Samuel I Donley

US Patent:

4171393, Oct 16, 1979

Filed:

Jun 20, 1977

Appl. No.:

5/808225

Inventors:

Samuel W. Donley - Rochester NY
Peter N. Bacel - Rochester NY

Assignee:

Eastman Kodak Company - Rochester NY

International Classification:

B05D 118
C23C 300

US Classification:

427354

Abstract:

An improved method for the electroless plating of metals is accomplished by a sustainable direct metal-metal ion displacement reaction on porous metal surfaces. It is applicable whenever the plating metal is more electronegative than the porous metal surface on which it is to be plated. The porous metal must be a catalyst for the displacement reaction, and the pores of the porous metal surface must be large enough to enable plating solution to wet the internal surfaces of the pores and to enable cations of the porous metal to diffuse into the plating solution, but the pores must not be so large as to allow plating solution to circulate freely into them. The method comprises immersing an article having a porous metal surface in an alkaline aqueous solution containing cations of the plating metal. No chemical reducing agent for the metal cations is required in the plating bath.