Kurt P Wachtler

US Patent:

6374481, Apr 23, 2002

Filed:

Jun 28, 2000

Appl. No.:

09/607087

Inventors:

Kurt P. Wachtler - Richardson TX
Mark W. Heaton - Irving TX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H01F 706

US Classification:

29606, 296021, 2960303, 335 78, 335 80, 335 82, 335 84, 335 86

Abstract:

A piece-part microactuator ( ), or micromotor, manufacturing approach is presented. In this approach, two of the NiFe parts ( ) and dielectric and copper ( ) piece-parts are manufactured separately. This allows the NiFe parts ( ) to be designed in a manner to maximize the thickness of the metal, which in turn increases the magnetic properties of the motor. The dielectric and copper coils piece-part ( ) may be based upon a thin film interconnect ( ) or some derivative of a standard flex circuit printed wiring board. These piece-parts ( ) may be tested individually, defective parts discarded, and only functional units assembled. This not only produces a mechanically balanced construction, but has lower cost due to non-sequential manufacturing steps. The dielectric and copper coils piece-part ( ) also provides the path for electrical connections to the movable platform ( ) and a relatively easy method for electrical connection off the microactuator and onto the hard disk drive system.

US Patent:

6473274, Oct 29, 2002

Filed:

Jun 28, 2000

Appl. No.:

09/607413

Inventors:

Peter J. Maimone - Irvine CA
Kurt P. Wachtler - Richardson TX
Mark W. Heaton - Irving TX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

G11B 556

US Classification:

3602945

Abstract:

A microactuator includes a base, first microactuator elements carried by the base, a platform attached to the base, second microactuator elements carried by the platform, and the first microactuator elements being located substantially symmetrically on either side of a plane along a centerline of the base.

US Patent:

6504685, Jan 7, 2003

Filed:

Aug 8, 2000

Appl. No.:

09/634097

Inventors:

Kurt P. Wachtler - Richardson TX
Peter J. Maimone - Irvine CA

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

G11B 556

US Classification:

3602943

Abstract:

A microelectromechanical (MEM) device with an expanded PTFE material over the gap between movable structures to provide electrical connection across the gap and prevent particles from contaminating the gap. A microelectromechanical (MEM) device is also immobilized by placing an expanded PTFE material over the gap between movable structures. The expanded PTFE material can be made stiff during manufacture and then flexible after the manufacturing process is complete. An embodiment of the invention is a MEM device configured as a micro-actuator for a dual-actuator hard disk drive.

US Patent:

6541352, Apr 1, 2003

Filed:

Jul 27, 2001

Appl. No.:

09/917524

Inventors:

Kurt P. Wachtler - Richardson TX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H01L 2146

US Classification:

438460, 438113, 438665, 438459, 438964, 257739

Abstract:

Methods are disclosed for manufacturing semiconductor device dies and for removing material from the bottom side of the wafer dies, wherein a contoured surface is provided on the die bottom, such as through an etching process. In addition, methods are disclosed for securing a semiconductor device to a surface. Semiconductor wafers and die are also disclosed having contoured bottom surfaces.

US Patent:

6686225, Feb 3, 2004

Filed:

Jul 27, 2001

Appl. No.:

09/917534

Inventors:

Kurt P. Wachtler - Richardson TX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H01L 2144

US Classification:

438114, 438462, 438465, 438964, 438977

Abstract:

Methods are disclosed for manufacturing semiconductor device dies and for separating dies from a semiconductor wafer, wherein one or more channels are etched in the top of the wafer between individual die areas. Material is then removed from the bottom side of the wafer in order to separate the individual dies. Methods are also disclosed for removing material from the bottom side of the wafer dies, wherein a contoured surface is provided on the die bottom, such as through an etching process. In addition, methods are disclosed for removing material from the bottom side of a wafer, and for securing a semiconductor device to a surface. Semiconductor wafers and dies are also disclosed having contoured bottom surfaces.

US Patent:

6707124, Mar 16, 2004

Filed:

Feb 16, 2001

Appl. No.:

09/788075

Inventors:

Kurt P. Wachtler - Richardson TX
David N. Walter - Richardson TX
Larry J. Mowatt - Allen TX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H01L 310203

US Classification:

257433, 257432, 257434, 257435, 257668, 257678, 257711, 257774, 257700

Abstract:

A high density interconnect device which creates a thin, electrically and thermally high performance package for semiconductor devices having a mechanically stable and high thermal conductivity substrate. Cavities in the substrate accommodate semiconductor devices attached directly to the substrate. The semiconductor devices include at least one optical receiver and/or transmitter. A thin film overlay having multiple layers interconnects the semiconductor devices to an array of pads on a surface of the thin film overlay facing away from the substrate. Connectors are attached to the pads to provide direct electrical and mechanical attachment to other system hardware. In one embodiment, the optical receiver and/or transmitter receives and/or transmits light signals through the thin film overlay. In another embodiment, the optical receiver and/or transmitter receives and/or transmits light signals through holes formed through the thin film overlay. The holes may be back filled with an optical quality material.

US Patent:

7390700, Jun 24, 2008

Filed:

Apr 7, 2006

Appl. No.:

11/400099

Inventors:

Mark A. Gerber - Lucas TX, US
Kurt P. Wachtler - Richardson TX, US
Abram M. Castro - Fort Worth TX, US

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H01L 21/44

US Classification:

438108, 438113, 257E21499

Abstract:

A semiconductor system () of one or more semiconductor interposers () with a certain dimension (), conductive vias () extending from the first to the second surface, with terminals and attached non-reflow metal studs () at the ends of the vias. A semiconducting interposer surface may include discrete electronic components or an integrated circuit. One or more semiconductor chips () have a dimension () narrower than the interposer dimension, and an active surface with terminals and non-reflow metal studs (). One chip is flip-attached to the first interposer surface, and another chip to the second interposer surface, so that the interposer dimension projects over the chip dimension. An insulating substrate () has terminals and reflow bodies () to connect to the studs of the projecting interposer.

US Patent:

7569918, Aug 4, 2009

Filed:

May 1, 2006

Appl. No.:

11/380953

Inventors:

Mark A. Gerber - Lucas TX, US
Kurt P. Wachtler - Richardson TX, US
Abram M. Castro - Fort Worth TX, US

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H01L 23/02

US Classification:

257676, 257724, 438107

Abstract:

A semiconductor system () has one or more packaged active subsystems (); each subsystem has a substrate with electrical contact pads and one or more semiconductor chips stacked on top of each other, assembled on the substrate. The system further has a packaged passive subsystem () including a substrate with electrical contacts and passive electrical components, such as resistors, capacitors, and indictors. The passive subsystem is stacked with the active subsystems and connected to them by solder bodies.