David M. Kolesar - Gulph Mills PA, US Robert L. Post - Ivyland PA, US Alan H. Saikin - Landenberg PA, US Aaron Sarafinas - Ivyland PA, US
Assignee:
Rohm and Haas Electronic Materials CMP Holdings, Inc. - Newark DE
International Classification:
B29C 44/06 B01F 13/02
US Classification:
425447, 366137, 366139
Abstract:
The present invention provides an apparatus for forming a chemical mechanical polishing pad, comprising a tank with polymeric materials, a storage silo with microspheres and a curative storage tank with curing agents. The apparatus further provides a premix prep tank for forming a pre-mixture of the polymeric materials and the microspheres and a recirculation loop in the premix prep tank for recirculating the pre-mixture until a desired bulk density is reached. The apparatus further provides a premix run tank for storing the pre-mixture, a mixer for forming a mixture of the pre-mixture and the curing agents and a mold for molding the mixture.
Method Of Manufacturing Chemical Mechanical Polishing Layers
- Newark DE, US Alan Saikin - Landenberg PA, US David Kolesar - Gulph Mills PA, US Aaron Sarafinas - Ivyland PA, US Robert L. Post - Ivyland PA, US
International Classification:
B24B 37/24 B24D 3/32 B24D 18/00
Abstract:
A method of making a polishing layer for polishing a substrate selected from at least one of a magnetic substrate, an optical substrate and a semiconductor substrate is provided, comprising: providing a liquid prepolymer material; providing a plurality of hollow microspheres; exposing the plurality of hollow microspheres to a carbon dioxide atmosphere for an exposure period to form a plurality of treated hollow microspheres; combining the liquid prepolymer material with the plurality of treated hollow microspheres to form a curable mixture; allowing the curable mixture to undergo a reaction to form a cured material, wherein the reaction is allowed to begin ≦24 hours after the formation of the plurality of treated hollow microspheres; and, deriving at least one polishing layer from the cured material; wherein the at least one polishing layer has a polishing surface adapted for polishing the substrate.