Jason M Weigold

US Patent:

7449356, Nov 11, 2008

Filed:

Dec 19, 2006

Appl. No.:

11/613003

Inventors:

Jason W. Weigold - Somerville MA, US

Assignee:

Analog Devices, Inc. - Norwood MA

International Classification:

H01L 21/00

US Classification:

438 53, 438 52, 438 50, 257419, 381191, 381174

Abstract:

A method of forming a microphone forms a backplate, and a flexible diaphragm on at least a portion of a wet etch removable sacrificial layer. The method adds a wet etch resistant material, where a portion of the wet etch resistant material is positioned between the diaphragm and the backplate to support the diaphragm. Some of the wet etch resistant material is not positioned between the diaphragm and backplate. The method then removes the sacrificial material before removing any of the wet etch resistant material added during the prior noted act of adding. The wet etch resistant material then is removed substantially in its entirety after removing at least part of the sacrificial material.

US Patent:

7633360, Dec 15, 2009

Filed:

Sep 27, 2006

Appl. No.:

11/535807

Inventors:

Jason W. Weigold - Somerville MA, US

Assignee:

Analog Devices, Inc. - Norwood MA

International Classification:

H03H 9/24
H03H 9/46
H03H 9/50
H03B 5/30

US Classification:

333186, 333199, 331154, 257415

Abstract:

A MEMS resonator has an outer element having an inner surface, the inner surface defining an area and a inner element coupled to the outer element and disposed within the area. The MEMS resonator also has an actuation electrode, in communication with the outer element, for generating electrostatic signals that cause the inner element to flex in a periodic manner.

US Patent:

7795695, Sep 14, 2010

Filed:

Sep 27, 2006

Appl. No.:

11/535804

Inventors:

Jason W. Weigold - Somerville MA, US
John R. Martin - Foxborough MA, US
Timothy J. Brosnihan - Natick MA, US

Assignee:

Analog Devices, Inc. - Norwood MA

International Classification:

H01L 29/84
H04R 25/00

US Classification:

257419, 381175, 181167

Abstract:

A method of forming a microphone having a variable capacitance first deposits high temperature deposition material on a die. The high temperature material ultimately forms structure that contributes to the variable capacitance. The method then forms circuitry on the die after depositing the deposition material. The circuitry is configured to detect the variable capacitance.

US Patent:

7825484, Nov 2, 2010

Filed:

Apr 25, 2005

Appl. No.:

11/113925

Inventors:

John R. Martin - Foxborough MA, US
Timothy J. Brosnihan - Natick MA, US
Craig Core - North Andover MA, US
Thomas Kieran Nunan - Carlisle MA, US
Jason Weigold - Somerville MA, US
Xin Zhang - Acton MA, US

Assignee:

Analog Devices, Inc. - Norwood MA

International Classification:

H01L 29/82

US Classification:

257415, 257704, 257419, 257680, 257E21235, 257E31032, 381191, 381175, 381355

Abstract:

A micromachined microphone is formed from a silicon or silicon-on-insulator (SOI) wafer. A fixed sensing electrode for the microphone is formed from a top silicon layer of the wafer. Various polysilicon microphone structures are formed above a front side of the top silicon layer by depositing at least one oxide layer, forming the structures, and then removing a portion of the oxide underlying the structures from a back side of the top silicon layer through trenches formed through the top silicon layer. The trenches allow sound waves to reach the diaphragm from the back side of the top silicon layer. In an SOI wafer, a cavity is formed through a bottom silicon layer and an intermediate oxide layer to expose the trenches for both removing the oxide and allowing the sound waves to reach the diaphragm. An inertial sensor may be formed on the same wafer, with various inertial sensor structures formed at substantially the same time and using substantially the same processes as corresponding microphone structures.

US Patent:

7863069, Jan 4, 2011

Filed:

Sep 27, 2006

Appl. No.:

11/535698

Inventors:

Jason W. Weigold - Somerville MA, US

Assignee:

Analog Devices, Inc. - Norwood MA

International Classification:

H01L 21/00

US Classification:

438 50, 438 48, 438 53

Abstract:

A method of producing an integrated MEMS resonator includes providing a substrate including single crystal silicon and partially forming a resonator in a first portion of the substrate, the resonator having a resonating element formed by the substrate and an electrode, the resonating element and the electrode forming a variable capacitor. The method also includes forming circuitry in a second portion of the substrate, the circuitry configured for detecting capacitance of the variable capacitor and finish forming the resonator and integrating the resonator with the circuitry so that the electrode is in communication with the circuitry.

US Patent:

7885423, Feb 8, 2011

Filed:

Jan 22, 2007

Appl. No.:

11/625553

Inventors:

Jason W. Weigold - Somerville MA, US

Assignee:

Analog Devices, Inc. - Norwood MA

International Classification:

H04R 25/00

US Classification:

381174, 381175

Abstract:

A microphone includes a diaphragm assembly supported by a substrate. The diaphragm assembly includes at least one carrier, a diaphragm, and at least one spring coupling the diaphragm to the at least one carrier such that the diaphragm is spaced from the at least one carrier. An insulator (or separate insulators) between the substrate and the at least one carrier electrically isolates the diaphragm and the substrate.

US Patent:

7961897, Jun 14, 2011

Filed:

Jun 28, 2006

Appl. No.:

11/476378

Inventors:

Jason W. Weigold - Somerville MA, US

Assignee:

Analog Devices, Inc. - Norwood MA

International Classification:

H04R 25/00

US Classification:

381174, 381175, 381369

Abstract:

A microphone is formed to have a diaphragm that is configured to improve signal to noise ratio. To that end, the microphone has a backplate having a hole therethrough, and a diaphragm movably coupled with the backplate. The diaphragm has a bottom surface (facing the backplate) with a convex portion aligned with the hole in the backplate.

US Patent:

8129803, Mar 6, 2012

Filed:

Jul 16, 2010

Appl. No.:

12/804213

Inventors:

John R. Martin - Foxborough MA, US
Timothy J. Brosnihan - Natick MA, US
Craig Core - North Andover MA, US
Thomas Kieran Nunan - Carlisle MA, US
Jason Weigold - Newburyport MA, US
Xin Zhang - Acton MA, US

Assignee:

Analog Devices, Inc. - Norwood MA

International Classification:

H01L 21/02
H01L 21/84

US Classification:

257415, 257416, 257E21002, 257E2932, 438 53, 438E21704, 438400, 438 48, 438 52

Abstract:

A micromachined microphone is formed from a silicon or silicon-on-insulator (SOI) wafer. A fixed sensing electrode for the microphone is formed from a top silicon layer of the wafer. Various polysilicon microphone structures are formed above a front side of the top silicon layer by depositing at least one oxide layer, forming the structures, and then removing a portion of the oxide underlying the structures from a back side of the top silicon layer through trenches formed through the top silicon layer. The trenches allow sound waves to reach the diaphragm from the back side of the top silicon layer. In an SOI wafer, a cavity is formed through a bottom silicon layer and an intermediate oxide layer to expose the trenches for both removing the oxide and allowing the sound waves to reach the diaphragm. An inertial sensor may be formed on the same wafer, with various inertial sensor structures formed at substantially the same time and using substantially the same processes as corresponding microphone structures.