Abstract:
Disclosed is a method for making relief deepenings in solid, hydrophylic, adhesive printing plate materials. The surface of the plate with an image unaffected by water is treated before making pressurized contact with another solid substance, i. e. removal medium. Non-imaged areas of the plate surface are softened and rendered actively adhesive by aforesaid treatment of water and are bonded to removal medium by said contact. Bond formed between plate parts and removal medium is terminated when the removal medium and the plate are forcefully separated; the removal medium carrying away the adhered plate material. Various embodiments of this basic method include the mode of plate surface treatment, means for controlling formation of image supporting sidewalls and different forms of removal medium. The method is employable with solid hydrophylic adhesive materials of organic or synthetic origin.