Rajeev Ramanath - Plano TX, US Kirk F. Settle - McKinney TX, US Jeffrey M. Kempf - Allen TX, US
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
G09G 5/10
US Classification:
345690
Abstract:
In accordance with a particular embodiment of the present disclosure, color correction based on light intensity in imaging systems may be accomplished by applying a color correction data structure to color component values.
Expanded Lead Pitch For Semiconductor Package And Method Of Electrical Testing
The invention relates to packages of semiconductor devices, specifically of the surface mount and Quad Flat Pack families, that can be used in current semiconductor device production, and to a method of automated testing. The packages have a plurality of insulating tie bars supporting a multitude of leads. The tie bars are designed so that they comprise celectrically conductive vias in a pattern expanding the effective lead pitch for more convenient testing, without introducing unwanted side effects. The full benefit of the expanded lead pitch can be exploited during the electrical testing of the device which utilizes a test apparatus simplified for an automated testing procedure. The base of the apparatus includes a multitude of electrically conductive and mechanically elastic passageways with surface contours adapted for contacting the metallic end connectors of the semiconductor device-to-be-tested, as well as the metallic connector to the tester.
Keynote Technologies since May 2010
Senior Systems Engineer
Brilliant Technologies May 2009 - May 2010
Contract Systems Engineer, Solid State Illumination
Mitsubishi Digital Electronics Jan 2009 - May 2009
Contract Systems Engineer, DLP
Texas Instruments Inc. Mar 2005 - Jan 2009
Customer Systems Engineer
Texas Instruments DLP(TM) Home Entertainment Products Mar 2005 - Jan 2009
Customer Systems Engineer
Education:
American College of Computer and Information Sciences 2002
BS, Computer Science
Midland College 1990
AS, Audio/Electronics Technology
Honor & Awards:
• Designed and implemented an NCTB (non-conductive tie bar) contactor solution for automated device testing, along with package modifications to increase testability. US Patent # 6,377,061.
• Defined and implemented an algorithm to maintain color correctness in imaging systems based on light intensity. US Patent Pending.
• Designed an environment chamber and modified an EG2010 probe system to facilitate production level wafer probe at temperatures ranging from –55’c to 125’c. Received TI's Technical Excellence award for this project. Consulted on several other projects related to Cold Chuck Probe, one which resulted in a solution being released in DTF.