Randal Daniel King

US Patent:

6642346, Nov 4, 2003

Filed:

Jan 25, 2001

Appl. No.:

09/770073

Inventors:

Charles J. Brandenburg - Wilmington DE
Randal D. King - Kennett Square PA
Larry G. Oien - Lapeer MI
Peter W. Uhlianuk - Romeo MI

Assignee:

E. I. du Pont de Nemours and Company - Wilmington DE

International Classification:

C08G 7300

US Classification:

528310, 528354, 528318, 528323, 528359, 526266, 525410, 525411, 525413, 525415

Abstract:

This invention is directed to a coating composition used for original equipment manufacturing or refinishing uses in the automotive industry, which coating composition utilizes an acrylic polymer which contains substituted or unsubstituted exomethylene lactones or lactams as a comonomer.

US Patent:

6992141, Jan 31, 2006

Filed:

Jul 28, 2003

Appl. No.:

10/629002

Inventors:

Charles J. Brandenburg - Newark DE, US
David M. Dean - West Chester PA, US
George Henry Hofmann - Wilmington DE, US
Rutger D. Puts - Wilmington DE, US
Randal King - Midlothian VA, US
Edmund Arthur Flexman - Wilmington DE, US

Assignee:

E.I. du Pont de Nemours and Company - Wilmington DE

International Classification:

C08L 77/00
C08F 224/00

US Classification:

525181, 525185, 525206

Abstract:

Polymers containing α-methylenelact(ones)(ams) such as α-methylenebutyrolactones are useful in blends with other polymers. For examples such polymers which have reactive groups are toughened by mixing with a rubbery material which has complimentary reactive groups, or polymers containing repeat units derived from α-methylenelact(ones)(ams) are toughened by mixing with polymeric core-shell particles having an elastomeric core and a specified thermoplastic shell. The properties of thermoplastics are also improved by blending with α-methylenelact(ones)(ams) such as α-methylenebutyrolactones containing (co)polymers.

US Patent:

51960532, Mar 23, 1993

Filed:

Nov 27, 1991

Appl. No.:

7/799136

Inventors:

John R. Dodd - Wilmington DE
Anthony J. Arduengo - Wilmington DE
Randal D. King - Wilmington DE
Americus C. Vitale - West Chester PA

Assignee:

McGean-Rohco, Inc. - Cleveland OH

International Classification:

C23C 1831
B05D 512

US Classification:

106 122

Abstract:

An environmentally innocuous effective replacement for thiourea is disclosed for use as a complexing agent in displacement plating processes in which the plating solution is applied to the substrate surface to be plated by immersion or by spraying, cascading, pouring and the like. The replacement complexing agent is an imidazole-2-thione compound having the formula: ##STR1## wherein A and B are the same or different --R--Y groups, wherein R is linear, branched or cyclic alkenyl group containing 1 to 12 carbon atoms and Y is a hydrogen, halogen, cyano, vinyl, phenyl, or ether moiety. Of this class of compounds, 1-methyl-3-propyl-imidazole-2-thione is preferred for immersion tin plating. This class of complexing agents is particularly useful in spray displacement tin plating for the manufacture of printed circuit boards wherein free tin metal is added to the plating solution.

US Patent:

51748860, Dec 29, 1992

Filed:

Feb 22, 1991

Appl. No.:

7/659584

Inventors:

Randal D. King - Wilmington DE
Eda R. Montgomery - Wilmington DE

Assignee:

McGean-Rohco, Inc. - Cleveland OH

International Classification:

C25D 338

US Classification:

205125

Abstract:

Improved through-hole plating of printed circuit boards, wherein the ratio of the printed circuit board thickness to the diameter of at least one through hole is greater than 3 to 1, is achieved by a high-throw acid copper plating bath of this invention. The high-throw acid copper plating bath comprises an aqeuous solution of (A) copper sulfate, (B) sulfuric acid, (C) chloride ion, e. g. , hydrochloric acid, (D) a carrier, (E) a brightener, and (F) an alkali metal salt; wherein the plating bath has a pH of not greater than about 1, the concentration of the hydrochloric acid is from about 6. times. 10. sup. -4 to about 1. 8. times. 10. sup. -3 moles/liter, and the mole ratio of copper sulfate:sulfuric acid is not greater than about 1:25. Unlike previous high-throw acid copper plating baths, the bath of this invention contains an alkali metal salt. The use of the alkali metal salt makes it possible to maintain a lower acid concentration resulting in easier maintenance and more consistent plating.

