A polishing pad for use in chemical mechanical polishing of substrates that being made of fibrous matrix such as cellulose with a binder consisting of thermoset resin material, such as phenolic resin. The polishing surface is ground to form asperities. The polishing pad provides a porous structure by which polishing slurry and polishing debris during chemical mechanical polishing of substrates are stored for subsequent rinsing away, and for enhanced flow-distribution of the polishing slurry. Also disclosed is a method of making the polishing pad.
Polishing Pad For Use In Chemical/Mechanical Planarization Of Semiconductor Wafers Having A Transparent Window For End-Point Determination And Method Of Making
Angela Petroski - Crawfordsville IN, US Richard D. Copper - Sullivan IN, US Paul Fathauer - Sullivan IN, US David Perry - Crawfordsville IN, US
Assignee:
Raytech Innovative Solutions, Inc. - Sullivan IN
International Classification:
B24B001/00
US Classification:
451 6, 451 37, 451 56, 451 58, 451526, 51298
Abstract:
A porous polishing pad for use chemical/mechanical planarization of semiconductor wafers is provided with a transparent section formed in a section of the porous polishing pad by direct injection of a polymeric material into a modified portion of the pad. The modified section may be either a low density area, or may be created by removing a complete vertical section of the pad. The injected polymer forms an integral window with the pad by flowing into the matrix of the pad at the pad/window interface. No additional reinforcement is required to hold the window in place; however, adhesive and/or another impervious layer may be attached behind the window for additional support. In an alternative embodiment, a separate and distinct window-plug is inserted into a cutout section of the pad, and bonded to the pad by one or more binding film layers on the back, non-working surface of the pad.
Retaining Ring With Wear Pad For Use In Chemical Mechanical Planarization
Richard D. Cooper - Sullivan IN, US Paul Fathauer - Sullivan IN, US David Perry - Crawfordsville IN, US James P. Macey - Crawfordsville IN, US
Assignee:
Raytech Innovative Solutions, Inc. - Sullivan IN
International Classification:
B24B005/00
US Classification:
451397, 451287, 451398
Abstract:
A novel retaining ring having a wear pad of such construction, design and material such that it provides improved resistance to wear and/or degradation as compared to currently available products for use in the chemical mechanical planarization (CMP) of semiconductor wafers and similar materials. The retaining ring with wear pad of the invention is able to withstand increased operating temperatures and pressures at the polishing surface of the wafer with less wear than would normally be encountered with currently used materials and designs. The ability to operate at increased temperature and pressure can accelerate the rate of removal of material from a semiconductor wafer in some processes. The flexibility of a manufacturer to use an expanded range of temperature and pressure in CMP processes, combined with a significant reduction in the cost of consumables, provides a significant advantage in the final cost of ownership in the production of multilayer, integrated circuit devices and other products where CMP is utilized in manufacture. Moreover, the retaining with wear pad of the present invention may also retrofitted to previously used and worn retaining rings of the prior-art design, thus salvaging the major structural component of the CMP processing apparatus, thereby reducing costs.
Polishing Pad For Use In Chemical/Mechanical Planarization Of Semiconductor Wafers Having A Transparent Window For End-Point Determination And Method Of Making
Angela Petroski - Crawfordsville IN, US Richard D. Copper - Sullivan IN, US Paul Fathauer - Sullivan IN, US David Perry - Crawfordsville IN, US
Assignee:
Raytech Innovative Solutions LLC - Crawfordsville IN
International Classification:
B24B001/00
US Classification:
451 6, 451 37, 451 56, 451 58, 451526, 51298
Abstract:
A porous polishing pad for use chemical/mechanical planarization of semiconductor wafers is provided with a transparent section formed in a section of the porous polishing pad by direct injection of a polymeric material into a modified portion of the pad. The modified section may be either a low density area, or may be created by removing a complete vertical section of the pad. The injected polymer forms an integral window with the pad by flowing into the matrix of the pad at the pad/window interface. No additional reinforcement is required to hold the window in place; however, adhesive and/or another impervious layer may be attached behind the window for additional support. In an alternative embodiment, a separate and distinct window-plug is inserted into a cutout section of the pad, and bonded to the pad by one or more binding film layers on the back, non-working surface of the pad.
