Robert A Meyen

US Patent:

6543347, Apr 8, 2003

Filed:

Jan 10, 2001

Appl. No.:

09/757515

Inventors:

Robert Albert Meyen - Salt Point NY
Keith C. ONeil - Hughsonville NY
Brenda Lee Peterson - Wappingers Falls NY
Thomas Ramundo - Albany NY
Kurt A. Smith - Poughkeepsie NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B05C 1706

US Classification:

101126, 101115

Abstract:

An apparatus for displacing an article including first and second pallets for holding and transporting an article between two process stations; an H-bar assembly for receiving the first and second pallets at one of the two process stations; wherein, in operation, a process is performed on the articles while the first and second pallets are received by the H-bar assembly, the pallets then being transported to the second process station where a second process is performed on the articles.

US Patent:

6595136, Jul 22, 2003

Filed:

Jan 10, 2001

Appl. No.:

09/757516

Inventors:

Robert Albert Meyen - Salt Point NY
Keith C. ONeil - Hughsonville NY
Brenda Lee Peterson - Wappingers Falls NY
Kurt A. Smith - Poughkeepsie NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B41F 134

US Classification:

101485, 101126, 101129

Abstract:

A method for displacing an article using first and second pallets for holding and transporting an article between two process stations and an H-bar assembly for receiving the first and second pallets, the method including the steps of: receiving the first and second pallets and articles thereon by the H-bar assembly at one of the two process stations; performing a first process on the articles while received by the H-bar assembly; moving the first and second pallets and articles thereon to a second process station; and performing a second process on the articles while at the second process station.

US Patent:

61427268, Nov 7, 2000

Filed:

Feb 16, 1999

Appl. No.:

9/250464

Inventors:

Robert Peter Westerfield - Montgomery NY
Thomas Gerard Jantz - Hopewell Junction NY
Robert Paul Kuder - Hopewell Junction NY
David Clyde Linnell - Poughkeepsie NY
Robert Albert Meyen - Salt Point NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B65G 6500
B23C 312

US Classification:

414808

Abstract:

An apparatus for loading, chamfering and unloading a ceramic or ceramic/polymer substrate for electronic components. An automatic part loader moves substrates in a row as a unit, using a frangible pin to push the parts. The part loader separates the first of the substrates from the rest, and a load pedestal pushes the first substrate up into a loading/unloading nest. The load pedestal is mounted on rods so that the substrate may move laterally to center itself in the nest. The nest then rotates to load the substrate onto a movable process pedestal. The chamfering apparatus includes a pair of spaced, rotatable cutting spindles for chamfering edges and corners on the substrate. The cutting spindles include: i) separate top and bottom edge cutters for simultaneously chamfering top and bottom of edges of a substrate secured on the carrier as the substrate passes between the spindles and ii) corner cutters for simultaneously chamfering corners of a substrate secured on the carrier as the substrate contacts the spindles. The pedestal rotates the substrate about an axis normal to the plane of the substrate and moves the substrate in a direction normal to the plane of the substrate to present unchamfered edges and corners to the cutting spindles. A disc brake on the process pedestal may be actuated to prevent rotation of the substrate during chamfering.

US Patent:

52945200, Mar 15, 1994

Filed:

Aug 25, 1992

Appl. No.:

7/934993

Inventors:

Thomas A. DeMercurio - Beacon NY
Richard J. Hetherington - Pine Plains NY
Robert A. Meyen - Salt Point NY
Scott A. Sands - Hopewell Junction NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G03C 500

US Classification:

430314

Abstract:

A process in the fabrication of wiring patterns on ceramic or polymeric substrates precisely controls the cross-sectional dimensions of the metallization that constitute the wiring patterns. A single etch process defines thin film conductors on a substrate without loss to the conductor cross-section and provides enhanced thin film design flexibility. The zero undercut etch process uses photoresists defining the metal patterns to completely protect the metal patterns during the subetch.

