Ashay A Dani

US Patent:

6926955, Aug 9, 2005

Filed:

Feb 8, 2002

Appl. No.:

10/071743

Inventors:

Saikumar Jayaraman - Chandler AZ, US
Paul A. Koning - Chandler AZ, US
Ashay Dani - Chandler AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

B23B005/16

US Classification:

428323, 428 68, 428402, 428645, 428673, 524432, 524437, 524495

Abstract:

According to one aspect of the invention, a structure and method for providing improved thermal conductivity of a thermal interface material (TIM) made of phase changed polymer matrix and a fusible filler material is disclosed. The TIM may also have a non-fusible filler material and a percentage of a non-phase change polymer added to the phase change polymer matrix. The TIM, used to mate and conduct heat between two or more components, can be highly filled systems in a polymeric matrix where the fillers are thermally more conductive than the polymer matrix.

US Patent:

6974723, Dec 13, 2005

Filed:

Sep 30, 2004

Appl. No.:

10/956162

Inventors:

Paul A. Koning - Chandler AZ, US
Ashay A. Dani - Chandler AZ, US
Christopher L. Rumer - Chandler AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01L029/866

US Classification:

438106, 438108, 438122, 438584, 438610, 438424

Abstract:

A composition including an amount of at least one vinyl terminated polymer; an amount of at least one cross-linker comprising a terminal Si—H unit; an amount of at least one thermally conductive first filler, and at least one thermally conductive second filler, wherein a melting point of the first filler is greater than the melting point of the second filler. An apparatus including a package configured to mate with a printed circuit board; a semiconductor device coupled to the package; a thermal element; and a curable thermal material disposed between the thermal element and the semiconductor device.

US Patent:

6974726, Dec 13, 2005

Filed:

Dec 30, 2003

Appl. No.:

10/748446

Inventors:

Ashay A. Dani - Chandler AZ, US
Gudbjorg H. Oskarsdottir - Chandler AZ, US
Chris Matayabas, Jr. - Chandler AZ, US
Sujit Sharan - Chandler AZ, US
Chris L. Rumer - Chandler AZ, US
Beverly J. Canham - Chandler AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01L021/44

US Classification:

438114, 438113, 438458, 438460, 438462, 438463, 438465, 257620

Abstract:

A silicon wafer has a plurality of integrated circuits terminated on a surface of the silicon wafer. The silicon wafer has a soluble protective coat on the surface of the silicon wafer. The coated silicon wafer may be processed by laser scribing. A solvent wash may be used to remove the soluble protective coat and debris from laser scribing. The coated silicon wafer may be saw cut after laser scribing. A flow of solvent may be provided during the saw cutting. The flow of solvent may be sufficient to remove at least a substantial portion of the soluble protective coat.

US Patent:

7014093, Mar 21, 2006

Filed:

Jun 26, 2003

Appl. No.:

10/607738

Inventors:

Sabina J. Houle - Phoenix AZ, US
Ashay A. Dani - Chandler AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

B23K 31/02

US Classification:

228 563, 4282951

Abstract:

A process of making a multi-layer thermal interface material is depicted. The multi-layer thermal interface material is attached between an integrated heat spreader and a die. Processing of the multi-layer thermal interface material includes stamping or other pressure processing.

US Patent:

7030483, Apr 18, 2006

Filed:

Jun 30, 2003

Appl. No.:

10/612328

Inventors:

James C Matayabas - Chandler AZ, US
Ashay A. Dani - Chandler AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01L 23/10
H01L 23/34

US Classification:

257706, 257713

Abstract:

One embodiment of the invention includes a thermal interface material. The thermal interface material includes a polymer matrix; a plurality of fusible particles dispersed within the polymer matrix; and a plurality of non-fusible particles dispersed within the polymer matrix. The fusible particles have a mean particle size that is greater than the maximum particle size of the non-fusible particles. The thermal interface material improves performance of an integrated circuit.

US Patent:

7252877, Aug 7, 2007

Filed:

Feb 4, 2003

Appl. No.:

10/358526

Inventors:

Saikumar Jayaraman - Chandler AZ, US
Paul A. Koning - Chandler AZ, US
Ashay Dani - Chandler AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

B32B 27/00

US Classification:

428323

Abstract:

Embodiments of the present invention provide various polymeric matrices that may be used as a binder matrix for polymer solder hybrid thermal interface materials. In alternative embodiments the binder matrix material may be phophozene, perfluoro ether, polyether, or urethane. For one embodiment, the binder matrix is selected to provide improved adhesion to a variety of interfaces. For an alternative embodiment the binder matrix is selected to provide low contact resistance. In alternative embodiments, polymeric materials containing fusible and non-fusible particles may be used in application where heat removal is desired and is not restricted to thermal interface materials for microelectronic devices.

US Patent:

7253523, Aug 7, 2007

Filed:

Jul 29, 2003

Appl. No.:

10/630550

Inventors:

Ashay A. Dani - Chandler AZ, US
Scott Gilbert - Chandler AZ, US
Ajit V. Sathe - Chandler AZ, US
Ravi Prasher - Phoenix AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01L 23/10

US Classification:

257762, 257706, 257707, 257E23075

Abstract:

A process of making a reworkable thermal interface material is described. The reworkable thermal interface material is bonded to a die and a heat sink. The reworkable thermal interface material includes a phase-change polymer matrix material. Other materials in the reworkable thermal interface material can include heat transfer particles and low melting-point metal particles. The phase-change polymer matrix material includes a melting temperature below a selected temperature and the heat transfer particles have a melting temperature substantially above the selected temperature. The heat transfer particles act as a spacer limit, which holds the thermal interface material to a given bond-line thickness during use.

US Patent:

7294394, Nov 13, 2007

Filed:

May 13, 2005

Appl. No.:

11/129516

Inventors:

Saikumar Jayaraman - Chandler AZ, US
Paul A. Koning - Chandler AZ, US
Ashay Dani - Chandler AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

B23B 5/16

US Classification:

428323, 428 68, 428402, 428645, 428673, 524432, 524437, 524495, 29611, 29620, 29832

Abstract:

According to one aspect of the invention, a structure and method for providing improved thermal conductivity of a thermal interface material (TIM) made of phase changed polymer matrix and a fusible filler material is disclosed. The TIM may also have a non-fusible filler material and a percentage of a non-phase change polymer added to the phase change polymer matrix. The TIM, used to mate and conduct heat between two or more components, can be highly filled systems in a polymeric matrix where the fillers are thermally more conductive than the polymer matrix.