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Natale F Tinnerino

age ~85

from Palm Desert, CA

Also known as:
  • Natale Francis Tinnerino
  • Natale Helga Tinnerino
  • Natale F Tinnernio
  • Nat Tinnerino
  • Natale O
  • Tinnerino Natale
Phone and address:
78276 Hollister Dr, Palm Desert, CA 92211
760-772-4343

Natale Tinnerino Phones & Addresses

  • 78276 Hollister Dr, Palm Desert, CA 92211 • 760-772-4343
  • Morgan Hill, CA
  • Doylestown, PA
  • Redding Ridge, CT
  • Flushing, NY
  • West Redding, CT
  • Trumbull, CT
  • Riverside, CA

Us Patents

  • Image Reconstruction Techniques For Charge Coupled Devices

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  • US Patent:
    20040012684, Jan 22, 2004
  • Filed:
    Jul 16, 2002
  • Appl. No.:
    10/198713
  • Inventors:
    Natale Tinnerino - Morgan Hill CA, US
  • Assignee:
    Fairchild Imaging - Milpitas CA
  • International Classification:
    H04N005/228
  • US Classification:
    348/208100
  • Abstract:
    Techniques are provided for producing video data using a sensor with charge coupled devices. Signals from the CCD pixels are alternately stored into one set of memory devices and read out of another set of memory devices. Once the signals from the pixels are read out of the memory devices, they are used to produce video frames. The orientation of each portion of the frames is independent of the direction the signals are read out of each of the charge coupled devices. The orientation of each portion of the frames is independent of the physical orientation of the CCDs in the x,-y plane. The pixel signals from the CCDs can be used to produce video data in near real-time. The image reconstruction techniques can be re-programmed to account for different CCD focal plan configurations and orientations.
  • Large Area Charge Coupled Device Camera

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  • US Patent:
    20040012688, Jan 22, 2004
  • Filed:
    Jul 16, 2002
  • Appl. No.:
    10/197967
  • Inventors:
    Natale Tinnerino - Morgan Hill CA, US
    David Wen - Los Altos CA, US
    Edward Guerrero - Union City CA, US
    Douglas Debs - Palo Alto CA, US
    Dan Laxson - San Jose CA, US
  • Assignee:
    Fairchild Imaging - Milpitas CA
  • International Classification:
    H04N005/335
  • US Classification:
    348/218100
  • Abstract:
    Large area cameras that sense light using charge coupled devices are provided. The large area cameras have a scintillator that senses short wavelength (e.g. x-rays) radiation and provides light at a longer wavelength. Optical fibers transmit the light to charge coupled devices arranged in an M×N array. Subsets of the image signals can be summed together to increase signal strength and frame rate. The image signals can be amplified and digitized to accomplish image reconstruction in near-real time for a plurality of CCDs. To accomplish image reconstruction in near-real time for a plurality of CCDs, the digitized signals for one image frame are stored in first memory circuits, while image signals from another frame are read out of second memory circuits. The image signal are written into and read out of the memory circuits in configurations that are independent of the orientation of the CCDs within the CCD array. The image reconstruction circuitry can simultaneously read and write signals into memory at different rates, typically reading faster than writing.
  • Charge Coupled Devices In Tiled Arrays

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  • US Patent:
    20040012689, Jan 22, 2004
  • Filed:
    Jul 16, 2002
  • Appl. No.:
    10/197968
  • Inventors:
    Natale Tinnerino - Morgan Hill CA, US
    Jose Camara - Saratoga CA, US
    Edward LeonGuerrero - Union City CA, US
    Harlan Lawler - Milpitas CA, US
  • Assignee:
    Fairchild Imaging - Milpitas CA
  • International Classification:
    H04N005/335
  • US Classification:
    348/218100
  • Abstract:
    Charge coupled devices (CCDs) can be placed next to each in a tiled array to reproduce a larger image. The seams between the CCDs in a tiled CCD array can be reduced by placing fiber optic arrays on top of each CCD in the CCD array. The fiber optic arrays have numerous optical fibers that are tilted with respect to the plane of the CCDs. The optical fibers can retrieve electromagnetic radiation falling in gaps between the tiled CCDs. The optical fiber arrays substantially reduce the seams that appear in the image. Electronic pixel binning configurations can be adjusted to accommodate the placement of the optical fibers. The fiber optic arrays can have beveled edges near the gaps between adjacent CCDs to image light in the gaps. Techniques for reducing the dead zone between CCDs in a tiled array and for forming fiber optic arrays on a common plane are also provided.
  • Misregistration/Distortion Correction Scheme

