Adam D Ticknor

US Patent:

6492238, Dec 10, 2002

Filed:

Jun 22, 2001

Appl. No.:

09/887310

Inventors:

David C. Ahlgren - Wappingers Falls NY
Gregory G. Freeman - Hopewell Junction NY
Feng-Yi Huang - Hacienda Heights CA
Adam D. Ticknor - Wappingers Falls NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2100

US Classification:

438322, 438202, 438327, 438319, 438309

Abstract:

A process for forming a bipolar transistor with a raised extrinsic base, an emitter, and a collector integrated with a CMOS circuit with a gate. An intermediate semiconductor structure is provided having CMOS and bipolar areas. An intrinsic base layer is provided in the bipolar area. A base oxide is formed across, and a sacrificial emitter stack silicon layer is deposited on, both the CMOS and bipolar areas. A photoresist is applied to protect the bipolar area and the structure is etched to remove the sacrificial layer from the CMOS area only such that the top surface of the sacrificial layer on the bipolar area is substantially flush with the top surface of the CMOS area. Finally, a polish stop layer is deposited having a substantially flat top surface across both the CMOS and bipolar areas suitable for subsequent chemical-mechanical polishing (CMP) to form the raised extrinsic base.

US Patent:

6500054, Dec 31, 2002

Filed:

Jun 8, 2000

Appl. No.:

09/590576

Inventors:

William H. Ma - Fishkill NY
Adam D. Ticknor - Wappingers Falls NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B24B 100

US Classification:

451 56, 451443, 451529

Abstract:

A chemical-mechanical polishing (CMP) pad conditioner. The conditioner has a non-uniform conditioning surface with a plurality of conditioning elements. The non-uniform surface comprises a first section having a first cutting volume per unit width and a second section having a second cutting volume per unit width that is different from the first cutting volume per unit width. The difference in cutting volume may be provided by different projected widths of the individual conditioning elements, by a difference in the linear density between the two sections, or by a difference in the cutting depth. A CMP tool comprising a polishing pad, a conditioning pad having the disclosed structure, and a mechanism for moving the polishing pad relative to the pad conditioner is also provided. A method is further provided for uniformly conditioning a CMP pad using a conditioner having the structure described.

US Patent:

6667521, Dec 23, 2003

Filed:

Oct 29, 2002

Appl. No.:

10/283739

Inventors:

David C. Ahlgren - Wappingers Falls NY
Gregory G. Freeman - Hopewell Junction NY
Feng Yi Huang - Hacienda Heights CA
Adam D. Ticknor - Wappingers Falls NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2976

US Classification:

257370

Abstract:

A process for forming a bipolar transistor with a raised extrinsic base, an emitter, and a collector integrated with a CMOS circuit with a gate. An intermediate semiconductor structure is provided having CMOS and bipolar areas. An intrinsic base layer is provided in the bipolar area. A base oxide is formed across, and a sacrificial emitter stack silicon layer is deposited on, both the CMOS and bipolar areas. A photoresist is applied to protect the bipolar area and the structure is etched to remove the sacrificial layer from the CMOS area only such that the top surface of the sacrificial layer on the bipolar area is substantially flush with the top surface of the CMOS area. Finally, a polish stop layer is deposited having a substantially flat top surface across both the CMOS and bipolar areas suitable for subsequent chemical-mechanical polishing (CMP) to form the raised extrinsic base.

US Patent:

7510463, Mar 31, 2009

Filed:

Jun 7, 2006

Appl. No.:

11/422753

Inventors:

Ben Kim - Wappingers Falls NY, US
Manoj Balachandran - Wappingers Falls NY, US
James Aloysius Hagan - Hopewell Junction NY, US
Deoram Persaud - Bronx NY, US
Adam Daniel Ticknor - Poughquag NY, US
Wei-tsu Tseng - Hopewell Junction NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B24B 1/00
B24B 21/18

US Classification:

451 56, 451443

Abstract:

The present invention is an apparatus and method for extending the life of abrasive disks used in the conditioning of polishing pads used in chemical mechanical planarization (CMP) of polishing pads used to polish and/or planarize the surfaces of semiconductor wafers during the production of integrated circuits. The invention consists of the a disk comprising a plurality of abrasive segments, each of which is fixed in tangential and radial relationship to one another about the common axis of rotation of the conditioning disk. Means are provided for movement of the abrasive segments, individually or in sets, into or out of the plane of the active abrasive surface of the conditioning disk according to the present invention.

