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George M Jordhamo

age ~64

from Hopewell Junction, NY

Also known as:
  • Kate Jordhamo
  • Michael Jordhamo
  • George Jordham
  • George O
Phone and address:
14 Hollyberry Dr, East Fishkill, NY 12533
845-226-6365

George Jordhamo Phones & Addresses

  • 14 Hollyberry Dr, Hopewell Jct, NY 12533 • 845-226-6365 • 845-226-5968
  • Hopewell Junction, NY
  • 9554 Ironstone Ter APT 102, Naples, FL 34120 • 239-234-6406
  • Chicago, IL
  • Wappingers Falls, NY
  • Poughkeepsie, NY
  • 14 Hollyberry Dr, Hopewell Jct, NY 12533 • 845-264-4486

Work

  • Company:
    Ibm
    Jan 2012
  • Position:
    Functional manager, wafer bumping and 3d/3di

Education

  • Degree:
    MS
  • School / High School:
    Lehigh University
    1982 to 1984
  • Specialities:
    Polymer Science & Engineering

Skills

Semiconductors • Manufacturing • Six Sigma • Process Engineering • Engineering Management • Cross Functional Team Leadership • Engineering • Characterization • Design of Experiments • Semiconductor Industry • R&D • Root Cause Analysis • Electronics • Failure Analysis • Thin Films • Program Management • Integration • Project Management • Process Simulation • Spc • Cmos • Lean Manufacturing • Ic • Testing • Technical Leadership • Product Management • Business Process Improvement • Materials Science • Materials • Process Control • Strategy • Debugging • Start Ups • Wafer Fab • Pmp • Process Integration • Perl • Project Planning • Building Organizational Capability • Yield

Ranks

  • Certificate:
    Project Management

Interests

Coach • Soccer • Referee • Golf • Fishing

Emails

g***1@aol.com

Industries

Semiconductors

Us Patents

  • Blends Of Hydroxystyrene Polymers For Use In Chemically Amplified Positive Resist Formulations

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  • US Patent:
    6365321, Apr 2, 2002
  • Filed:
    Apr 13, 1999
  • Appl. No.:
    09/291389
  • Inventors:
    Kuang-Jung Chen - Poughkeepsie NY
    Ronald Anthony DellaGuardia - Poughkeepsie NY
    Hiroshi Ito - San Jose CA
    George Michael Jordhamo - Hopewell Junction NY
    Ahmad Dauod Katnani - Poughkeepsie NY
  • Assignee:
    International Business Machines Corporation - Armonk NY
  • International Classification:
    G03F 7004
  • US Classification:
    4302701, 430905, 430910
  • Abstract:
    A photoresist binder composition comprising a homogeneous blend of (i) a hydroxystyrene copolymer comprising a first monomer that is optionally substituted hydroxystyrene and a second monomer containing an acid labile group, preferably pendant to the polymer backbone, and (ii) and a phenolic polymer, that is optionally partially or wholly protected, such as polyhydroxystyrene, poly(hydroxystyrene-co-styrene), poly(hydroxystyrene-co-styrene-co-t-butyl acrylate), novolac, and the like. Also provided is a lithographic resist composition comprising the homogeneous blend of the photoresist binder composition, and a radiation-sensitive acid generator which generates an acid upon exposure to radiation, and a process for using the resist composition to generate resist images on a substrate, such as in the manufacture of integrated circuits or the like.
  • High Resolution Photoresist Compositions

    view source
  • US Patent:
    20030003391, Jan 2, 2003
  • Filed:
    Feb 8, 2001
  • Appl. No.:
    09/778365
  • Inventors:
    George Barclay - Jefferson MA, US
    Robert Heumann - Mendon MA, US
    Edward Rutter - Franklin MA, US
    Jung-Kuang Chen - Poughkeepsie NY, US
    Margaret Lawson - LaGrangeville NY, US
    George Jordhamo - Hopewell Junction NY, US
    Timothy Hughes - marlboro NY, US
    Wayne Moreau - Wappingers Falls NY, US
    Ann Mewherter - Austin TX, US
  • Assignee:
    Shipley Company, L.L.C. - Marlborough MA
  • International Classification:
    G03F007/038
  • US Classification:
    430/270100, 430/311000
  • Abstract:
    The invention provides photoresists and resist preparative methods. Methods of the invention include treatment of a resist resin with methylene chloride or other organic solvent to remove low molecular weight materials. It has been found that the treated resin can be formulated into resists that provide manufactured electronic devices with significantly reduced defects.
  • Resist Composition And Process Of Forming A Patterned Resist Layer On A Substrate

