Raymond Andrew Cirelli - Hillsborough NJ Masis Mkrtchyan - Stirling NJ Lee Edward Trimble - Orlando FL George Patrick Watson - Avon NJ David Lee Windt - Berkeley Heights NJ
Assignee:
Lucent Technologies Inc. - Murray Hill NJ
International Classification:
G03F 900
US Classification:
430 30
Abstract:
A process for device fabrication is disclosed. In the process, optical lithography is used to introduce an image of a desired pattern into an energy sensitive material. In the process, a filter element is provided. The filter element has at least two regions of different transmittance, each region denominated an aperture. The regions are selected by obtaining information about the desired pattern and an optical lithographic tool that will be used to introduce the image of the desired pattern into the energy sensitive resist material. A filter element that provides an image that, when developed, will provide features with dimensions within acceptable process tolerances is then designed. The filter element is designed by modeling the effects of each aperture of the filter element on the intensity profile of an image of the desired pattern. The combined effect of the apertures is then determined.
Method Of Increasing The Grain Size Of Polycrystalline Materials By Directed Energy-Beams
George K. Celler - Summit NJ Harry J. Leamy - Summit NJ Lee E. Trimble - Hillsborough NJ
Assignee:
Bell Telephone Laboratories, Incorporated - Murray Hill NJ
International Classification:
H01L 21263
US Classification:
148 15
Abstract:
Crystal grain size in a material is increased by scanning the material with an appropriately directed energy beam. Short-term oscillation in the scan, and a particular temperature gradient configuration in the wake of the scan, results in growth of large-grain crystallites.
Fabrication Of Dielectrically Isolated Devices With Buried Conductive Layers
George K. Celler - New Providence NJ Lee E. Trimble - Hillsborough NJ
Assignee:
American Telephone and Telegraph Company, AT&T Bell Laboratories - Murry Hill NJ
International Classification:
H01L 21225
US Classification:
437 37
Abstract:
In dielectrically isolated devices a buried conducting layer adjacent to the dielectric layer is produced by a drift effect. In particular, if arsenic antimony and/or phosphorus is present in the silicon dioxide layer, it is caused to drift from this layer and enter the adjacent isolated silicon region while maintaining a relatively narrow spatial configuration. Thus, a discrete buried highly conductive layer is formed. This configuration is particularly useful for transistor configurations such as utilized in switching applications.
Lee E. Trimble - Clark NJ Rudolf J. H. Voorhoeve - Summit NJ
Assignee:
Bell Telephone Laboratories, Incorporated - Murray Hill NJ
International Classification:
C01C 300 C01C 314
US Classification:
423365
Abstract:
The use of a reaction mixture of carbon monoxide, an oxide of nitrogen such as nitric oxide, and a source of hydrogen when passed over a hydrogenation catalyst produces cyanate compounds, e. g. , ammonium cyanate and isocyanic acid. The reaction conditions chosen determine the relative amounts of the various cyanate compounds to be formed. When the formation of ammonium cyanate is desired, the addition of ammonia to the reaction mixture reduces the amount of nitric oxide reactant necessary, while enhancing the efficiency of ammonium cyanate production. When a palladium or iridium catalyst is used, the production of isocyanic acid is favored.
George K. Celler - New Providence NJ Lee E. Trimble - Hillsborough NJ
Assignee:
AT&T Bell Laboratories - Murray Hill NJ
International Classification:
G03F 900
US Classification:
430 5
Abstract:
A mask for X-ray lithography is produced by initially forming a thin layer of polycrystalline silicon on a silicon oxide containing substrate. A portion of the substrate at the periphery of the major surface opposite the silicon layer is masked. The exposed portion of the substrate is removed by an etchant that is selective for silicon oxide containing composition relative to silicon, e. g. aqueous HF. The resulting membrane of silicon on a peripheral region of silicon oxide containing compositions is in tensile stress as required for lithography, but is robust. Metal, X-ray absorbing patterns are formed on the silicon by standard lithographic procedures.
Process For Fabricating Dielectrically Isolated Devices Utilizing Heating Of The Polycrystalline Support Layer To Prevent Substrate Deformation
George K. Celler - New Providence NJ Pradip K. Roy - Wyomissing Hills PA Donald G. Schimmel - Reading PA Lee E. Trimble - Hillsborough NJ
Assignee:
AT&T Bell Laboratories - Murray Hill NJ
International Classification:
H01L 2120 H01L 2176
US Classification:
29576W
Abstract:
The efficacy of dielectrically isolated device formation on a substrate is substantially enhanced through a specific set of processing steps. In particular, before silicon oxide regions, e. g. , gate oxide regions, are produced, bulk polycrystalline areas are heat treated to substantially increase their polycrystalline silicon grain size.
Lee Trimble (1980-1984), Lois stewart (1976-1980), kathy wellman (1978-1982), Clarice Arthur (1964-1968), Nancy Butler (1963-1967), marian evans (1970-1974)