Calvin G Leong

US Patent:

7917327, Mar 29, 2011

Filed:

Jul 7, 2010

Appl. No.:

12/831777

Inventors:

Ramon S. Co - Trabuco Canyon CA, US
Tat Leung Lai - Torrance CA, US
Calvin G. Leong - Irvine CA, US

Assignee:

Kingston Technology Corp. - Fountain Valley CA

International Classification:

G06F 19/00
G06F 17/40

US Classification:

702121, 221 1, 221 92, 700213, 700228, 700230, 700248, 702108, 702117, 702187

Abstract:

Two robotic arms roam in separate, non-overlapping areas of a test station, avoiding collisions. A traveling buffer moves along x-tracks between a front position and a back position. In the front position, a first robotic arm loads IC chips from an input tray or stacker into buffer cavities in the traveling buffer. The traveling buffer then moves along the x-tracks to the back position, where a second robotic arm moves chips from the traveling buffer to test boards for testing. After testing, the second robotic arm moves chips to a second traveling buffer, which then moves along tracks to a front position for unloading by the first robotic arm. Two traveling buffers may move on the same tracks in a loop. The buffer cavities in the traveling buffer move on internal tracks to expand and contract spacing and pitch between the front and back positions to match test-board pitch.

US Patent:

20090138119, May 28, 2009

Filed:

Nov 24, 2007

Appl. No.:

11/944614

Inventors:

Ramon S. Co - Trabuco Canyon CA, US
Tat Leung Lai - Torrance CA, US
Calvin G. Leong - Irvine CA, US

Assignee:

KINGSTON TECHNOLOGY CORP. - Fountain Valley CA

International Classification:

G06F 19/00

US Classification:

700121

Abstract:

Two robotic arms roam in separate, non-overlapping areas of a test station, avoiding collisions. A traveling buffer moves along x-tracks between a front position and a back position. In the front position, a first robotic arm loads IC chips from an input tray or stacker into buffer cavities in the traveling buffer. The traveling buffer then moves along the x-tracks to the back position, where a second robotic arm moves chips from the traveling buffer to test boards for testing. After testing, the second robotic arm moves chips to a second traveling buffer, which then moves along tracks to a front position for unloading by the first robotic arm. Two traveling buffers may move on the same tracks in a loop. The buffer cavities in the traveling buffer move on internal tracks to expand and contract spacing and pitch between the front and back positions to match test-board pitch.