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  • US Patent:
    62108565, Apr 3, 2001
  • Filed:
    Jan 27, 1999
  • Appl. No.:
    9/238823
  • Inventors:
    Qinghuang Lin - Wappingers Falls NY
    Timothy M. Hughes - Marlboro NY
    George M. Jordhamo - Hopewell Junction NY
    Ahmad D. Katnani - Poughkeepsie NY
    Wayne M. Moreau - Wappingers Falls NY
    Niranjan Patel - Fremont CA
  • Assignee:
    International Business Machines Corporation - Armonk NY
  • International Classification:
    G03C 1725
    G03F 7004
  • US Classification:
    4302701
  • Abstract:
    A radiation sensitive resist composition exhibiting high resolution and enhanced etch resistance comprising a silicon containing polymeric additive, a non-silicon containing base polymer, a photoacid generator and a base is provided. A method of forming a patterned resist film is also provided. A resist film having an upper surface region enriched with silicon is also disclosed.
  • Cross-Hatch Flow Distribution And Applications Thereof

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  • US Patent:
    50160907, May 14, 1991
  • Filed:
    Mar 21, 1990
  • Appl. No.:
    7/496838
  • Inventors:
    George T. Galyon - Fishkill NY
    George M. Jordhamo - Wappingers Falls NY
    Kevin P. Moran - Wappingers Falls NY
    Michael L. Zumbrunnen - Poughkeepsie NY
  • Assignee:
    International Business Machines Corporation - Armonk NY
  • International Classification:
    H02B 100
    G06F 100
    H01L 2346
  • US Classification:
    357 82
  • Abstract:
    A cold plate and an integrated circuit cooling module embodying a cross-hatch coolant flow distribution scheme. Cross hatch flow distribution is achieved by way of two sets of channels which run perpendicular to each other. The first set of channels is formed on a base plate. The second, perpendicular set is includes a set of inlet channels and a set of interleaved outlet channels formed on a distribution plate. In the preferred embodiment, the base and distribution plates are separated by an interposer plate that has nozzles which cause a liquid coolant to impinge, under pressure, on the floor of the base plate.
  • Continuous Anodizing Of A Cylindrical Aluminum Surface

    view source
  • US Patent:
    51511690, Sep 29, 1992
  • Filed:
    Dec 6, 1991
  • Appl. No.:
    7/802792
  • Inventors:
    George T. Galyon - Fishkill NY
    George M. Jordhamo - Wappingers Falls NY
    Louis H. Wirtz - Highland NY
  • Assignee:
    International Business Machines Corp. - Armonk NY
  • International Classification:
    C25D 1104
    C25D 1700
  • US Classification:
    205151
  • Abstract:
    A method and apparatus in which an aluminum-clad copper pin-piston is supported on the upper surface of a roller or a pair of rollers. As the roller rotates, it rotates the pin-piston and the surface of the roller carries an electrolyte. The positive side of a power supply is connected to the pin-piston and the negative side of the supply is coupled to the roller surface via the electrolyte bath. Anodizing current passes from the rotating roller to the rotating pin-piston via the electrolyte, which is continuously replenished. An anodized film forms on the aluminum surface of the pin-piston. Oxide growth rate and film thickness are controlled by controlling the current density and the duration of pin-piston contact with the charged roller.
  • Structure And Process For Electro/Mechanical Joint Formation

    view source
  • US Patent:
    54545064, Oct 3, 1995
  • Filed:
    Mar 1, 1994
  • Appl. No.:
    8/204117
  • Inventors:
    George M. Jordhamo - Wappingers Falls NY
    Louis H. Wirtz - Calverton NY
  • Assignee:
    International Business Machines Corporation - Armonk NY
  • International Classification:
    B23K 2010
    H01R 402
  • US Classification:
    2281101
  • Abstract:
    A bonding method joins together a plurality of conductively coated polymers in a single operation. The method employs heat generation via a high energy source, whose output is focused by an energy director which causes fusing of the polymer surfaces along with fusing of the metal surfaces at their respective interfaces to form a robust electrical and mechanical bond.
  • Input Output Connector With Coaxial Shielding And Strain Relief

