Richard W Gerrie

US Patent:

50973908, Mar 17, 1992

Filed:

Jun 22, 1988

Appl. No.:

7/209826

Inventors:

Richard W. Gerrie - Bedford NH
Victor F. Dahlgren - Nashua NH

Assignee:

Interflex Corporation - Manchester NH

International Classification:

H05K 111

US Classification:

361412

Abstract:

Apparatus and method for protecting intermediate layers of a multi-layer printed circuit board from chemical or other damage from processing of a layer or layers to which previously fabricated layers of the printed circuit board are attached prior to such additional processing. A thin layer of protective material is selectively attached to intermediate or inner layers of a multi-layer printed circuit board after fabrication of such layers, when the outer or subsequent layers are attached. Inner or intermediate layer(s) of a multi-layer printed circuit board are fabricated. When outer layer(s) of the resulting printed circuit board are attached to the inner or intermediate layer(s), a layer of protective material such as a thin sheet of chemical-resistive plastic is disposed between the inner or intermediate layer(s) and the outer layer(s) and is selectively or completely attached or bonded thereto such as with a layer of acrylic adhesive.

US Patent:

52145719, May 25, 1993

Filed:

Oct 16, 1989

Appl. No.:

7/422829

Inventors:

Victor E. Dahlgren - Nashua NH
Richard W. Gerrie - Bedford NH

Assignee:

Miraco, Inc. - Nashua NH

International Classification:

H05K 111

US Classification:

361414

Abstract:

A multilayer printed circuit, including: first and second layers, each comprising dielectric material, at least one of these layers having an opening therethrough for which the other layer does not have a corresponding opening therethrough, at least one of the layers bearing a conductive path; there being disposed between and bonded to these layers a third layer comprising substantially chemically nonpermeable material to chemically isolate the conductive path against subsequent treatment of the printed circuit; all three layers having corresponding datums formed thereon located for relative mutual alignment of the corresponding features on the layers.

US Patent:

49618067, Oct 9, 1990

Filed:

Jun 22, 1988

Appl. No.:

7/209827

Inventors:

Richard W. Gerrie - Bedford NH
Victor F. Dahlgren - Nashua NH

Assignee:

Sanders Associates, Inc. - Nashua NH

International Classification:

B32B 3104

US Classification:

156252

Abstract:

Method for protecting intermediate layers of a multi-layer printed circuit board from chemical or other damage from processing of a layer or layers to which previously fabricated layers of the printed circuit board are attached prior to such additional processing. A thin layer of protective material is selectively attached to intermediate or inner layers of a multi-layer printed circuit board after fabrication of such layers, when the outer or subsequent layers are attached. Inner or intermediate layer(s) of a multi-layer printed circuit board are fabricated. When outer layer(s) of the resulting printed circuit board are attached to the inner or intermediate layer(s), a layer of protective material such as a thin sheet of chemical-resistive plastic is disposed between the inner or intermediate layer(s) and the outer layer(s) and is selectively or completely attached or bonded thereto such as with a layer of acrylic adhesive.