A terminal element for fiber optic communication has an elongated body defining a body axis and having a first end from which an optical fiber extends along the body axis. The body has a second end with an angled surface offset at an angle from the body axis. The fiber extends partly through the length of the body, and terminates at a fiber end surface. The second portion has an optical entry surface registered with the fiber end surface such that light emitted from the fiber end surface enters the optical entry surface. At least one of the fiber end surface, angled surface and optical entry surface has a figured optical form with a non-planar shape.
Stacks Of Optical Structures And Methods And Apparatus For Making Same
Seong Suh - Florham Park NJ, US Francis Mess - Ellicott City MD, US Ralph Ebbutt - Baltimore MD, US Roy Meade - Odenton MD, US Peter Myers - Nottingham MD, US
International Classification:
G02B005/30 G02B027/28
US Classification:
359/494000, 359/500000
Abstract:
Stacked optical structures and methods and apparatus for making them are provided. The stack has a uniform gap between adjacent structures in which (1) a mixture of adhesive and mechanical spacers and (2) an optical filler, or adhesive, is placed. Each stacked optical structure includes at least two optical substructures, each of which has a mating surface. The thickness of the gap is equal to the maximum diameter of the mechanical spacers. The mixture is distributed in the gap away from an optical axis and the optical filler is distributed in the gap such that the optical axis passes through it.
A terminal element for fiber optic communication has an elongated body defining a body axis and having a first end from which an optical fiber extends along the body axis. The body has a second end with an angled surface offset at an angle from the body axis. The fiber extends through the length of the body, and terminates at a fiber end surface flush with the angled surface. A lens element is positioned adjacent to the angled surface. The fiber may be hermetically sealed to the body at a position away from first end, and may be sealed with a flexible material at the first end.
Cooling Facility And Method For Integrated Circuit
An integrated circuit chip has a first part with active circuitry, and a second part with a major surface defining a chamber. The first part covers the second, to enclose the chamber. Inlet and outlet openings are provided in the edge or face of the chip, so that a cooling facility may be connected to each end to transmit coolant through the passage. The chamber may be a serpentine conduit that occupies a plane parallel to the plane of the chip surface or a generally open space enclosed at the periphery, and having spaced apart support elements. The buried passage may be formed by a conventional surface etching process.
Facility And Method For High-Performance Circuit Board Connection
A circuit assembly has two circuit boards parallel to each other and having major faces facing each other. Each major face has a signal contact connected to a signal trace. At least one of the major faces has a ground contact surrounding the signal contact. The signal and ground contacts are connected by way of a column element defining an axis perpendicular to the board faces. The column element has an inner conductor electrically connecting the signal contact, and a shield electrically isolated from and surrounding the inner conductor. A number of the column elements, as well as solder elements, may be supported by a carrier, which is placed between the boards for an electrical connection process, and which then may be dissolved.
Sr. Product Development Manager at Lattice Semiconductor
Location:
Portland, Oregon Area
Industry:
Design
Work:
Lattice Semiconductor - Hillsboro, OR since Nov 2011
Sr. Product Development Manager
Tektronix Component Solutions - Beaverton, OR Jan 2009 - Nov 2011
Manager & Principal Engineer
Education:
Babson College - Franklin W. Olin Graduate School of Business
MBA, Entrepreneurship & Business Strategy
Georgia Institute of Technology - Woodruff School of Engineering
MS and BS, Engineering
Skills:
Strategic Planning Product Development Business Development Program Management Management Engineering Semiconductors Manufacturing Product Management
Awards:
MBA: Summa Cum Laude Beta Gamma Sigma Honor Society
Intel Corporation
Business Planner and Strategist
Lattice Semiconductor Nov 2011 - May 2015
Senior Manager - Product Development
Tektronix Component Solutions 2008 - 2011
Manager - Applications Engineering
Tektronix Component Solutions 2002 - 2008
Senior Engineer - Product Development
Education:
Georgia Institute of Technology
Masters, Engineering
Georgia Institute of Technology
Bachelors, Engineering
Babson College
Master of Business Administration, Masters, Business, Global Studies
Skills:
Leadership Management Product Development Product Management Product Design Sales Process Optoelectronics Electronic Interconnect Technical Product Sales Applications Engineering Technical Marketing Program Management People Development Mergers and Acquisitions Strategic Planning Business Alliances Market Research Supplier Management Technology Roadmapping Capabilities Development Financial Analysis Risk Management Kaizen Leadership Manufacturing
Interests:
Disaster and Humanitarian Relief Economic Empowerment
Ralph Ebbutt 1990 graduate of Barrington High School in Barrington, RI is on Classmates.com. See pictures, plan your class reunion and get caught up with Ralph and other high ...