Meredith Steenwyk

US Patent:

8023267, Sep 20, 2011

Filed:

Jun 19, 2009

Appl. No.:

12/487834

Inventors:

John Jay Streyle - Walker MI, US
Benjamin Jon Vander Ploeg - Kentwood MI, US
Meredith Marie Steenwyk - Kentwood MI, US
Danny Weldon Coxon - Conklin MI, US

Assignee:

General Electric Company - Schenectady NY

International Classification:

H05K 7/20
F28F 7/00
H01L 23/34

US Classification:

361707, 361704, 361719, 165 801, 257713, 174547, 174 17 R, 174252

Abstract:

An avionics chassis comprises a housing having opposing walls, a pair of spaced card rails with one rail mounted to each of the opposing walls where each rail has a channel to define an effective slot between the rails, a circuit card assembly comprising a PCB and a thermal plane in overlying relationship with the PCB, with the PCB defining a first primary plane, and the thermal plane defining a second primary plane and the spatial relationship between them is such that the planes are located within the slot when the circuit card assembly is mounted to the card rails and the thermal plane is conductively coupled to a rail to form a first conductive path from the thermal plane to one of the walls and the PCB is conductively coupled to a rail to form a second conductive path from the PCB to one of the walls.

US Patent:

8059409, Nov 15, 2011

Filed:

Jun 19, 2009

Appl. No.:

12/487797

Inventors:

Meredith Marie Steenwyk - Kentwood MI, US
Danny Weldon Coxon - Conklin MI, US
John Jay Streyle - Walker MI, US
Benjamin Jon Vander Ploeg - Kentwood MI, US

Assignee:

General Electric Company - Schenectady NY

International Classification:

H05K 7/20

US Classification:

361710, 361707, 361708, 361709, 361714, 361697

Abstract:

An avionics chassis comprises a carbon fiber reinforced housing, a card rail for holding an electronic circuit board mounted to an interior surface of the housing, at least one heat-dissipating fin composed of carbon fiber and extending from the outer surface of the housing, a plurality of isotropic carbon fibers extending from an interior of the fin through the housing and in abutting contact with the card rail. The plurality of isotropic fibers form a direct conductive path from the card rail to the heat-dissipating fin.

US Patent:

8222541, Jul 17, 2012

Filed:

Jun 19, 2009

Appl. No.:

12/487784

Inventors:

Benjamin Jon Vander Ploeg - Kentwood MI, US
Meredith Marie Steenwyk - Kentwood MI, US
Danny Weldon Coxon - Conklin MI, US
Paul James Horton - Rockford MI, US
John Jay Streyle - Walker MI, US

Assignee:

General Electric Company - Schenectady NY

International Classification:

H05K 9/00

US Classification:

174382, 174384, 361218, 361816

Abstract:

An avionics chassis comprises a composite housing, a radio wave shield, and a lightning strike conductive path, wherein the radio wave shield attenuates electromagnetic interference entering and leaving the housing, and the lightning strike conductive path directs the current from a lightning strike away from an interior of the housing.

US Patent:

20100321892, Dec 23, 2010

Filed:

Jun 19, 2009

Appl. No.:

12/487850

Inventors:

Benjamin Jon Vander Ploeg - Kentwood MI, US
Meredith Marie Steenwyk - Kentwood MI, US
Danny Weldon Coxon - Conklin MI, US
John Jay Streyle - Walker MI, US

Assignee:

General Electric Company - Schenectady NY

International Classification:

H05K 7/20

US Classification:

361707

Abstract:

An avionics chassis comprises a housing having a substantially thermally non-conductive frame comprising a composite of carbon fibers laid up in an epoxy matrix. The housing also includes at least two walls, at least one of which is a thermally conductive wall comprising a composite of carbon fibers in a carbonized matrix, and a plurality of spaced, thermally-conductive, card rails provided on the at least two walls. The at least two walls are mounted to the frame in opposing relationship such that corresponding card rails on the walls define an effective slot therebetween in which a printed circuit board may be received and the card rails and the at least one thermally conductive wall form a thermally conductive path from the interior to the exterior.