US Patent:

7556972, Jul 7, 2009

Filed:

Jan 25, 2007

Appl. No.:

11/626975

Inventors:

Manoj Balachandran - Wappingers Falls NY, US
James A. Hagan - Hopewell Junction NY, US
Ben Kim - Wappingers Falls NY, US
Deoram Persaud - Bronx NY, US
Adam D. Ticknor - Poughquag NY, US
Wei-tsu Tseng - Hopewell Junction NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G01R 31/26
H01L 21/00
H01L 21/302

US Classification:

438 14, 438 7, 438 8, 438690, 438691, 438692, 257E21304, 257E2126, 257E2124

Abstract:

Processes and apparatuses are disclosed for detecting and characterizing SiCOH-based dielectric materials during integrated circuit fabrication. The processes generally include chromatographically analyzing a fluid stream generated during a process employed for device fabrication, e. g. , during a wet strip, a chemical mechanical planarization process and the like.

US Patent:

8285414, Oct 9, 2012

Filed:

Mar 31, 2009

Appl. No.:

12/415348

Inventors:

Ehud Aharoni - Kfar Saba, IL
Robert J. Baseman - Brewster NY, US
Ramona Kei - Hopewell Junction NY, US
Oded Margalit - Ramat Gan, IL
Kevin Mackey - Wappingers Falls NY, US
Michal Rosen-Zvi - Jerusalem, IL
Raminderpal Singh - Cortlandt Manor NY, US
Noam Slonim - Jerusalem, IL
Hong Lin - Yorktown Heights NY, US
Fateh A. Tipu - Wappingers Falls NY, US
Adam D. Ticknor - Poughkeepsie NY, US
Timothy M. McCormack - Pleasant Valley NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G06F 19/00

US Classification:

700175, 409232

Abstract:

A method and system for evaluating a performance of a semiconductor manufacturing tool while manufacturing microelectronic devices are disclosed. At least one report is generated based on executions of at least one statistical test. The report includes at least one heat map having rows that correspond to sensors, columns that correspond to trace data obtained during recipe steps, and cells at the intersection of the rows and the columns. At least one sensor in the tool obtains trace data of a recipe step while manufacturing at least one microelectronic device. A computing device analyzes the obtained trace data to determine a level of operational significance found in the data and assigns a score to the trace data that indicates a level of operational significance. Then, the computing device places the score in a corresponding cell of the heat map. A user uses the cell for evaluating the tool performance.

US Patent:

8594826, Nov 26, 2013

Filed:

Sep 10, 2012

Appl. No.:

13/608032

Inventors:

Ehud Aharoni - Kfar Saba, IL
Robert J. Baseman - Brewster NY, US
Ramona Kei - Hopewell Junction NY, US
Oded Margalit - Ramat Gan, IL
Kevin Mackey - Wappingers Falls NY, US
Michal Rosen-Zvi - Jerusalem, IL
Raminderpal Singh - Essex Junction VT, US
Noam Slonim - Jerusalem, IL
Hong Lin - Yorktown Heights NY, US
Fateh A. Tipu - Wappingers Fall NY, US
Adam D. Ticknor - Poughkeepsie NY, US
Timothy M. McCormack - Pleasant Valley NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G06F 19/00

US Classification:

700121, 438 16, 700108

Abstract:

A method, a system and a computer program product suitable for use in a manufacturing environment comprising a multiplicity of nominally identical independent tools. A computing device generates a multi dimensional array of process trace data derived from at least one of the independent tools, wherein, the array includes data representing a first dimension comprising a list of steps in a manufacturing recipe and data representing a second dimension comprising a list of a set of sensors generating measurements from at least one of the independent tools. The computing device conducts an analysis on at least one preselected subset of the multi dimensional array for the purpose of evaluating at least one operating characteristic of at least one of the independent tools. The computing device presents results of the analysis via a set of hierarchically linked and browseable graphics.

US Patent:

20070190788, Aug 16, 2007

Filed:

Feb 15, 2006

Appl. No.:

11/276137

Inventors:

Manoj Balachandran - Wappingers Falls NY, US
James Hagan - Hopewell Junction NY, US
Ben Kim - Shelburne VT, US
Deoram Persaud - Bronx NY, US
Adam Ticknor - Poughquag NY, US
Wei-Tsu Tseng - Hopewell Junction NY, US

International Classification:

H01L 21/302
H01L 21/461
H01L 21/311

US Classification:

438692000, 438698000

Abstract:

Reduction of a wafer removing force on a chemical mechanical planarization (CMP) tool that includes planarizing a wafer on a platen at a wafer/platen interface; applying carbonated water to the wafer/platen interface so as to reduce the removing force; and removing the wafer from the platen.