Abstract:
A method of bonding film-forming metals and their alloys has been developed. The method comprises applying a first coating of a metal, compound, or alloy of the platinum metal group to the film-forming metal. A second coating of copper is then applied to the first coating. A second metal, such as steel, can then be readily soldered to the copper coating to form a strong, durable bond. This bonding method can be used, for example, to solder a titanium screen or mesh to an electroconductive metal in the assembly of electrolytic cells for the production of chlorine or oxychlorine compounds.