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Nathan P Lower

age ~42

from North Liberty, IA

Also known as:
  • Nathan Lower
  • Nathan Paul Lower
  • Nate Lower
  • James Lower
1415 Doe Run Dr, North Liberty, IA 52317319-626-4997

Nathan Lower Phones & Addresses

  • 1415 Doe Run Dr, North Liberty, IA 52317 • 319-626-4997
  • 1320 Logan Ct, North Liberty, IA 52317 • 319-626-4997
  • 503 Canterbury Ct, Rolla, MO 65401 • 573-364-7061
  • 2844 P Ave, Parnell, IA 52325 • 319-668-2548
  • 2882 Coral St, Coralville, IA 52241 • 319-545-5692
  • Cedar Rapids, IA

Us Patents

  • Reconfigurable Radio Frequency (Rf) Surface With Optical Bias For Rf Antenna And Rf Circuit Applications

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  • US Patent:
    7965249, Jun 21, 2011
  • Filed:
    Apr 25, 2008
  • Appl. No.:
    12/150139
  • Inventors:
    Jeremiah D. Wolf - Cedar Rapids IA,
    Nathan P. Lower - North Liberty IA,
    Lee M. Paulsen - Cedar Rapids IA,
    Jonathan P. Doane - Cedar Rapids IA,
    James B. West - Cedar Rapids IA,
  • Assignee:
    Rockwell Collins, Inc. - Cedar Rapids IA
  • International Classification:
    H01Q 9/00
  • US Classification:
    343745, 343700 MS, 343749, 343755, 343778
  • Abstract:
    The present invention is a Radio Frequency (RF) apparatus. The RF apparatus may include a layer of photoconductive material. The RF apparatus may further include a plurality of conductive patches which are disposed within the layer of photoconductive material. The RF apparatus may further include a generating layer. The generating layer may be operatively coupled to the layer of photoconductive material and may be configured for generating light. The generating layer may further be configured for providing the generated light to the layer of photoconductive material. The generated light may be configurable for being provided at a selectable intensity and in a selectable pattern for causing the layer of photoconductive material to be a dynamically controllable optical switch. The dynamically controllable optical switch may be configured for providing a connection between conductive patches included in the plurality of conductive patches.
  • Plasma Klystron Switch

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  • US Patent:
    8575844, Nov 5, 2013
  • Filed:
    Aug 18, 2011
  • Appl. No.:
    13/212825
  • Inventors:
    Don L. Landt - Palo IA,
    Nathan P. Lower - North Liberty IA,
    Roger A. Dana - Marion IA,
    Mark M. Mulbrook - Marion IA,
  • Assignee:
    Rockwell Collins, Inc. - Cedar Rapids IA
  • International Classification:
    H01J 7/24
    H05B 31/26
    H01J 1/62
    H01J 63/04
    H01J 17/49
  • US Classification:
    31511121, 313484, 313586
  • Abstract:
    The plasma klystron switching device of the present invention may include a low-dielectric substrate, a plasma cavity internally pressurized by an inert gas, a circuit assembly formed on the first surface of the low-dielectric substrate and enclosed by the plasma cavity, wherein the circuit assembly includes a first electrode and a second electrode configured to form a switching gap, wherein the switching gap is configured to act as a high conductance plasma generation zone during an ON state of the plasma klystron switching device and a low conductance zone during an OFF state of the plasma klystron switching device, an evacuated klystron resonance generator, wherein the klystron resonance generator includes a klystron resonance cavity, wherein the klystron resonance generator includes a coupling aperture configured to RF couple the klystron resonance cavity and the plasma cavity, and a field emitter array configured to energize the klystron resonance generator.
  • Integrated Circuit Tampering Protection And Reverse Engineering Prevention Coatings And Methods

