Hassan Iravani

US Patent:

8284560, Oct 9, 2012

Filed:

Nov 11, 2009

Appl. No.:

12/616761

Inventors:

Hassan G. Iravani - San Jose CA, US
Ingemar Carlsson - Milpitas CA, US
Boguslaw A. Swedek - Cupertino CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

H05K 7/00

US Classification:

361760, 324100, 324229, 324242, 324243, 324662, 702104, 702105, 451 5, 451 6, 451 10, 451 11

Abstract:

An apparatus for monitoring the thickness of a conductive layer on a substrate includes a support to hold a substrate having a conductive layer, an eddy current monitoring system including a first plurality of core portions, and a motor to cause relative motion between the support and the eddy current monitoring system such that the substrate moves across the first plurality of core portions in a direction that defines a first axis. At least one core portion is positioned further from a second axis than at least two other core portions. The second axis is orthogonal to the first axis.

US Patent:

20110189856, Aug 4, 2011

Filed:

Jan 26, 2011

Appl. No.:

13/014558

Inventors:

Kun Xu - Sunol CA, US
Hassan G. Iravani - San Jose CA, US
Boguslaw A. Swedek - Cupertino CA, US
Yuchun Wang - Santa Clara CA, US
Wen-Chiang Tu - Mountain View CA, US

International Classification:

H01L 21/306
B24B 49/10

US Classification:

438692, 451 5, 257E2123

Abstract:

A method of chemical mechanical polishing a metal layer on a substrate includes polishing the metal layer on the substrate at first and second polishing stations, monitoring thickness of the metal layer during polishing at the first and second polishing station with first and second eddy current monitoring systems having different resonant frequencies, and controlling pressures applied by a carrier head to the substrate during polishing at the first and second polishing stations to improve uniformity based on thickness measurements from the first and second eddy current monitoring systems.

US Patent:

20110189925, Aug 4, 2011

Filed:

Jan 24, 2011

Appl. No.:

13/012692

Inventors:

Hassan G. Iravani - San Jose CA, US
Kun Xu - Sunol CA, US
Boguslaw A. Swedek - Cupertino CA, US
Yuchun Wang - Santa Clara CA, US
Wen-Chiang Tu - Mountain View CA, US

International Classification:

B24B 49/00

US Classification:

451 5

Abstract:

An apparatus for chemical mechanical polishing includes a platen having a surface to support a polishing pad, and an eddy current monitoring system to generate an eddy current signal. The eddy current monitoring system includes a core and a coil wound around a portion of the core. The core includes a back portion, a first prong extending from the back portion in a first direction normal to the surface of the platen and having a width in a second direction parallel to the surface of the platen, and second and third prongs extending from the back portion in parallel with the first protrusion, the second and third prongs positioned on opposite sides of and equidistant from the first prong. A spacing between each of the second and third prongs and the first prong is approximately equal to twice the width of the first prong.

US Patent:

20120276661, Nov 1, 2012

Filed:

Apr 27, 2011

Appl. No.:

13/095818

Inventors:

Hassan G. Iravani - San Jose CA, US
Kun Xu - Sunol CA, US
Boguslaw A. Swedek - Cupertino CA, US
Ingemar Carlsson - Milpitas CA, US
Wen-Chiang Tu - Mountain View CA, US

International Classification:

H01L 21/66
B24B 51/00

US Classification:

438 10, 451 5, 257E21528

Abstract:

A method of chemical mechanical polishing a substrate includes polishing a metal layer on the substrate at a polishing station, monitoring thickness of the metal layer during polishing at the polishing station with an eddy current monitoring system, and controlling pressures applied by a carrier head to the substrate during polishing of the metal layer at the polishing station based on thickness measurements of the metal layer from the eddy current monitoring system to reduce differences between an expected thickness profile of the metal layer and a target profile, wherein the metal layer has a resistivity greater than 700 ohm Angstroms.

