Rajkumar E Ramamurthi

US Patent:

20100009517, Jan 14, 2010

Filed:

Jul 8, 2009

Appl. No.:

12/499556

Inventors:

Terence Quintin Collier - Rowlett TX, US
Charles A. Lhota - San Antonio TX, US
David Barry Rennie - Bethlehem PA, US
Rajkumar Ramamurthi - Cave Creek AZ, US
Madhukar Bhaskara Rao - Fogelsville PA, US
Dnyanesh Chandrakant Tamboli - Breinigsville PA, US

Assignee:

AIR PRODUCTS AND CHEMICALS, INC. - Allentown PA

International Classification:

H01L 21/304
C09K 13/00

US Classification:

438460, 252 791, 257E21238

Abstract:

Adherence of contaminant residues or particles is suppressed, corrosion of exposed surfaces is substantially reduced or eliminated during the process of dicing a wafer by sawing. A fluoride-free aqueous composition comprising a dicarboxylic acid and/or salt thereof; a hydroxycarboxylic acid and/or salt thereof or amine group containing acid, a surfactant and deionized water is employed.

US Patent:

20120009762, Jan 12, 2012

Filed:

Jun 28, 2011

Appl. No.:

13/171252

Inventors:

Dnyanesh Chandrakant Tamboli - Breinigsville PA, US
Rajkumar Ramamurthi - Cave Creek AZ, US
David Barry Rennie - Bethlehem PA, US
Madhukar Bhaskara Rao - Fogelsville PA, US
Gautam Banerjee - Latham NY, US
Gene Everad Parris - Coopersburg PA, US

Assignee:

AIR PRODUCTS AND CHEMICALS, INC. - Allentown PA

International Classification:

H01L 21/78
C23F 11/14
C23F 11/167
C23F 11/12

US Classification:

438460, 252396, 252392, 25238931, 25238923, 25238922, 25238932, 257E21599

Abstract:

A solution for semiconductor wafer dicing is disclosed. The solution suppresses the adherence of contamination residues or particles, and reduces or eliminates the corrosion of the exposed metallization areas, during the process of dicing a wafer by sawing. The solution comprises at least one organic acid and/or salt thereof; at least a surfactant and/or at least a base; and deionized water, the composition has a pH is equal or greater than 4. The solution can further comprise, a chelating agent, a defoaming agent, or a dispersing agent.

US Patent:

20140170835, Jun 19, 2014

Filed:

Mar 3, 2014

Appl. No.:

14/195285

Inventors:

Dnyanesh Chandrakant Tamboli - Breinigsville PA, US
Rajkumar Ramamurthi - Cave Creek AZ, US
David Barry Rennie - Bethlehem PA, US
Madhukar Bhaskara Rao - Fogelsville PA, US
Gautam Banerjee - Latham NY, US
Gene Everad Parris - Coopersburg PA, US

Assignee:

AIR PRODUCTS AND CHEMICALS, INC. - Allentown PA

International Classification:

C11D 3/20
H01L 21/67
H01L 21/78

US Classification:

438460, 15634511

Abstract:

A solution for semiconductor wafer dicing is disclosed. The solution suppresses the adherence of contamination residues or particles, and reduces or eliminates the corrosion of the exposed metallization areas, during the process of dicing a wafer by sawing. The solution comprises at least one organic acid and/or salt thereof; at least a surfactant and/or at least a base; and deionized water, the composition has a pH is equal or greater than 4. The solution can further comprise, a chelating agent, a defoaming agent, or a dispersing agent.