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  • US Patent:
    2012008, Apr 12, 2012
  • Filed:
    Dec 16, 2011
  • Appl. No.:
    13/329068
  • Inventors:
    Nathan P. Lower - North Liberty IA,
    Alan P. Boone - Swisher IA,
    Ross K. Wilcoxon - Cedar Rapids IA,
  • International Classification:
    H01L 21/56
  • US Classification:
    438127, 257E21502
  • Abstract:
    A method of protecting an electronics package is discussed along with devices formed by the method. The method involves providing at least one electronic component that requires protecting from tampering and/or reverse engineering. Further, the method includes mixing into a liquid glass material at least one of high durability micro-particles or high-durability nano-particles, to form a coating material. Further still, the method includes depositing the coating material onto the electronic component and curing the coating material deposited.
  • Flexible Flow Channel For A Modular Liquid-Cooled Thermal Spreader

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  • US Patent:
    2010006, Mar 18, 2010
  • Filed:
    Sep 12, 2008
  • Appl. No.:
    12/283502
  • Inventors:
    Ross K. Wilcoxon - Cedar Rapids IA,
    David W. Dlouhy - Cedar Rapids IA,
    Nathan P. Lower - North Liberty IA,
    James R. Wooldridge - Cedar Rapids IA,
  • International Classification:
    F25B 21/02
    F28D 15/00
  • US Classification:
    62 32, 16510433
  • Abstract:
    The present invention is a flexible liquid cooling loop for providing a thermal path between a heat source and a heat sink. The cooling loop includes a plurality of mechanically rigid tubing sections configured for being in thermal contact with the heat source and the heat sink. The cooling loop further includes a plurality of mechanically flexible tubing sections configured for connecting the mechanically rigid sections to form the loop. The loop is configured for containing a liquid. The liquid is configured for being circulated within the loop for promoting transfer of thermal energy from the heat source to the heat sink via the loop.
  • Fabrication Process For A Flexible, Thin Thermal Spreader

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  • US Patent:
    8205337, Jun 26, 2012
  • Filed:
    Sep 12, 2008
  • Appl. No.:
    12/283563
  • Inventors:
    Nathan P. Lower - North Liberty IA,
    Ross K. Wilcoxon - Cedar Rapids IA,
    James R. Wooldridge - Cedar Rapids IA,
    David W. Dlouhy - Cedar Rapids IA,
  • Assignee:
    Rockwell Collins, Inc. - Cedar Rapids IA
  • International Classification:
    H05K 7/20
  • US Classification:
    29890039, 2989004, 29890041, 165 804, 16510418, 16510419
  • Abstract:
    The present invention is a method for fabricating a thermal spreader. The method may include laminating a plurality of layer portions together to fabricate a mechanically flexible substrate. The method may further include providing an internal channel within the mechanically flexible substrate, the internal channel configured for containing an electrically-conductive liquid, the internal channel being further configured to allow for closed-loop flow of the electrically-conductive liquid within the internal channel. The method may further include integrating a pump with the mechanically flexible substrate. The method may further include fabricating a plurality of rigid metal inserts. The method may further include forming a plurality of extension portions on a surface of each rigid metal insert included in the plurality of rigid metal inserts. The method may further include connecting the plurality of rigid metal inserts to the mechanically flexible substrate.
  • Adhesive Applications Using Alkali Silicate Glass For Electronics

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  • US Patent:
    8637980, Jan 28, 2014
  • Filed:
    Dec 18, 2007
  • Appl. No.:
    11/959225
  • Inventors:
    Nathan P. Lower - North Liberty IA,
    Alan P. Boone - Swisher IA,
    Ross K. Wilcoxon - Cedar Rapids IA,
  • Assignee:
    Rockwell Collins, Inc. - Cedar Rapids IA
  • International Classification:
    H01L 23/34
  • US Classification:
    257713, 257678, 257701, 257794, 257E23009, 257E23116
  • Abstract:
    An assembly includes an integrated circuit die coupled to another component of the assembly with an alkali silicate glass material. The alkali silicate material may include particles for modifying the thermal, mechanical, and/or electrical characteristics of the material.
  • Alkali Silicate Glass Based Coating And Method For Applying

