Lynda G Flederbach from 5256 W 80 S, Kokomo, IN 46901, age 68, Phone: 317-669-2065

Method For Improving The Thermal Cycled Adhesion Of Thick-Film Conductors On Dielectric
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US Patent:

20060240231, Oct 26, 2006
Filed:

Apr 21, 2005
Appl. No.:

11/111317
Inventors:

Bradley Carter - Kokomo IN, US
Lynda Flederbach - Kokomo IN, US
John Isenberg - Rossville IN, US
International Classification:

B32B 3/00
B32B 18/00
US Classification:

428209000, 428210000, 428901000
Abstract:

An improved electrical printed circuit exhibiting a combination of enhanced solderability and outstanding adhesion with a dielectric substrate includes a stack of two different types of conductive films. The stack includes a first conductive film that is printed onto the substrate with an ink that has been specially formulated to achieve enhanced adhesion with the substrate, and a second film that is applied over the first film using an ink that has been specifically formulated to achieve enhanced solderability.

Ultra-Thick Thick Film On Ceramic Substrate
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US Patent:

20090001546, Jan 1, 2009
Filed:

Jun 28, 2007
Appl. No.:

11/823690
Inventors:

Lynda G. Flederbach - Kokomo IN, US
Rick A. Weed - Kokomo IN, US
Bradley H. Carter - Kokomo IN, US
Erich W. Gerbsch - Cicero IN, US
John K. Isenberg - Rossville IN, US
Carl W. Berlin - West Lafayette IN, US
International Classification:

H01L 23/373
US Classification:

257690, 257E23113
Abstract:

An electrically isolated and thermally conductive double-sided pre-packaged integrated circuit component exhibiting excellent heat dissipative properties, durability and strength, and which can be manufactured at a low cost includes electrically insulated and thermally conductive substrate members having outer surfaces, ultra-thick thick film materials secured to the outer surfaces of the substrate members and a lead member and a transistor member positioned between the substrate members.

Lynda G Flederbach