Howard A Berg

US Patent:

57563802, May 26, 1998

Filed:

Nov 2, 1995

Appl. No.:

8/556782

Inventors:

Howard M. Berg - Scottsdale AZ
Sankaranarayanan Ganesan - Chandler AZ
Gary L. Lewis - Peoria AZ
George W. Hawkins - Gilbert AZ
James W. Sloan - Austin TX
Scott C. Bolton - Austin TX

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 2160

US Classification:

438126

Abstract:

A method for making moisture resistant semiconductor devices having organic substrates targets each of the potentially critical interfaces within a semiconductor device having the potential for delamination and cracking. An organic substrate (110) is designed to include a solid pad (116) having a chemically created oxide layer (118) formed thereon. A silicone-based die attach material (108) is dispensed and gelled very soon after dispensing to prevent excessive bleed. A semiconductor die (102) is mounted to the substrate after undergoing a cleaning operation to remove contaminants from the backside of the die. Prior to molding compound encapsulation and subsequent to die attach material cure, the substrate is cleaned to improve adhesion to the die attach material fillet (122). In practicing these operations, the following interfaces are targeted and their adhesion characteristics are improved: die attach material to die pad; die attach material to die; molding compound to die pad; and molding compound to die attach material.

US Patent:

53858697, Jan 31, 1995

Filed:

Jul 22, 1993

Appl. No.:

8/094735

Inventors:

Jay J. Liu - Chandler AZ
Howard M. Berg - Scottsdale AZ
George W. Hawkins - Mesa AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 2160

US Classification:

437209

Abstract:

A semiconductor chip is flip chip bonded to a substrate having a cavity or a through hole formed therein. The cavity or through hole is preferably large enough to substantially remove the narrow gap which is formed between the portion of the substrate which does not have the cavity or through hole formed therein. This allows for use of mold processes to encapsulate and underfill the semiconductor chip and for line of sight cleaning of the semiconductor chip after bonding.

US Patent:

43994539, Aug 16, 1983

Filed:

Mar 23, 1981

Appl. No.:

6/246506

Inventors:

Howard M. Berg - Scottsdale AZ
Gary L. Lewis - Peoria AZ
Curtis W. Mitchell - Phoenix AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 2302
H01L 2714
H01L 3300

US Classification:

357 81

Abstract:

A package for fiber optic semiconductor devices is disclosed in which heat is conducted by both a heat spreader and through a plastic enclosure portion of the package.

US Patent:

55545696, Sep 10, 1996

Filed:

Jun 6, 1994

Appl. No.:

8/254842

Inventors:

Sankaranarayanan Ganesan - Chandler AZ
Howard M. Berg - Scottsdale AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 2160

US Classification:

437207

Abstract:

A leadframe (11) and a method for improving adhesion of a polymer (17, 19) to the leadframe (11). The leadframe (11) has a flag (14) having a top surface (15) and a bottom surface (18), and leads (12). Microscopic locking features (31) are formed in the top surface (15) and the bottom surface (18) of flag (14) by bombarding the flag (14) with a grit material. Thus, the top and bottom surfaces (14, 18) are roughened. A semiconductor die (13) is attached to the flag (14) by a die attach material (17) and the flag (13), the semiconductor material (13), and portions of the leads (12) are encapsulated by a molding compound. The pits improve the adhesion of the die attach material (17) and the molding compound (19) to the leadframe (11).

US Patent:

52756670, Jan 4, 1994

Filed:

May 4, 1992

Appl. No.:

7/878067

Inventors:

Sankaranarayanan Ganesan - Scottsdale AZ
Shun-Meen Kuo - Chandler AZ
Howard M. Berg - Scottsdale AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

B08B 310

US Classification:

134 1

Abstract:

A fast and simple method of determining a desired level of cleanliness of an inorganic surface is performed by correlating a level of cleanliness of many inorganic surfaces having varying thicknesses of organic contamination with reliability tests. The level of cleanliness is in terms of a measurement from a water drop test. The level of cleanliness between two inorganic surfaces can also be compared by utilizing the combination of a UV/ozone clean and the level of cleanliness to determine the relative amount of contamination present on one inorganic surface as compared to the other.

US Patent:

46538470, Mar 31, 1987

Filed:

Feb 23, 1981

Appl. No.:

6/237177

Inventors:

Howard M. Berg - Scottsdale AZ
Curtis W. Mitchell - Phoenix AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

G02B 642

US Classification:

350 9620

Abstract:

A semiconductor package for use in fiber optics systems is disclosed wherein optical performance is enhanced by a lens between a fiber segment and the photoactive area of the semiconductor. The lens is spaced a predetermined distance from the fiber by a layer of elastomer. During assembly of the package, the fiber provides a convenient means for handling the lens.

US Patent:

46473319, Mar 3, 1987

Filed:

Sep 24, 1984

Appl. No.:

6/653490

Inventors:

Daniel N. Koury - Scottsdale AZ
Howard M. Berg - Scottsdale AZ
David W. Stevenson - Mesa AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

B32B 3126

US Classification:

1562739

Abstract:

An assembly method is described in which low level light is used to align an optical fiber to the emitting area of an LED. When alignment is achieved, the power dissipated by the LED is increased to gel or partially cure an adhesive, thereby securing the aligned fiber to the LED.

US Patent:

43291902, May 11, 1982

Filed:

Jun 6, 1979

Appl. No.:

6/045903

Inventors:

Howard M. Berg - Scottsdale AZ
Gary L. Lewis - Peoria AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

G02B 726
H01L 3112

US Classification:

156 60

Abstract:

A process is described for attaching optical fiber to a semiconductor die in which a first droplet of adhesive is applied to the die and partially gelled to form a cushion for receiving the end of the optical fiber to be attached thereto.