Method For Securing A Polishing Pad To A Platen For Use In Chemical-Mechanical Polishing Of Wafers
Angela Petroski - Crawfordsville IN, US Richard D. Cooper - Williston Pk NY, US Paul Fathauer - Sullivan IN, US David Perry - Crawfordsville IN, US James Macey - Crawfordsville IN, US
Assignee:
Raytech Innovative Solutions, LLC - Sullivan IN
International Classification:
B24D017/00
US Classification:
451 56, 451285, 451490
Abstract:
The present invention is related to a method for securing a polishing pad to the platen for use in chemical-mechanical polishing. Specifically, a polishing pad is attached to a platen using a reclosable, hook-and-pile fastener, whereby the platen-attachment fastener may be reused. Separate embodiments are disclosed for attaching porous and nonporous polishing pads.
Retaining Ring With Wear Pad For Use In Chemical Mechanical Planarization
Richard D. Cooper - Sullivan IN, US Paul Fathauer - Sullivan IN, US David Perry - Crawfordsville IN, US James P. Macey - Crawfordsville IN, US
Assignee:
Raytech Innovative Solutions,LLC - Sullivan IN
International Classification:
B24B005/00
US Classification:
451397, 451287, 451398
Abstract:
A novel retaining ring having a wear pad of such construction, design and material such that it provides improved resistance to wear and/or degradation as compared to currently available products for use in the chemical mechanical planarization (CMP) of semiconductor wafers and similar materials. The retaining ring with wear pad of the invention is able to withstand increased operating temperatures and pressures at the polishing surface of the wafer with less wear than would normally be encountered with currently used materials and designs. The ability to operate at increased temperature and pressure can accelerate the rate of removal of material from a semiconductor wafer in some processes. The flexibility of a manufacturer to use an expanded range of temperature and pressure in CMP processes, combined with a significant reduction in the cost of consumables, provides a significant advantage in the final cost of ownership in the production of multilayer, integrated circuit devices and other products where CMP is utilized in manufacture. Moreover, the retaining with wear pad of the present invention may also retrofitted to previously used and worn retaining rings of the prior-art design, thus salvaging the major structural component of the CMP processing apparatus, thereby reducing costs.
Gradient Polishing Pad Made From Paper-Making Fibers For Use In Chemical/Mechanical Planarization Of Wafers
Angela Petroski - Crawfordsville IN, US Richard D. Cooper - Sullivan IN, US Paul Fathauer - Sullivan IN, US David Perry - Crawfordsville IN, US
Assignee:
Raytech Innovative Solutions, LLC - Sullivan IN
International Classification:
B24B 1/00
US Classification:
451526, 451527, 451 56, 451 41, 51298, 51295
Abstract:
A composite polishing pad for use in chemical-mechanical planarization (CMP) processes, which polishing pad of the invention is made of a paper-making-process produced fibrous-matrix of paper-making fibers bound with resin material, and consists of a top section with one or more lower sections, where each layer has unique material properties. Polishing performance can be substantially improved by modifying the individual characteristics of each layer. Typically, the top layer or working surface will be of a higher modulus material than the lower layers. Therefore, the sub-layers may consist of lower density regions or a modified surface structure, such as grooving, to effectively modify the bulk modulus.
Polishing Pad For Use In Chemical-Mechanical Planarization Of Semiconductor Wafers And Method Of Making Same
Angela Petroski - Crawfordsville IN, US Richard D. Cooper - Sullivan IN, US Paul Fathauer - Sullivan IN, US Marc Andrew Yesnik - Crawfordsville IN, US
Assignee:
Raytech Innovation Solutions, LLC - Sullivan IN
International Classification:
B24D 11/00
US Classification:
451532, 451527
Abstract:
A polishing pad for use in chemical mechanical polishing of substrates that being made of a porous structure comprising a matrix consisting of fibers, such as cotton linter cellulose bound with a thermoset resin, such as phenolic resin. The polishing pad surface has voids in which polishing slurry flows during chemical mechanical polishing of substrates, and in which debris formed during the chemical-mechanical polishing of substrates is temporarily stored for subsequent rinsing away. The polishing surface of the pad is ground to form asperities that aid in slurry transport and polishing, as well as opening the porous structure of the pad. The porous pad contains nanometer-sized filler-particles that reinforce the structure, imparting an increased resistance to wear as compared to prior-art pads. Also disclosed is a method of making the polishing pad.
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