Ramesh Chander Varma

US Patent:

6481903, Nov 19, 2002

Filed:

Aug 7, 1998

Appl. No.:

09/131381

Inventors:

Ramesh Varma - Berkeley Heights NJ
Richard S. Riggs - Somerville NJ

Assignee:

TyCom (U.S.) Inc. - Morristown NJ

International Classification:

G02B 6255

US Classification:

385 99, 385 95, 385 97, 385 98

Abstract:

An optical fiber splice protector protects a splice between a first optical fiber and a second optical fiber. The first optical fiber includes a first fiber coating and the second optical fiber includes a second fiber coating where the second fiber coating has a larger diameter than the first fiber coating. The splice protector includes a sleeve that is applied around the first fiber coating. The sleeve has a similar diameter to the diameter of the second fiber coating. A splint is applied around the splice of the first optical fiber and the second optical fiber and extends from the sleeve to the second fiber coating. Additionally, a method for applying a fiber optic splice protector is provided. The method includes the steps of positioning the splint around the splice, proof testing the splice, and heat curing the splint around the splice after proof testing of the splice.

US Patent:

62695150, Aug 7, 2001

Filed:

Mar 26, 1999

Appl. No.:

9/276797

Inventors:

Ramesh Varma - Berkeley Heights NJ

Assignee:

TyCom (US) Inc. - Morristown NJ

International Classification:

A46B 300
A46B 1500

US Classification:

15160

Abstract:

An apparatus and method for cleaning electrodes of an optical fiber splicing apparatus is disclosed. In one embodiment of the present invention, the cleaning apparatus includes a plurality of tungsten wires and a support member. The plurality of tungsten wires are coupled to the support member at a first end of the support member. The cleaning apparatus may also include a cover that is slidably disposed on the support member. The cover is slidable between a first position where the cover is disposed away from the plurality of tungsten wires and a second position where the plurality of tungsten wires are received within the cover.

US Patent:

55598170, Sep 24, 1996

Filed:

Nov 23, 1994

Appl. No.:

8/344448

Inventors:

Gustav E. Derkits - New Providence NJ
Jose A. Lourenco - Union NJ
Ramesh R. Varma - Berkeley Heights NJ

Assignee:

Lucent Technologies Inc. - Murray Hill NJ

International Classification:

H01S 319
H01L 2348

US Classification:

372 36

Abstract:

A compliant layer metallization for relieving thermal and mechanical stress developed between a semiconductor and a semiconductor submount. The compliant layer metallization includes a compliant layer, a wetting layer and a barrier layer. The compliant layer provides thermal and mechanical stress relief. The wetting layer ensures adequate wetting during soldering. The barrier layer prevents diffusion of bonding material into the compliant layer and/or into the semiconductor during solder-bonding. The compliant layer metallization design promotes ease of manufacturing.

US Patent:

62897241, Sep 18, 2001

Filed:

Aug 5, 1999

Appl. No.:

9/368428

Inventors:

Ramesh Varma - Berkeley Heights NJ
J. Bradley Hunter - Basking Ridge NJ
Marty Alexander - Summit NJ

Assignee:

TyCom (US) Inc. - Morristown NJ

International Classification:

G01M 702

US Classification:

73 52

Abstract:

A method and apparatus for examining internal components of a sealed container is disclosed. In one embodiment, the method includes the steps of attaching an acoustic sensor to an outer surface of the sealed container and moving the sealed container about at least one axis of the sealed container. An audio signal is received from the acoustic sensor, where the audio signal is generated by a component within the sealed container that is put into motion as a result of the step of moving the sealed container about the at least one axis. The audio signal is analyzed to determine the frequency of the signal. In an embodiment for an apparatus of the present invention, an acoustic sensor is attached to the sealed container. An amplifier is coupled to the acoustic sensor and receives an audio signal from the acoustic sensor. The audio signal is generated by a component within the sealed container that is put into motion as a result of movement of the sealed container.