James S Tonge

US Patent:

7378482, May 27, 2008

Filed:

Apr 29, 2003

Appl. No.:

10/512953

Inventors:

Karmen Karen Asch - Beaverton MI, US
Brian Douglas Chapman - Midland MI, US
Loren Dean Durfee - Midland MI, US
Robert Michael Hensel - Sanford MI, US
Timothy Paul Mitchell - Clio MI, US
James Steven Tonge - Sanford MI, US
Paul Cornelius Van Dort - Sanford MI, US
Loretta Ann Jones - Midland MI, US

Assignee:

Dow Corning Corporation - Midland MI

International Classification:

C08G 77/12

US Classification:

528 31, 528 33

Abstract:

A composition comprising (A) at least one compound having at least one aliphatic unsaturation; (B) at least one organohydrogensilicon compound containing at least one silicon-bonded hydrogen atom per molecule and (C) a platinum group metal-containing catalyst.

US Patent:

7429636, Sep 30, 2008

Filed:

Apr 29, 2003

Appl. No.:

10/512750

Inventors:

Karmen Karen Asch - Beaverton MI, US
Brian Douglas Chapman - Midland MI, US
Loren Dean Durfee - Midland MI, US
Robert Michael Hensel - Sanford MI, US
Timothy Paul Mitchell - Clio MI, US
James Steven Tonge - Sanford MI, US
Paul Cornelius Van Dort - Sanford MI, US

Assignee:

Dow Corning Corporation - Midland MI

International Classification:

C08G 77/12
C08G 77/20

US Classification:

528 31, 528 32

Abstract:

Organohydrogensilicon compounds containing at least one silicon-bonded hydrogen atom per molecule and at least one cyclosiloxane.

US Patent:

7432338, Oct 7, 2008

Filed:

Dec 17, 2003

Appl. No.:

10/538680

Inventors:

Brian Douglas Chapman - Midland MI, US
Loren Dean Durfee - Midland MI, US
Timothy Paul Mitchell - Clio MI, US
James Steven Tonge - Sanford MI, US
Paul Cornelius Vandort - Sanford MI, US

Assignee:

Dow Corning Corporation - Midland MI

International Classification:

C08G 77/12
C08G 77/20
C08G 77/04

US Classification:

528 31, 528 32, 528 33

Abstract:

This invention relates to a method comprising (1) heating in the presence of a catalyst a mixture comprising (i) at least one organohydrogensilicon compound containing at least one silicon-bonded hydrogen atom per molecule or a reaction product obtained by mixing in the presence of a platinum group metal-containing catalyst at least one organohydrogensilicon compound containing at least one silicon-bonded hydrogen atom per molecule and at least one compound having at least one aliphatic unsaturation, (ii) at least one endblocker, and optionally (iii) at least one organosiloxane chosen from a hydrolyzate or a cyclosiloxane, so to cause polymerization of components (i), (ii), and optionally (iii) to form silicon-bonded hydrogen containing branched polymers.

US Patent:

7449536, Nov 11, 2008

Filed:

Dec 17, 2003

Appl. No.:

10/538682

Inventors:

Brian Douglas Chapman - Midland MI, US
Loren Dean Durfee - Midland MI, US
Timothy Paul Mitchell - Clio MI, US
James Steven Tonge - Sanford MI, US
Paul Cornelius Vandort - Sanford MI, US

Assignee:

Dow Corning Corporation - Midland MI

International Classification:

C08G 77/00
C08G 77/04
C08G 77/12
C08G 77/08
C08G 77/06

US Classification:

528 10, 528 31, 528 37, 528 14

Abstract:

A method comprising heating in the presence of a catalyst, a mixture comprising (i) a reaction product obtained by mixing in the presence of a platinum group metal-containing catalyst at least one organohydrogensilicon compound containing at least one silicon-bonded hydrogen atom per molecule and at least one compound having at least one aliphatic unsaturation; (ii) at least one endblocker, and optionally (iii) at least one organosiloxane chosen from a hydrolyzate or a cyclosiloxane, so to cause polymerization of components (i), (ii), and optionally (iii) to form branched polymers.

