A method eliminates voids in the bond line and manipulates a thickness of the bond line. This method includes: applying an adhesive at a center of an area of a structure; placing a doubler on the adhesive over the area of the structure, wherein the doubler has a peripheral edge; and maintaining a negative pressure at the peripheral edge of the doubler while simultaneously maintaining a positive pressure at the doubler to purge entrapped gases and control a thickness of the bond line at the peripheral edge of the doubler.