Samual D. Tonomura - Rancho Palos Verdes CA, US Terry C. Cisco - Glendale CA, US Clinton O. Holter - Long Beach CA, US
Assignee:
Raytheon Company - Waltham MA
International Classification:
H05K009/00
US Classification:
174 35R, 174255, 174260, 257659, 257778
Abstract:
A hybrid assembly having improved cross talk characteristics includes a substrate having an upper surface. Conductive paths on the upper surface are provided for conducting high frequency signals. Regular polygons made of an electromagnetic band gap (EBG) material having slow wave characteristics are deposited on the upper surface and form a lattice for tessellating the upper surface. Each of the polygons has a periphery. The polygons are separated along their periphery from adjacent polygons by an interspace and are covered with an insulating material. Second polygons, also made of an electromagnetic band gap material, are deposited over the insulating material. Semiconductor structures are mounted over the second polygons. The semiconductor structures have a plurality of electrical contacts with the conductive paths. The regular polygons can be hexagons, triangles, octagons or any other combination that forms a lattice and can be printed onto the substrate.
Tunable Transmission Line Time Delay Circuit Having Conductive Floating Strip Segments Connected By Switches
A tunable compact time delay circuit assembly is provided. In one embodiment, the invention relates to a tunable delay circuit assembly for controllably delaying signals that propagate along a transmission line, the circuit assembly including an elongated conductor extending in a first direction, the elongated conductor configured to carry the signals, at least one floating strip, each floating strip including a first elongated conductive segment having a first centerline, wherein the first centerline is not parallel to the first direction, and a second elongated conductive segment having a second centerline, wherein the second centerline is not parallel to the first direction, and a first switch coupled between the first segment and the second segment, wherein the first switch, in a first position, is configured to connect the first segment to the second segment, wherein the first switch, in a second position, is configured to electrically isolate the first segment from the second segment, and wherein the at least one floating strip is electrically isolated from other components of the circuit assembly.
Terry Cisco - Glendale CA, US Mary A. Teshiba - Torrance CA, US
Assignee:
Raytheon Company - Waltham MA
International Classification:
H01P 5/18 H01P 3/08
US Classification:
333116, 333109
Abstract:
Directional couplers are provided. In one embodiment, the directional coupler includes first and second transmission line segments positioned on a first plane and spaced apart by a first distance, third and fourth transmission line segments positioned on a second plane and spaced apart by a second distance, the second plane spaced apart from the first plane, a first conductive segment connecting the first and third transmission line segments, and a second conductive segment connecting the second and fourth transmission line segments, where the first and second transmission line segments are configured to couple energy therebetween, and where the third and fourth transmission line segments are configured to couple energy therebetween.
A circuit board assembly includes a circuit board, a chip attached to the circuit board and a dielectric layer. The chip has a circuit facing the circuit board and spaced from it. The dielectric layer includes an aerogel. In one embodiment, the aerogel has a dielectric constant of approximately 2.0 or less and a compression strength of at least approximately 100 psi.
Low Temperature Co-Fired Ceramic (Ltcc) High Density Interconnect Package With Circuitry Within The Cavity Walls
Kathleen Virga - Redondo Beach CA Terry Cisco - Glendale CA Joseph N. Owens - Santa Monica CA Craig Shoda - Torrance CA
Assignee:
Hughes Aircraft Company - Los Angeles CA
International Classification:
H01L 2302
US Classification:
174 524
Abstract:
A unitized integrally fused multilayer circuit package having a substrate, walls disposed on the substrate to form a central circuit package cavity, and circuit traces contained in the walls.
Terry C. Cisco - Glendale CA Algert G. Grimaila - Northridge CA
Assignee:
Whittaker Corporation - Burbank CA
International Classification:
G21C 1700
US Classification:
176 19R
Abstract:
A multi-sensor radiation detection system for removable insertion into a nuclear reactor wherein one conductor of all the sensors is a single, common element. This single common element is contained within a tubular metallic sheath and in cross-section comprises a multiple radial armed metallic conductor having a star shaped cross-section dimensioned to form wedge-shaped compartments throughout the active radiation detecting length of the metallic sheath.
Caed 1994 - 2014
Ieee Life Fellow Member Mtt-S
Ieee 1994 - 2014
Life Senior Member Mtt-S
Raytheon Feb 1994 - Feb 2011
Senior Fellow
Hughes Aircraft Company Nov 1977 - Jan 1997
Principal Scientist
Education:
University of California, Berkeley 2004 - 2005
Master of Science, Masters
University of California, Berkeley 1963 - 1964
Master of Science, Masters, Electronics Engineering
University of California, Berkeley 1958 - 1963
Skills:
Radar Systems Engineering Simulations Engineering Management Sensors Signal Processing Electronics Rf System Architecture Electrical Engineering Agilent Ads System Design Rf Design Semiconductors Dod Awr Microwave Office Ansoft Hfss Analog Circuit Design
Terry Cisco 1970 graduate of Brablec High School in Roseville, MI is on Memory Lane. Get caught up with Terry and other high school alumni from Brablec High
Terry Cisco 1979 graduate of Lookout Valley High School in Chattanooga, TN is on Memory Lane. Get caught up with Terry and other high school alumni from Lookout