Michael Dean Brooks

US Patent:

6661673, Dec 9, 2003

Filed:

Feb 12, 2002

Appl. No.:

10/074783

Inventors:

Michael Alan Brooks - Sacramento CA
Sean Anthony Cerniglia - Cool CA

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H05K 714

US Classification:

361756, 361741, 361802, 361796

Abstract:

An apparatus in one example comprises a first card guide base portion and a card guide end portion. The first card guide base portion is connected with a second card guide base portion in a side-by-side relationship. The card guide end portion is employable with the first card guide base portion to comprise one or more portions of a card guide path. The card guide end portion comprises a face of a color that is different from a color of the first card guide base portion.

US Patent:

6680840, Jan 20, 2004

Filed:

Aug 31, 2001

Appl. No.:

09/943704

Inventors:

Michael Alan Brooks - Sacramento CA

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H01H 4700

US Classification:

361160, 361152, 361170

Abstract:

A method and apparatus to achieve an electro-mechanical interlock for a hot-swappable component. This invention prevents the misuse and possible damage to the hot-swappable component or the host data processing system due to incorrect insertion or removal of an energized hot-swappable component. One embodiment of the invention involves a method to assemble a hot-swappable power supply with an electro-mechanical interlock into the frame of a data processing system. A second embodiment of the invention involves a method to fabricate an electro-mechanical interlock with a solenoid. A third embodiment of the invention involves a hot-swappable component interlock.

US Patent:

6891734, May 10, 2005

Filed:

Mar 7, 2002

Appl. No.:

10/094248

Inventors:

Michael A. Brooks - Sacramento CA, US
Glenn C. Simon - Auburn CA, US
Sean A. Cerniglia - Cool CA, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H05K007/14

US Classification:

361800, 361756

Abstract:

A keyed filler panel with removably-coupleable airflow resistive filler card assembly is disclosed. In one embodiment, the present invention is comprised of a filler panel body. The present embodiment is further comprised of an airflow resistive filler portion removably-coupleable with said filler panel body. The airflow resistive filler portion adapted to couple with the filler panel body without additional hardware.

US Patent:

6920049, Jul 19, 2005

Filed:

Feb 5, 2003

Appl. No.:

10/358771

Inventors:

Michael Alan Brooks - Sacramento CA, US
Michael J. Greenside - Granite Bay CA, US
Glenn Simon - Auburn CA, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

G06F001/16

US Classification:

361727, 312319, 710302, 16271

Abstract:

A bladed server with a chassis having a front and rear is provided. A plurality of blades is disposed within the chassis so that opposing faces and a faceplate of each of the plurality of blades are substantially perpendicular to the front and rear of the chassis. The plurality of blades includes at least one server blade. One or more fans are located at at least one of the front and rear of the chassis such that a flow-path at at least one of an inlet and exit of the one or more fans is substantially parallel to the opposing faces and faceplate of each of the plurality of blades.

US Patent:

6963484, Nov 8, 2005

Filed:

Dec 17, 2003

Appl. No.:

10/738106

Inventors:

Michael Alan Brooks - Antelope CA, US
Jeremy Wilson - Roseville CA, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H05K007/20

US Classification:

361678, 361691, 361695

Abstract:

An airflow blocker component of an apparatus in one example is coupled with a support component. The airflow blocker component comprises a flexible flap portion that is bendable away from the support component into a position that directs one or more airflow portions to promote an increased cooling of one or more thermal components.

US Patent:

7079387, Jul 18, 2006

Filed:

Jun 11, 2003

Appl. No.:

10/459263

Inventors:

Michael A. Brooks - Sacramento CA, US
Thane M. Larson - Roseville CA, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

G06F 1/16

US Classification:

361687, 454184, 622592, 165185

Abstract:

A computer system includes an enclosure, a backplane within the enclosure, a replaceable unit releasably connected to the backplane, an air cooling system configured to create an air flow along the replaceable unit and an air flow blocking system. The air flow blocking system includes a first member coupled to the enclosure and a second member coupled to the replaceable unit. The first member and the second member interact to at least partially block air flow along the replaceable unit based upon at least one characteristic of the replaceable unit.

US Patent:

7248484, Jul 24, 2007

Filed:

Mar 12, 2003

Appl. No.:

10/387800

Inventors:

Michael Brooks - Sacramento CA, US
Mike Cherniski - Rescue CA, US
Kevin Smith - Roseville CA, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H05K 9/00

US Classification:

361818, 361816, 174 51

Abstract:

Embodiments of the present invention provide an electro-magnetic suppressive structure. The electro-magnetic suppressive structure comprises a cover portion and an integrally formed conductive portion.

US Patent:

20030189818, Oct 9, 2003

Filed:

Apr 4, 2002

Appl. No.:

10/117025

Inventors:

Michael Brooks - Sacramento CA, US
James Hensley - Rocklin CA, US
Michael Greenside - Granite Bay CA, US

International Classification:

H05K007/14
H05K007/18

US Classification:

361/796000

Abstract:

A substrate cover assembly is disclosed. In one embodiment, the present invention is comprised of a cover element adapted to be removably-coupleable with a substrate. The present embodiment is further comprised of at least one openable portion coupled with the cover element. Beneficially, the openable portion is adapted to allow access to a portion of the substrate.