US Patent:

7732543, Jun 8, 2010

Filed:

Dec 13, 2005

Appl. No.:

11/792063

Inventors:

Cheryl Lynn Loch - Ypsilanti MI, US
Dongchan Ahn - Midland MI, US
Nick Evan Shephard - Midland MI, US
James Steven Tonge - Sanford MI, US
Patricia Ann Olney - Midland MI, US

Assignee:

Dow Corning Corporation - Midland MI

International Classification:

C08F 4/52

US Classification:

526196, 526134, 526141, 526328, 526178, 502162, 502200, 502202, 564 8, 564 9

Abstract:

Curable compositions contain (i) a free radical polymerizable organosilicon monomer, oligomer or polymer; (ii) an organoborane amine complex; optionally (iii) an amine reactive compound having amine reactive groups; and optionally (iv) a component capable of generating a gas when mixed with a compound bearing active hydrogen and a catalyst. The curable compositions can be used as a rubber, tape, adhesive, foam, pressure sensitive adhesive, protective coating, thin film, thermoplastic monolithic molded part, thermosetting monolithic molded part, sealant, gasket, seal, or o-ring, die attachment adhesive, lid sealant, encapsulant, potting compound, or conformal coating. The compositions can also be used in composite articles of manufacture such as integrally bonded device including electrical and electronic connectors and scuba diving masks, in which substrates are coated or bonded together with the composition and cured.

US Patent:

8168737, May 1, 2012

Filed:

Dec 10, 2007

Appl. No.:

12/517220

Inventors:

Khristopher Edward Alvarez - Midland MI, US
Nick Evan Shephard - Midland MI, US
James Tonge - Midland MI, US

Assignee:

Dow Corning Corporation - Midland MI

International Classification:

C08G 77/08

US Classification:

528 15, 528 31, 525476

Abstract:

A polymer cures by both radiation and moisture curing mechanisms. The polymer is prepared by hydrosilylation. The polymer is useful in adhesive compositions. The polymer includes units of formulae (I), (R2Si0)b, (RSi0)c, (Si0)d, (R)f, and (R3SiO)g, where each Ris independently an oxygen atom or a divalent hydrocarbon group; each Ris independently divalent hydrocarbon group; each Ris independently a monovalent organic group that is free of terminal aliphatic unsaturation each X is independently a monovalent hydrolyzable group; each J is independently a monovalent epoxy functional organic group; subscript a has a value of 1 or more; subscript b has a value of 0 or more; subscript c has a value of 0 or more; subscript d has a value of 0 or more; subscript e has a value of 1 or more; subscript f has a value of 0 or more; subscript g has a value of 0 or more; subscript s is 1, 2, or 3; and subscript t is 1, 2, or 3.

US Patent:

8318244, Nov 27, 2012

Filed:

Dec 18, 2008

Appl. No.:

12/811772

Inventors:

Michael Brasseur - Saginaw MI, US
Karen Hueston - Midland MI, US
James Tonge - Sanford MI, US

Assignee:

Dow Corning Corporation - Midland MI

International Classification:

B05D 1/38

US Classification:

427146, 427147, 427152, 427256, 427258, 427270, 427271, 427272, 427279, 427282, 427387

Abstract:

A method for fabricating electronic devices includes the steps of 1) printing a multi-layer electronic device on a silicone-based hard coating on a substrate, and 2) removing the device from the substrate. The silicone-based hard coating is an abrasion resistant coating with hardness ranging from 1 to 10 gigaPascals.

US Patent:

8405233, Mar 26, 2013

Filed:

Jan 13, 2010

Appl. No.:

13/144362

Inventors:

John Blizzard - Bay City MI, US
James Steven Tonge - Sanford MI, US
William Kenneth Weidner - Bay City MI, US

Assignee:

Dow Corning Corporation - Midland MI

International Classification:

H01L 23/29

US Classification:

257788, 257789, 257790, 257E23117, 257E23126

Abstract:

A flexible barrier film has a thickness of from greater than zero to less than 5,000 nanometers and a water vapor transmission rate of no more than 1×10g/m/day at 22 C. and 47% relative humidity. The flexible barrier film is formed from a composition, which comprises a multi-functional acrylate. The composition further comprises the reaction product of an alkoxy-functional organometallic compound and an alkoxy-functional organosilicon compound. A method of forming the flexible barrier film includes the steps of disposing the composition on a substrate and curing the composition to form the flexible barrier film. The flexible barrier film may be utilized in organic electronic devices.