Michael A Bayne

US Patent:

6578264, Jun 17, 2003

Filed:

Apr 11, 2000

Appl. No.:

09/546927

Inventors:

Reed Gleason - Portland OR
Michael A. Bayne - Beaverton OR
Kenneth Smith - Portland OR

Assignee:

Cascade Microtech, Inc. - Beaverton OR

International Classification:

H01R 4316

US Classification:

29874, 29846, 29876, 29882, 294261, 324715, 324754

Abstract:

A method for constructing a membrane probe that includes providing a substrate, and creating a depression within the substrate. Conductive material is located within the depression and a conductive trace is connected to the conductive material. A membrane is applied to support the conductive material and the substrate is removed from the conductive material.

US Patent:

6708386, Mar 23, 2004

Filed:

Mar 22, 2001

Appl. No.:

09/814593

Inventors:

Reed Gleason - Portland OR
Michael A. Bayne - Vancouver WA
Kenneth Smith - Portland OR
Timothy Lesher - Beaverton OR
Martin Koxxy - Hillsboro OR

Assignee:

Cascade Microtech, Inc. - Beaverton OR

International Classification:

G01R 100

US Classification:

29593, 29815, 29825, 29827, 438 17

Abstract:

A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.

US Patent:

6825677, Nov 30, 2004

Filed:

Mar 22, 2001

Appl. No.:

09/814594

Inventors:

Reed Gleason - Portland OR
Michael A. Bayne - Vancouver WA
Kenneth Smith - Portland OR
Timothy Lesher - Beaverton OR
Martin Koxxy - Hillsboro OR

Assignee:

Cascade Microtech, Inc. - Beaverton OR

International Classification:

G01R 3102

US Classification:

324754

Abstract:

A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material islocated within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.

US Patent:

6860009, Mar 1, 2005

Filed:

Mar 22, 2001

Appl. No.:

09/814584

Inventors:

Reed Gleason - Portland OR, US
Michael A. Bayne - Vancouver WA, US
Kenneth Smith - Portland OR, US
Timothy Lesher - Beaverton OR, US
Martin Koxxy - Hillsboro OR, US

Assignee:

Cascade Microtech, Inc. - Beaverton OR

International Classification:

H01R043/16

US Classification:

29874, 294261, 29882, 29846, 29876

Abstract:

A method of constructing a probe which includes providing a substrate and creating a first substantially asymmetrical recess within the substrate. A conductive material is located within the recess and a conductive trace is electrically connected with the conductive material. A membrane supports the conductive trace, wherein the conductive material is located between the membrane and the substrate. The substrate is removed from the conductive material.

US Patent:

7178236, Feb 20, 2007

Filed:

Apr 16, 2003

Appl. No.:

10/418510

Inventors:

Reed Gleason - Portland OR, US
Michael A. Bayne - Beaverton OR, US
Kenneth Smith - Portland OR, US

Assignee:

Cascade Microtech, Inc. - Beaverton OR

International Classification:

H01R 43/16

US Classification:

29874, 29876, 29882, 294261, 324754

Abstract:

A method for constructing a membrane probe that includes providing a substrate, and creating a depression within the substrate. Conductive material is located within the depression and a conductive trace is connected to the conductive material. A membrane is applied to support the conductive material and the substrate is removed from the conductive material.

US Patent:

7400155, Jul 15, 2008

Filed:

Feb 3, 2004

Appl. No.:

10/772172

Inventors:

Reed Gleason - Portland OR, US
Michael A. Bayne - Vancouver WA, US
Kenneth Smith - Portland OR, US
Timothy Lesher - Beaverton OR, US
Martin Koxxy - Hillsboro OR, US

Assignee:

Cascade Microtech, Inc. - Beaverton OR

International Classification:

G01R 31/02

US Classification:

324754, 29874, 29846, 29876, 29882, 294261

Abstract:

A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.

US Patent:

7533462, May 19, 2009

Filed:

Dec 1, 2006

Appl. No.:

11/607156

Inventors:

Reed Gleason - Portland OR, US
Michael A. Bayne - Beaverton OR, US
Kenneth Smith - Portland OR, US

Assignee:

Cascade Microtech, Inc. - Beaverton OR

International Classification:

H01R 43/16
H01R 43/00

US Classification:

29874, 29825, 29846, 29876, 29879

Abstract:

A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.

US Patent:

7681312, Mar 23, 2010

Filed:

Jul 31, 2007

Appl. No.:

11/888429

Inventors:

Reed Gleason - Portland OR, US
Michael A. Bayne - Vancouver WA, US
Kenneth Smith - Portland OR, US
Timothy Lesher - Beaverton OR, US
Martin Koxxy - Hillsboro OR, US

Assignee:

Cascade Microtech, Inc. - Beaverton OR

International Classification:

H01R 43/16

US Classification:

29857, 29846, 29876, 29882, 29426, 174253, 174 523

Abstract:

A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.