US Patent:

51511703, Sep 29, 1992

Filed:

Dec 19, 1991

Appl. No.:

7/810190

Inventors:

Eda R. Montgomery - Wilmington DE
Randal D. King - Wilmington DE

Assignee:

McGean-Rohco, Inc. - Cleveland OH

International Classification:

C25D 338

US Classification:

205298

Abstract:

For acid copper plating baths containing a brightener used to produce smooth copper coatings of high brilliancy, it has been found that the "break-in" period normally needed after a brightener is added to the plating bath, has been virtually eliminated by use of the brightener of this invention. This brightener consists essentially of a peroxide oxidation product of a dialkylamino-thioxomethyl-thioalkanesulfonic acid wherein each alkyl and alkane group individually contains 1 to 6 carbon atoms and wherein the peroxide oxidation of the dialkylamino-thioxomethyl-thioalkane-sulfonic acid is carried out in an acid, aqueous medium having a pH of not more than about 1. In an added embodiment of this invention the acid copper plating bath also contains hydrolysis products of the peroxide oxidation product of a dialkylamino-thioxomethyl-thioalkanesulfonic acid.

US Patent:

52118312, May 18, 1993

Filed:

Nov 27, 1991

Appl. No.:

7/799134

Inventors:

Americus C. Vitale - West Chester PA
Carl W. Reinbold - Wilmington DE
Randal D. King - Wilmington DE
John R. Dodd - Wilmington DE

Assignee:

McGean-Rohco, Inc. - Cleveland OH

International Classification:

B05D 512
B05D 118

US Classification:

205 85

Abstract:

A stabilized spray displacement tin plating process of copper printed circuit innerlayers is disclosed for the manufacture of multilayer printed circuit boards. During prolonged use of spray tin plating, the plating solution becomes saturated with cupurous thiourea complex which precipitates interfering with spray nozzles and other mechanical components. The tin plating solution is stabilized by removing portions from the reservoir before saturation is reached, selectively precipitating the thiourea complex, and returning the remaining solution back to the reservoir. The precipitated cupurous thiourea complex is redissolved in acid and either disposed of by conventional waste treatment or the acid solution can be electrowinned to reclaim copper and oxidize thiourea to form a more acceptable acid solution for waste treatment. Preferably, the thiourea is isolated from the anode during electrowinning, so that the acid thiourea solution formed may be used to partially replenish the tin plating solution in the reservoir. By such periodic removal of the complex, the plating bath is stabilized and its useful life is extended dramatically.

US Patent:

52177513, Jun 8, 1993

Filed:

Nov 27, 1991

Appl. No.:

7/799135

Inventors:

Randal D. King - Wilmington DE
Americus C. Vitale - West Chester PA

Assignee:

McGean-Rohco, Inc. - Cleveland OH

International Classification:

C23C 2600

US Classification:

427 98

Abstract:

An efficient spray displacement tin plating process of copper printed circuit innerlayers is disclosed for the manufacture of multilayer printed circuit boards. The displacement tin plating solution is stabilized and replenished by incorporating free tin metal in the plating solution reservoir. Unwanted tin(IV) ions which are produced by aerial oxidation during the spray process, are reacted with tin metal in the reservoir to produce sufficient tin(II) ions to compensate for losses due to plating, oxidation and the like. Not only is the plating bath stabilized, but its useful life is extended dramatically.

US Patent:

62324748, May 15, 2001

Filed:

Mar 27, 2000

Appl. No.:

9/536350

Inventors:

Charles Brandenburg - Wilmington DE
Randal King - Kennett Square PA
Leo E. Manzer - Wilmington DE

Assignee:

E. I. du Pont de Nemours and Company - Wilmington DE

International Classification:

C07D30702
C07D31300

US Classification:

549295

Abstract:

This invention pertains to a process for making. alpha. -methylenelactones and. alpha. -substituted hydrocarbylidene lactones. The present invention obtains high yields of. alpha. -methylene-. gamma. -butyrolactone by heating. gamma. -butyrolactone and formaldehyde in the presence of a base.