Nathan J Fo

US Patent:

20030085114, May 8, 2003

Filed:

Nov 3, 2001

Appl. No.:

10/006899

Inventors:

Paul Johnson - Santa Clara CA, US
Norman Pond - Santa Clara` CA, US
Robert Ruck - Santa Clara CA, US
Nathan Fo - Santa Clara CA, US

International Classification:

C23C014/32

US Classification:

204/192120, 204/298120, 204/298030, 204/192130, 204/298090, 428/544000, 204/192200

Abstract:

Sequential sputtered film deposition of distinct materials on a workpiece is obtained with discrete targets composed of such distinct materials disposed on separate area portions of a common cathode/heatsink. Sputtering without cross contamination of the deposited films is enabled during an interval of relative motionbetween the target and workpiece or in an indexed static relative disposition, wherein the workpiece projection is entirely proximate one such portion to deposit the respective layer.