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  • US Patent:
    8617913, Dec 31, 2013
  • Filed:
    Sep 29, 2008
  • Appl. No.:
    12/240775
  • Inventors:
    Nathan P. Lower - North Liberty IA,
    Alan P. Boone - Swisher IA,
    Ross K. Wilcoxon - Cedar Rapids IA,
    David D. Hillman - Cedar Rapids IA,
  • Assignee:
    Rockwell Collins, Inc. - Cedar Rapids IA
  • International Classification:
    H01L 21/00
  • US Classification:
    438 57, 438 72, 438127
  • Abstract:
    A coating for reducing interaction between a surface and the environment around the surface includes an alkali silicate glass material configured to protect the surface from environmental corrosion due to water or moisture. The alkali silicate glass material is doped with a first element to affect various forms of radiation passing through the coating. The electromagnetic radiation is at least one of ultraviolet, x-ray, atomic (gamma, alpha, beta), and electromagnetic or radio wave radiation. The coating may also be used to protect a solar cell from the environment and UV rays while retransmitting received light as usable light for conversion into electrical energy. The coating may also be used to prevent whisker formation in metal finishes of tin, cadmium, zinc, etc.
  • Mechanically Compliant Thermal Spreader With An Embedded Cooling Loop For Containing And Circulating Electrically-Conductive Liquid

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  • US Patent:
    8616266, Dec 31, 2013
  • Filed:
    Sep 12, 2008
  • Appl. No.:
    12/283501
  • Inventors:
    Ross K. Wilcoxon - Cedar Rapids IA,
    Nathan P. Lower - North Liberty IA,
    James R. Wooldridge - Cedar Rapids IA,
    David W. Dlouhy - Cedar Rapids IA,
    Anthony J. Strzelczyk - Plymouth MI,
  • Assignee:
    Rockwell Collins, Inc. - Cedar Rapids IA
  • International Classification:
    H01L 23/473
  • US Classification:
    165 804, 1651341
  • Abstract:
    The present invention is a thermal spreader for providing a high effective thermal conductivity between a heat source and a heat sink. The thermal spreader may include a mechanically flexible substrate. The mechanically flexible substrate may be at least partially constructed of organic materials. The mechanically flexible substrate may form an internal channel which is configured for containing an electrically-conductive liquid. The thermal spreader may further include a pump. The pump may be configured for being connected to the substrate and for circulating the electrically-conductive liquid within the internal channel. The thermal spreader may further include one or more thermally-conductive, rigid metal inserts. Each insert may be configured for being in thermal contact with the electrically-conductive liquid and the substrate and for promoting heat transfer between the thermal spreader and the electrically-conductive liquid.

Resumes

Nathan Lower Photo 1

Principal Mechanical Engineer At Rockwell Collins

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Position:
Principal Mechanical Engineer at Rockwell Collins
Location:
Iowa City, Iowa Area
Industry:
Military
Work:
Rockwell Collins - Cedar Rapids, Iowa since May 2005
Principal Mechanical Engineer
Education:
University of Missouri-Rolla 2001 - 2004
Doctor of Philosophy (PhD), Ceramic Engineering
Coe College 1997 - 2001
BA, Math, Physics, Computer Science
Nathan Lower Photo 2

Nathan Lower

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Myspace

Nathan Lower Photo 3

Nathan Lower

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Locality:
circleville
Birthday:
1950
Nathan Lower Photo 4

Nathan Lower

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Birthday:
1945

Classmates

Nathan Lower Photo 5

Nathan Lower

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Schools:
Dauphin County Technical School Harrisburg PA 2002-2006
Community:
Tina Wilken, Charles Jordan, Lisa Myers
Nathan Lower Photo 6

Williamsburg Community Hi...

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Graduates:
Russell Overton (1969-1973),
Nathan Lower (1993-1997),
Cindy Sandberg (1975-1979),
Amanda Lower (1994-1998)

Facebook

Nathan Lower Photo 7

Nathan Lower

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Friends:
Andy Stoak, Doris Espenshade, Antoinette Jean Weber, Aly Peter, Devon Alleman

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