Scott R Cheyne from 137 S Merrimack Rd, Hollis, NH 03049, age 47, Phone: 603-289-1270

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Busbar Connector
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US Patent:

7704083, Apr 27, 2010
Filed:

Mar 24, 2009
Appl. No.:

12/409639
Inventors:

Scott R. Cheyne - Brookline NH, US
Jeffrey Paquette - Newton MA, US
John D. Walker - Bolton MA, US
Dimitry Zarkh - Waltham MA, US
Assignee:

Raytheon Company - Waltham MA
International Classification:

H01R 4/60
US Classification:

439115, 439213
Abstract:

In one aspect, a busbar connector includes first and second portions. Each portion includes a rigid member forming an exterior portion of the busbar connector, a conduction member forming an interior portion of the busbar connector and a compliant member having a stiffness less than the rigid member and including a first surface attached to the rigid member and a second surface opposite the first surface attached to the conduction member. The busbar connector also includes a fastener structure configured to secure a first busbar and a second busbar between and in contact with the conduction members of the first and second portions to allow current to flow between the first and second busbars.

Translating Hinge
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US Patent:

8270169, Sep 18, 2012
Filed:

May 13, 2009
Appl. No.:

12/465120
Inventors:

Jeffrey Paquette - Newton MA, US
Scott R. Cheyne - Brookline NH, US
Assignee:

Raytheon Company - Waltham MA
International Classification:

H05K 5/00
H05K 7/20
F28F 7/00
E05D 7/04
E05D 5/10
E05F 1/08
US Classification:

361709, 361707, 36167946, 16235, 16242, 16289, 16386, 16255, 165 802
Abstract:

A translating hinge includes a translation element which provides translational movement between two objects coupled by the translating hinge and a rotating assembly coupled to the translation element.

Cooling Of Coplanar Active Circuits
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US Patent:

8355255, Jan 15, 2013
Filed:

Dec 22, 2010
Appl. No.:

12/975731
Inventors:

Scott R. Cheyne - Brookline NH, US
Jeffrey Paquette - Wakefield MA, US
Mark Ackerman - Sudbury MA, US
Assignee:

Raytheon Company - Waltham MA
International Classification:

H05K 7/20
F28F 9/013
US Classification:

361719, 36167946, 36167953, 36167954, 361704, 361721, 165 804, 16510433, 165185, 333260, 342373, 342375, 343853, 343700 MS
Abstract:

In one aspect, a system includes a first circuit board that includes integrated circuits, a first thermal spreader coupled to the integrated circuits of the first circuit board, a first compliant board coupled to the first circuit board, a second circuit board that includes integrated circuits and a second thermal spreader coupled to the integrated circuits of the second circuit board. The first circuit board and the first thermal spreader have a first thickness. The second daughter board and the second thermal spreader have a second thickness. The system further includes a second compliant board coupled to the second circuit board, a board assembly coupled to first and second compliant boards and a cold-plate assembly in contact with the first and second thermal spreaders. Either of the first or the second compliant boards is configured to expand or contract to account for the differences between the first and second thicknesses.

Assembly To Provide Thermal Cooling
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US Patent:

8363413, Jan 29, 2013
Filed:

Sep 13, 2010
Appl. No.:

12/880350
Inventors:

Jeffrey Paquette - Wakefield MA, US
Scott R. Cheyne - Brookline NH, US
Joseph R. Ellsworth - Worcester MA, US
Assignee:

Raytheon Company - Waltham MA
International Classification:

H05K 7/20
US Classification:

361721, 361699, 361702, 174 151, 165 804
Abstract:

In one aspect, an assembly to provide thermal cooling includes a first member having a first channel configured to receive a cooling fluid, a second member having a second channel configured to receive the cooling fluid and a first plurality of hollow and flexible conduits connecting the first and second members. Each of the first plurality of hollow and flexible conduits is configured to provide a path for the cooling fluid to flow between the first and second channels.

Cooling Active Circuits
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US Patent:

8508943, Aug 13, 2013
Filed:

Oct 16, 2009
Appl. No.:

12/580356
Inventors:

Paul A. Danello - Franklin MA, US
Scott R. Cheyne - Brookline NH, US
Joseph R. Ellsworth - Worcester MA, US
Thomas J. Tellinghuisen - Pelham NH, US
Assignee:

Raytheon Company - Waltham MA
International Classification:

H05K 7/20
H01Q 1/38
US Classification:

361704, 361688, 36167901, 343700 MS
Abstract:

In one aspect, an assembly includes a panel that includes a first surface. The panel also includes a first active circuit coupled to the first surface of the panel and a cold plate having a first bore. The cold plate includes a first inner surface exposed by the first bore. The panel further includes a first thermally conductive material in contact with the first inner surface of the cold plate and the first active circuit.

Heat Sink Interface Having Three-Dimensional Tolerance Compensation
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US Patent:

8537552, Sep 17, 2013
Filed:

Sep 25, 2009
Appl. No.:

12/566818
Inventors:

Jeffrey Paquette - Newton MA, US
Scott R. Cheyne - Brookline MA, US
Joseph R. Ellsworth - Pelham NH, US
Michael P. Martinez - Worcester MA, US
Michael R. Trahan - Northbridge MA, US
Assignee:

Raytheon Company - Waltham MA
International Classification:

H05K 7/20
F28F 7/00
H01Q 11/00
US Classification:

361710, 361717, 361711, 165185
Abstract:

A thermal interface includes a plurality of elevated regions and a plurality of mechanical tolerance circuits coupled to the plurality of elevated regions. The thermal interface is configured to be disposed between an array of heat generating elements and a heat sink with each of the plurality of elevated regions thermally coupled to a corresponding one or more of the array of heat generating elements. In one embodiment, the thermal interface provides a thermal path between a printed wiring board having a plurality of flip-chip circuit components disposed on an external surface thereof and a heat sink disposed over the flip-chip circuit components.

High Performance Compact Heat Exchanger
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US Patent:

20100038056, Feb 18, 2010
Filed:

Aug 15, 2008
Appl. No.:

12/228808
Inventors:

Joseph R. Ellsworth - Worcester MA, US
Scott R. Cheyne - Brookline NH, US
Michael E. Null - Marlborough MA, US
Michael P. Martinez - Worcester MA, US
David H. Altman - Framingham MA, US
Anthony J. Burdi - Waltham MA, US
International Classification:

F28F 7/00
F24H 3/02
US Classification:

165 803, 165121
Abstract:

A high performance compact heat exchanger includes a base plate with evaporator channels for cooling a heat source adjacent to the base plate. A condenser is connected to the base plate and includes fins with channels therein for the coolant. A pump delivers the coolant to the evaporator channels of the base plate after passing through the fins of the condenser.

Cold Chassis For Electronic Modules And Method Of Making Same
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US Patent:

20110114289, May 19, 2011
Filed:

Nov 16, 2009
Appl. No.:

12/590865
Inventors:

David H. Altman - Framingham MA, US
Scott R. Cheyne - Brookline NH, US
Anurag Gupta - Canton MA, US
International Classification:

F28F 7/00
B21D 53/04
US Classification:

165 804, 29890039
Abstract:

A cold chassis and method of making a cold chassis for electronic modules featuring the fabrication of individual brazed cooling ribs each including microchannels along the length thereof and a peripheral flange. A set of adjacent ribs are secured together and assembled onto at least one face of a frame member. The rib flanges are sealed (e.g., friction stir welded) with respect to the frame member.