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  • US Patent:
    46689826, May 26, 1987
  • Filed:
    Jun 17, 1985
  • Appl. No.:
    6/745968
  • Inventors:
    Natale F. Tinnerino - Redding CT
  • Assignee:
    The Perkin-Elmer Corporation - Norwalk CT
  • International Classification:
    H04N 700
  • US Classification:
    358101
  • Abstract:
    A registration system for compensating for distortion of a test printed circuit board relative to a stored reference in a printed circuit board inspection system is disclosed. Fiducial marks on the corners of the test board are compared with fiducial marks on the corners of the stored reference to determine relative distortion of the test board with respect to the reference board. This information is utilized to load a memory so that exposure pulses of a scanning CCD camera occur at intervals which compensate for distortion of the test board in the scanning direction x. The fiducial comparison information is also used to generate a gate on the occurrence of each exposure pulse to compensate for distortion of the test board in the y-direction. The exposure pulses are further utilized to generate addresses to a buffer memory storing the reference board to cause patches representative of the reference board to be read out of memory in registration with patches representative of the counterpart surface location of the test board to permit accurate real time comparison of the test board to the stored reference board.
  • Coarse Flaw Detector For Printed Circuit Board Inspection

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  • US Patent:
    47077344, Nov 17, 1987
  • Filed:
    Jun 17, 1985
  • Appl. No.:
    6/745967
  • Inventors:
    Richard L. Labinger - Trumbull CT
    Natale F. Tinnerino - Redding CT
    Timothy E. Bryant - Yorba Linda CA
  • Assignee:
    The Perkin-Elmer Corporation - Norwalk CT
  • International Classification:
    H04N 718
  • US Classification:
    358106
  • Abstract:
    A system for detecting flaws in printed circuit boards. The circuit board is scanned by a video camera to provide a serial stream of bits each indicative of a picture element within a particular scan line. The serial stream of bits is formulated into binary numbers each representative of a contiguous path of picture elements composed of n. times. n picture elements. Each of these binary numbers are compared with a corresponding one of a set binary numbers stored in memory representative of a perfect master printed circuit board. Failure of the printed circuit board to match the stored master indicates a flaw. The invention also includes means to generate overlapping patches to insure detection of defects which occur in adjacent patches.
  • Ceramic Carrier Transport For Die Attach Equipment

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  • US Patent:
    55475370, Aug 20, 1996
  • Filed:
    Jun 3, 1994
  • Appl. No.:
    8/253579
  • Inventors:
    Edward P. Reynolds - Philadelphia PA
    Natale F. Tinnerino - Doylestown PA
    Walter P. Schiefele - Sebastian FL
  • Assignee:
    Kulicke & Soffa, Investments, Inc. - Wilmington DE
  • International Classification:
    B23B 3500
    B23P 1900
  • US Classification:
    156351
  • Abstract:
    An aligning and positioning system for a bonder including a bond sensor for sensing the X, Y and. theta. coordinates of a substrate at the bonding location and a die sensor for sensing the X, Y and. theta. coordinates of the die on a die transport. A controller correlates the sensed coordinates from the sensors and adjusts the X, Y and. theta. of the die and the substrate relative to each other to place the die at a preselected bond site on the substrate. The Z coordinate of the surface of the substrate, as well as its planarity, may be sensed by a Z optical sensor. The X and Y coordinates of the substrate are adjusted and the. theta. coordinate of the die on the die transport is adjusted. A pattern recognition system is used with the die and bond sensors to determine the coordinates as well as quality control of the substrate prior to bonding, the quality of paste pattern on the die or the substrate prior to bonding and the quality of the bond and the coordinates of the die after bonding. In a calibration phase, the controller correlates the X, Y and. theta.

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