Edward O Daigle

US Patent:

20080190770, Aug 14, 2008

Filed:

Apr 26, 2005

Appl. No.:

11/587802

Inventors:

Edward O. Daigle - Covington LA, US
Pankaj Gupta - Minnetonka MN, US
Gregory J. Tenhundfeld - Baton Rouge LA, US

Assignee:

CAP TECHNOLOGIES, LLC - Baton Rouge LA

International Classification:

B01D 57/00

US Classification:

204554, 204672

Abstract:

A process for the treatment and/or removal from Condenser of contaminants from a waste water, waste stream, industrial or municipal sludge, metals, oils, organics and other materials consider to be harmful to the environment are removed from the feed stock; in the case of non-metals, mineralized and in the case of metals, plated to the cathode. The present invention provides an apparatus and methods which overcome some of the problems associated with the treatment of wastewater and sludge and offers a new, novel approach to the treatment of waste, by employing the use of electroplasma processing which utilizes aspects of ultraviolet blue light, thermal energy, cavitation, flocculation, aeration, and electrical energy. The ability to control flow rates, energy density, cavitation density, aeration density and heat generation within the system offers a new level of control over different materials for treatment of waste, contaminants or metals within the same process and apparatus.

US Patent:

20140017915, Jan 16, 2014

Filed:

Jul 12, 2013

Appl. No.:

13/941321

Inventors:

Mateusz Szczesiak - Rego Park NY, US
Jason Herman - East Northport NY, US
Edward Daigle - Covington LA, US

Assignee:

CAP Technologies, LLC - Baton Rouge LA
HONEYBEE ROBOTICS LTD. - NEW YORK NY

International Classification:

H01R 13/648

US Classification:

439 95

Abstract:

An electrical grounding system has a frame containing one or more line component subassemblies supporting multiple lines of conductive material traveling linearly in parallel in a horizontal direction, and one or more preload subassemblies positioned in a vertical direction above the respective line component subassemblies. The line component subassembly has an array of grounding contact rollers positioned below and supporting the respective lines of conductive material traveling in electrical contact thereon. The preload subassembly has an array of preload rollers positioned above and applying a preload force to the respective lines of conductive material in electrical contact with the rollers of the line component subassembly below.