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  • US Patent:
    51220652, Jun 16, 1992
  • Filed:
    Aug 12, 1991
  • Appl. No.:
    7/743633
  • Inventors:
    Thomas J. Dudek - Poughkeepsie NY
    George M. Jordhamo - Wappingers Falls NY
    Basil D. Washo - Poughkeepsie NY
  • Assignee:
    International Business Machines Corp. - Armonk NY
  • International Classification:
    H01R 13648
  • US Classification:
    439 76
  • Abstract:
    A connector for terminating wires and cables is constructed of two mating thermoplastic members. One of the members carries a pattern of conductive material which forms edge contact pads, signal lines, ground lines and a ground buss interconnecting all ground lines. The other thermoplastic member is formed to include a series of ribs that parallel and contact the ground lines and ground buss. The surface of the thermoplastic member carrying the ribs and the ribs are plated with a copper layer and when assembled with the mating member forms grounded tunnel-like passages enclosing the signal lines and into which the signal conductors of the wires or cables extend to terminate on the signal lines.
  • Use Of Semi-Interpenetrating Polymer Networks For Cable/Fiber Retention

    view source
  • US Patent:
    55473962, Aug 20, 1996
  • Filed:
    Oct 4, 1994
  • Appl. No.:
    8/319180
  • Inventors:
    George M. Jordhamo - Wappingers Falls NY
  • Assignee:
    International Business Machines Corporation - Armonk NY
  • International Classification:
    H01R 1358
  • US Classification:
    439604
  • Abstract:
    A device and a method which utilizes semi-interpenetrating polymer networks for strain relief of fiber or cable. The need for adhesives and mechanical means for cable or fiber retention is eliminated while performance and reliability is enhanced. In one embodiment a first polymer network is fabricated in an undersized plug which is in turn placed inside a hollow connector housing with an open end and at least one aperture for a cable to pass through. The void created between the plug and the connector shell is then subsequently filled by adding a second polymer to fill the unit. The unit is then placed in a curing chamber so that the polymer can swell and completely fill any voids between the plug and the connector shell.

Resumes

George Jordhamo Photo 1

Senior Director, Fab8 Facilities

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Location:
14 Hollyberry Dr, Hopewell Junction, NY 12533
Industry:
Semiconductors
Work:
IBM since Jan 2012
Functional Manager, Wafer Bumping and 3D/3Di

IBM Feb 2000 - Jan 2012
Engineering Manager

IBM Feb 1995 - Feb 2000
Photoresist Development Manager

IBM 1984 - 2000
Materials Engineer
Education:
Lehigh University 1982 - 1984
MS, Polymer Science & Engineering
Eastern Connecticut State University 1978 - 1982
BS, Chemistry/Biology
Skills:
Semiconductors
Manufacturing
Six Sigma
Process Engineering
Engineering Management
Cross Functional Team Leadership
Engineering
Characterization
Design of Experiments
Semiconductor Industry
R&D
Root Cause Analysis
Electronics
Failure Analysis
Thin Films
Program Management
Integration
Project Management
Process Simulation
Spc
Cmos
Lean Manufacturing
Ic
Testing
Technical Leadership
Product Management
Business Process Improvement
Materials Science
Materials
Process Control
Strategy
Debugging
Start Ups
Wafer Fab
Pmp
Process Integration
Perl
Project Planning
Building Organizational Capability
Yield
Interests:
Coach
Soccer
Referee
Golf
Fishing
Certifications:
Project Management
George Washington University

Youtube

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