Robert Brown - Boca Raton FL Jeffrey E. LeClaire - Boca Raton FL Huizong Lu - Coral Springs FL John L. Sullivan - Boca Raton FL
Assignee:
Zygo Corporation - Middlefield CT
International Classification:
G02B 600
US Classification:
385137, 385 65, 385 83
Abstract:
An apparatus includes a substrate having at least one opening through a top surface to a bottom surface, the substrate also having a first plurality of aligned grooves formed in the top surface and a plurality of fibers, where each of the plurality of fibers are positioned over the opening and in contact with the substrate within a corresponding one of the first plurality of grooves. In another aspect, a method of manipulating fibers includes placing a plurality of fibers on a substrate to extend over an opening formed through a top surface of the substrate to a bottom surface of the substrate, and flowing air through the opening to draw the plurality of fibers down towards the top surface of the substrate, and positioning each of said plurality of fibers in substantial alignment.
Robert Brown - Boca Raton FL Jeffrey E. Leclaire - Boca Raton FL Huizong Lu - Coral Springs FL John L. Sullivan - Boca Raton FL
Assignee:
Zygo Corporation - Middlefield CT
International Classification:
G02B 600
US Classification:
385147, 385137, 269 21
Abstract:
An apparatus for placing a fiber on a substrate, the apparatus including a base, a supporting member attached to the base, a first placement head attached to the support member, the first placement head having an extendable plunger slidably coupled to the first placement head, the first placement head having an airflow channel formed proximate to a tip of the plunger, a substrate carrier attached to the base, wherein, during operation of the apparatus, the substrate carrier holds a substrate beneath the plunger mechanism, and wherein, during operation of the apparatus, a vacuum source is connected to the placement head to draw a flow of air through the airflow channel, and wherein, during operation of the apparatus, the placement head picks up and holds a fiber against the plunger tip using forces associated with the flow of air.
Robert Brown - Boca Raton FL Jeffrey E. Leclaire - Boca Raton FL Huizong Lu - Coral Springs FL John L. Sullivan - Boca Raton FL
Assignee:
Zygo Corporation - Middlefield CT
International Classification:
G02B 626
US Classification:
385 52, 385147, 257 48
Abstract:
A method of aligning fibers on a substrate includes placing a grooved substrate on a base next to an opening formed through a top surface of the base, flowing air through the opening to draw the plurality of fibers down towards the top surface of the substrate or base, placing a set of fibers to extend over the substrate or base and over the opening and bonding the plurality of fibers to the substrate.
Barry F. Hopkins - Hobe Sound FL, US David J. Ray - Agoura Hills CA, US Jeffrey E. LeClaire - Boca Raton FL, US Roy White - Wellington FL, US
Assignee:
Rave, LLC - Delray Beach FL
International Classification:
G01N 13/16
US Classification:
2504922, 2504921, 2504923, 250306, 73105
Abstract:
A method and apparatus includes positioning a reactant on a surface in specific location and then directing an energy source from a device at the reactant such that it modifies the surface to either remove material or add material.
A method and apparatus includes positioning a reactant on a surface in specific location and then directing an energy source from a device at the reactant such that it modifies the surface to either remove material or add material.
Apparatus And Method For Indirect Surface Cleaning
Jeffrey E. LeClaire - Boca Raton FL, US Kenneth G. Roessler - Boca Raton FL, US David Brinkley - Baltimore MD, US
Assignee:
Rave, LLC - Delray Beach FL
International Classification:
B08B 7/00
US Classification:
134 1, 134 13, 134 42, 134902
Abstract:
Methods for cleaning a surface of a substrate and for increasing the useable lifetime of a photomask substrate are provided. In one method, a substrate has at least one radiation-produced particle disposed thereon, and a laser that has a wavelength that substantially coincides with a high absorption coefficient of the substrate is directed towards the substrate. A thermal increase is generated in the substrate, and the radiation-produced particle is removed from the substrate by transferring thermal energy from the substrate to the radiation-produced particle until the radiation-produced particle decomposes.
Jeffrey E. LeClaire - Boca Raton FL, US Kenneth G. Roessler - Boca Raton FL, US David Brinkley - Baltimore MD, US
Assignee:
Rave LLC - Delray Beach FL
International Classification:
B08B 7/00
US Classification:
134 1, 134 13, 134 42, 134902
Abstract:
A wafer fabrication process with removal of haze formation from a pellicalized photomask surface is provided. The wafer fabrication process includes pre-print wafer processing, wafer print processing using at least one photomask having a pellicle, photomask clean processing, wafer print processing using the photomask, and post-print wafer processing. The photomask clean processing step includes directing a laser through the pellicle towards an inorganic particle disposed on the photomask to remove the particle from the photomask by thermal decomposition.
Apparatus And Method For Indirect Surface Cleaning
Jeffrey E. LeClaire - Boca Raton FL, US Kenneth Gilbert Roessler - Boca Raton FL, US David Brinkley - Baltimore MD, US
Assignee:
Rave, LLC - Delray Beach FL
International Classification:
B08B 7/00
US Classification:
134 1, 134 13, 134 42, 134902
Abstract:
A method for laser surface cleaning of a target surface that has limited or no access to the environment directly above the surface to be cleaned. The method includes the ability to clean the surface with a reduced risk of substrate damage. The method includes direct laser excitation of a contaminated substrate surface and thermal transfer from the substrate to the contaminating particulate or contamination layer. The method also includes producing a thermally based removal and reducing a risk of substrate damage by keeping the temperature required to produce surface cleaning below the thermal damage level of the substrate material. In addition, the method includes reducing the risk of substrate damage by utilizing relatively long pulse-widths, providing for improved removal of small contaminants/particles, and directing the beam through a material disposed relative to the surface that is part of the substrates environmental enclosure.
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Jeffrey Leclaire
Work:
Batteries Plus LLC - Senior Application Support Analyst (2009)