well as to rigidly support during polishing the position of the retaining ring. A flexible disk is fixedly mounted between a support post and the platen and oriented substantially parallel to the face of the platen.

US Patent:

56929501, Dec 2, 1997

Filed:

Aug 8, 1996

Appl. No.:

8/694357

Inventors:

Denise R. Rutherford - Stillwater MN
Douglas P. Goetz - St. Paul MN
Cristina U. Thomas - Woodbury MN
Richard J. Webb - Inver Grove Heights MN
Wesley J. Bruxvoort - Woodbury MN
James D. Buhler - Shringle Springs CA
William J. Hollywood - San Carlos CA

Assignee:

Minnesota Mining and Manufacturing Company - St. Paul MN

International Classification:

B23F 2103

US Classification:

451552

Abstract:

An abrasive construction for modifying a surface of a workpiece, such as a semiconductor wafer. The abrasive construction comprises: a three-dimensional, textured, fixed abrasive element; at least one resilient element generally coextensive with the fixed abrasive element; and at least one rigid element generally coextensive with and interposed between the resilient element and the fixed abrasive element, wherein the rigid element has a Young's Modulus greater than that of the resilient element.

US Patent:

60074078, Dec 28, 1999

Filed:

Aug 20, 1997

Appl. No.:

8/915058

Inventors:

Denise R. Rutherford - Stillwater MN
Douglas P. Goetz - St. Paul MN
Cristina U. Thomas - Woodbury MN
Richard J. Webb - Inver Grove Heights MN
Wesley J. Bruxvoort - Woodbury MN
James D. Buhler - Shringle Springs CA
William J. Hollywood - San Carlos CA

Assignee:

Minnesota Mining and Manufacturing Company - St. Paul MN
Exclusive Design Company, Inc. - Fremont CA

International Classification:

B24B 500

US Classification:

451 41

Abstract:

An abrasive construction for modifying a surface of a workpiece, such as a semiconductor wafer. The abrasive construction comprises: a three-dimensional, textured, fixed abrasive element; at least one resilient element generally coextensive with the fixed abrasive element; and at least one rigid element generally coextensive with and interposed between the resilient element and the fixed abrasive element, wherein the rigid element has a Young's Modulus greater than that of the resilient element.