Nicholas M Kopec

US Patent:

20130213169, Aug 22, 2013

Filed:

Feb 1, 2013

Appl. No.:

13/757489

Inventors:

Mark K. Tan - San Jose CA, US
Nicholas M. Kopec - Sunnyvale CA, US
Richard M. Blank - San Jose CA, US

International Classification:

F16F 7/10
B25J 15/00
B25J 18/00

US Classification:

7449001, 188378, 294213

Abstract:

A calibrated mass damper for use with end effectors for semiconductor wafer handling robots is described. The calibrated mass damper reduces vibrational response in an end effector carrying a semiconductor wafer without requiring modification of the end effector structure.

US Patent:

20200373190, Nov 26, 2020

Filed:

May 20, 2019

Appl. No.:

16/417348

Inventors:

- Santa Clara CA, US
Nicholas Michael Kopec - Santa Clara CA, US
Leon Volfovski - Mountain View CA, US
Douglas R. McAllister - San Ramon CA, US
Andreas Schmid - Meyriez, CH
Jeffrey Hudgens - San Francisco CA, US
Yogananda Sarode Vishwanath - Bangalore, IN
Steven Babayan - Los Altos CA, US

International Classification:

H01L 21/687
H01L 21/673
H01L 21/68
H01L 21/677

Abstract:

A process kit enclosure system includes surfaces to enclose an interior volume, a first support structure including first fins, a second support structure including second fins, and a front interface to interface the process kit enclosure system with a load port of a wafer processing system. The first and second fins are sized and spaced to hold process kit ring carriers and process kit rings in the interior volume. Each of the process kit rings is secured to one of the process kit ring carriers. The process kit enclosure system enables first automated transfer of a first process kit ring carrier securing a first process kit ring from the process kit enclosure system into the wafer processing system and second automated transfer of a second process kit ring carrier securing a second process kit ring from the wafer processing system into the process kit enclosure system.

US Patent:

20200373194, Nov 26, 2020

Filed:

May 20, 2019

Appl. No.:

16/417369

Inventors:

- Santa Clara CA, US
Andreas Schmid - Meyriez, CH
Denis Martin Koosau - Pleasanton CA, US
Nicholas Michael Kopec - Santa Clara CA, US
Steven Babayan - Los Altos CA, US
Douglas R. McAllister - San Ramon CA, US
Helder Lee - San Jose CA, US
Jeffrey Hudgens - San Francisco CA, US
Damon K. Cox - Jarrell TX, US

International Classification:

H01L 21/687
H01L 21/683
H01L 21/68

Abstract:

A process kit ring adaptor includes a rigid carrier. The rigid carrier includes an upper surface and a lower surface. The upper surface includes a first distal portion and a second distal portion to support a process kit ring. The lower surface includes a first region to interface with an end effector configured to support wafers and a solid planar central region to interface with a vacuum chuck.