US Patent:

20120276662, Nov 1, 2012

Filed:

Apr 27, 2011

Appl. No.:

13/095819

Inventors:

Hassan G. Iravani - San Jose CA, US
Kun Xu - Sunol CA, US
Boguslaw A. Swedek - Cupertino CA, US
Ingemar Carlsson - Milpitas CA, US
Wen-Chiang Tu - Mountain View CA, US
David Maxwell Gage - Sunnyvale CA, US

International Classification:

H01L 21/66

US Classification:

438 10, 257E21528

Abstract:

A method of chemical mechanical polishing a substrate includes polishing a plurality of discrete separated metal features of a layer on the substrate at a polishing station, using an eddy current monitoring system to monitor thickness of the metal features in the layer, and controlling pressures applied by a carrier head to the substrate during polishing of the layer at the polishing station based on thickness measurements of the metal features from the eddy current monitoring system to reduce differences between an expected thickness profile of the metal feature and a target profile.

US Patent:

20120276817, Nov 1, 2012

Filed:

Apr 27, 2011

Appl. No.:

13/095822

Inventors:

Hassan G. Iravani - San Jose CA, US
Kun Xu - Sunol CA, US
Boguslaw A. Swedek - Cupertino CA, US
Ingemar Carlsson - Milpitas CA, US
Wen-Chiang Tu - Mountain View CA, US
David Maxwell Gage - Sunnyvale CA, US
James C. Wang - Saratoga CA, US

International Classification:

B24B 1/00

US Classification:

451 8

Abstract:

A method of chemical mechanical polishing a substrate includes polishing a metal layer on the substrate at a polishing station, monitoring thickness of the metal layer during polishing at the polishing station with an eddy current monitoring system, and halting polishing when the eddy current monitoring system indicates that residue of the metal layer is removed from an underlying layer and a top surface of the underlying layer is exposed.

US Patent:

58473700, Dec 8, 1998

Filed:

Apr 20, 1995

Appl. No.:

8/425995

Inventors:

David L. Sluka - Milpitas CA
Hassan Iravani - San Jose CA
Robert A. Sprenger - late of Felton CA

Assignee:

Nordson Corporation - Westlake OH

International Classification:

H05B 610

US Classification:

219635

Abstract:

The side seam of a can is coated and heated inductively by passing it through a medium frequency, oscillating magnetic field generated by an induction coil wound around a core. The core is shaped and oriented so as to have two magnetically opposite poles direct magnetic flux in a concentrated manner from the coil into the side seams of cans traveling along a path of travel. The cores are constructed using individual laminations of high frequency core material, each less than about 0. 006 inches thick, individually insulated from each other and bound together to form a U- or E-shaped core directing flux toward the workpiece. The induction coil is constructed using a form of Litz wire and the coil and core are air-cooled. In one embodiment, the core has a plurality of pole pieces each directed toward the path of travel. The induction coil is wound on the core such that sequential ones of the pole pieces along the path of travel have alternatingly magnetically opposite polarities.

US Patent:

20210379723, Dec 9, 2021

Filed:

Sep 26, 2018

Appl. No.:

17/280163

Inventors:

- Santa Clara CA, US
David Maxwell Gage - Sunnyvale CA, US
Harry Q. Lee - Los Altos CA, US
Denis Anatolyevich Ivanov - St. Petersburg, RU
Hassan G. Iravani - Sunnyvale CA, US
Doyle E. Bennett - Santa Clara CA, US
Kiran Lall Shrestha - San Jose CA, US

International Classification:

B24B 37/013
H01L 21/66

Abstract:

A method of compensating for a contribution of conductivity of the semiconductor wafer to a measured trace by an in-situ electromagnetic induction monitoring system includes storing or generating a modified reference trace. The modified reference trace represents measurements of a bare doped reference semiconductor wafer by an in-situ electromagnetic induction monitoring system as modified by a neutral network. The substrate is monitored with an in-situ electromagnetic induction monitoring system to generate a measured trace that depends on a thickness of the conductive layer, and at least a portion of the measured trace is applied to a neural network to generate a modified measured trace. An adjusted trace is generated, including subtracting the modified reference trace from the modified measured trace.