US Patent:

41608933, Jul 10, 1979

Filed:

Dec 29, 1977

Appl. No.:

5/865768

Inventors:

Robert H. Meyen - Salt Point NY
Karl J. Puttlitz - Wappingers Falls NY
Karl Schink - Wappingers Falls NY
Herbert Wenskus - Hopewell Junction NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B23K 100
B23K 104

US Classification:

219 85BA

Abstract:

An individual chip joining machine is designed primarily to bond a single chip to a multi-chip substrate. The machine includes an X-Y table for moving a substrate to locate a chip site beneath a probe. The probe serves to pick up a chip and either place it on the substrate or remove it therefrom and further serves to heat the chip to join it to the substrate by solder reflow or to melt the solder and allow the chip to be removed. The probe is mounted on a Z direction placement mechanism that also includes means to allow the probe to be backed off a fixed distance from a chip, once the chip has been placed on the substrate preparatory to joining thereto. A second heater heats the substrate to a bias temperature, this heating being controlled through use of a surrogate substrate having a thermocouple attached thereto.

US Patent:

59846089, Nov 16, 1999

Filed:

Nov 10, 1997

Appl. No.:

8/966622

Inventors:

Robert Peter Westerfield - Montgomery NY
Thomas Gerard Jantz - Hopewell Junction NY
Robert Paul Kuder - Hopewell Junction NY
David Clyde Linnell - Poughkeepsie NY
Robert Albert Meyen - Salt Point NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B23C 312

US Classification:

414403

Abstract:

An apparatus for loading, chamfering and unloading a ceramic or ceramic/polymer substrate for electronic components. An automatic part loader moves substrates in a row as a unit, using a frangible pin to push the parts. The part loader separates the first of the substrates from the rest, and a load pedestal pushes the first substrate up into a loading/unloading nest. The load pedestal is mounted on rods so that the substrate may move laterally to center itself in the nest. The nest then rotates to load the substrate onto a movable process pedestal. The chamfering apparatus includes a pair of spaced, rotatable cutting spindles for chamfering edges and corners on the substrate. The cutting spindles include: i) separate top and bottom edge cutters for simultaneously chamfering top and bottom of edges of a substrate secured on the carrier as the substrate passes between the spindles and ii) corner cutters for simultaneously chamfering corners of a substrate secured on the carrier as the substrate contacts the spindles. The pedestal rotates the substrate about an axis normal to the plane of the substrate and moves the substrate in a direction normal to the plane of the substrate to present unchamfered edges and corners to the cutting spindles. A disc brake on the process pedestal may be actuated to prevent rotation of the substrate during chamfering.

US Patent:

57527970, May 19, 1998

Filed:

Apr 8, 1996

Appl. No.:

8/629300

Inventors:

Robert Peter Westerfield - Montgomery NY
Thomas Gerard Jantz - Hopewell Junction NY
Robert Paul Kuder - Hopewell Junction NY
David Clyde Linnell - Poughkeepsie NY
Robert Albert Meyen - Salt Point NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B23C 312

US Classification:

414403

Abstract:

An apparatus for loading, chamfering and unloading a ceramic or ceramic/polymer substrate for electronic components. An automatic part loader moves substrates in a row as a unit, using a frangible pin to push the parts. The part loader separates the first of the substrates from the rest, and a load pedestal pushes the first substrate up into a loading/unloading nest. The load pedestal is mounted on rods so that the substrate may move laterally to center itself in the nest. The nest then rotates to load the substrate onto a movable process pedestal. The chamfering apparatus includes a pair of spaced, rotatable cutting spindles for chamfering edges and corners on the substrate. The cutting spindles include: i) separate top and bottom edge cutters for simultaneously chamfering top and bottom of edges of a substrate secured on the carrier as the substrate passes between the spindles and ii) corner cutters for simultaneously chamfering corners of a substrate secured on the carrier as the substrate contacts the spindles. The pedestal rotates the substrate about an axis normal to the plane of the substrate and moves the substrate in a direction normal to the plane of the substrate to present unchamfered edges and corners to the cutting spindles. A disc brake on the process pedestal may be actuated to prevent rotation of the substrate during chamfering.