Douglas Jason Olsen

US Patent:

6545494, Apr 8, 2003

Filed:

Jul 10, 2000

Appl. No.:

09/612667

Inventors:

Douglas S. Olsen - Natick MA
David Stura - North Billerica MA

Assignee:

Temptronic Corporation - Sharon MA

International Classification:

G01R 3102

US Classification:

324760, 324 731

Abstract:

An apparatus and method for controlling temperature in a wafer on a wafer chuck includes a temperature sensing device, such as a temperature sensitive diode, integrally formed in the wafer. A sensing circuit senses a signal from the diode indicative of temperature of the wafer. The sensing circuit can be part of a testing circuit in a wafer prober being used to test integrated circuits on the wafer. The sensing circuit sends a control signal to a temperature control system used to control the temperature of the chuck. In response to the control signal, the temperature control system controls the temperature of the chuck at a desired temperature to control the temperature of the wafer. The wafer can include multiple integrated circuit die, and each circuit can include its own temperature sensing diode. As a result, extremely accurate and individualized temperature testing can be performed on each integrated circuit on the wafer.

US Patent:

6552561, Apr 22, 2003

Filed:

Apr 20, 2001

Appl. No.:

09/839274

Inventors:

Douglas S. Olsen - Natick MA
David Stura - North Billerica MA

Assignee:

Temptronic Corporation - Sharon MA

International Classification:

G01R 3102

US Classification:

324760, 324 731

Abstract:

An apparatus and method for controlling temperature in a device under test (DUT) having an integrated circuit chip die includes a temperature sensing device, such as a temperature sensitive diode, integrally formed in the chip die. A sensing circuit senses a signal from the diode indicative of temperature of the chip die. The sensing circuit can be part of a testing circuit in a system being used to test the DUT. The sensing circuit sends a control signal to a temperature control system used to control the temperature of a DUT temperature control medium. The temperature control medium can be, for example, a stream of temperature-controlled air directed onto the package of the DUT. In response to the control signal, the temperature control system controls the temperature of the air at a desired temperature to control the temperature of the DUT.

US Patent:

6700099, Mar 2, 2004

Filed:

Jul 6, 2001

Appl. No.:

09/900285

Inventors:

William M. Stone - Lennox MA
Douglas S. Olsen - Natick MA

Assignee:

Temptronic Corporation - Sharon MA

International Classification:

H01B 368

US Classification:

2194441, 118724

Abstract:

A workpiece chuck to support a semiconductor wafer during processing includes a thermal plate assembly which includes both heating and cooling capability. The heating element can be a resistive heater in a coiled configuration disposed in a plane. The cooling can be performed via a cooling fluid circulated through cooling tubes which are also disposed in a coiled configuration in a plane. The plane of the heating element and the cooling tubes can be the same plane, and that plane can be a center plane of the thermal plate assembly. The heating element and cooling tubes are coiled in an interleaved fashion to provide uniform heating and cooling while allowing them to simultaneously occupy the same plane. The thermal plate assembly can include a housing made of a cast material such as aluminum. The chuck also provides for interchangeable top surface assemblies used to support the workpiece chuck.

US Patent:

6866094, Mar 15, 2005

Filed:

May 15, 2001

Appl. No.:

09/858185

Inventors:

Shawn M. Cousineau - Hopkinton MA, US
Robert D. Kelso - Bridgewater MA, US
Douglas S. Olsen - Natick MA, US
David Stura - North Billerica MA, US

Assignee:

Temptronic Corporation - Sharon MA

International Classification:

H01L021/00
H01L021/68
F25B029/00
B23Q003/08
F28F027/02

US Classification:

165278, 165206, 165 481, 165 61, 165263, 165 804, 165 63, 165 64, 324760, 359395, 430329, 430330, 118724, 118725, 15634552, 15634553, 15634529

Abstract:

A system and method for controlling temperature in a workpiece chuck are described. A fluid circulation system circulates a temperature control fluid, such as an engineered HFE fluid, through te workpiece chuck. A fluid recovery system coupled to the fluid circulation system recovers a portion of the temperature control fluid from the fluid circulation system by circulating a gas through the fluid circulation system including fluid tubes and fluid passages in the chuck. The gas, which can be air, carries a portion of residual or excess fluid through the fluid circulation system as it is circulated. The residual fluid is carried back to a reservoir such that it can continue to be used to control temperature of the chuck. Where gas and temperature control fluid vapors are displaced from the reservoir, they are routed through a suction line heat exchanger which condenses the vapor. The gas and condensed fluid are separated in a fluid separator.

US Patent:

20050217583, Oct 6, 2005

Filed:

Jun 7, 2005

Appl. No.:

11/146959

Inventors:

Kenneth Cole - Holliston MA, US
William Stone - Lenox MA, US
Douglas Olsen - Natick MA, US

International Classification:

C23C016/00

US Classification:

118724000, 156345270, 156345520, 156345530

Abstract:

A workpiece chuck includes a thermal plate assembly which includes both heating and cooling capability. The heating element can be a resistive heater in a coiled configuration disposed in a plane. The cooling can be performed via a cooling fluid circulated through cooling tubes which are also disposed in a coiled configuration in a plane. The plane of the heating element and the cooling tubes can be the same plane, and that plane can be a center plane of the thermal plate assembly. By locating the heating and cooling in the same plane, uniform heating and cooling are achieved. Also, by locating the heating element and cooling tubes in the center of the thermal plate, distortions such as doming and dishing in the thermal plate are eliminated such that the wafer can be held extremely flat on the chuck. The heating element and cooling tubes are coiled in an interleaved fashion to provide uniform heating and cooling while allowing them to simultaneously occupy the same plane.

US Patent:

20200300247, Sep 24, 2020

Filed:

Jun 1, 2020

Appl. No.:

16/889055

Inventors:

- Marlborough MA, US
Douglas S. Olsen - Natick MA, US

Assignee:

ASPEN COMPRESSOR, LLC - Marlborough MA

International Classification:

F04C 29/06
F04C 18/356
F04C 29/00

Abstract:

The present disclosure relates to a low noise, compact rotary compressor configured to damp noise and vibration generated from internal components. The compressor may include a stator holder coupled to the stator and the pump, providing physical separation between the stator and the casing. The compressor may also include a pump holder coupled to the pump and the casing, providing physical separation between the pump and the casing. Additional damping components may be placed at various coupling points within and around the stator holder and/or pump holder. The suction line connection may also be configured to reduce noise and vibration. Aspects of the present disclosure may be applicable for reducing the noise and vibration in a number of fluid displacement devices and BLDC motors.

US Patent:

20190338772, Nov 7, 2019

Filed:

Dec 29, 2017

Appl. No.:

16/474709

Inventors:

- Marlborough MA, US
Douglas S. Olsen - Natick MA, US

Assignee:

ASPEN COMPRESSOR, LLC - Marlborough MA

International Classification:

F04C 15/00
F04C 2/00
H02K 7/02

Abstract:

Aspects described herein relate generally to rotary compressors that incorporate a flywheel within to significantly reduce the compressor vibration and drive torque ripples as well as to achieve a higher overall electro-mechanical efficiency and potentially lower combined costs of BLDC rotary compressors and their drive electronics.

US Patent:

20160305431, Oct 20, 2016

Filed:

Dec 1, 2014

Appl. No.:

15/100876

Inventors:

- Marlborough MA, US
Douglas S. Olsen - Natick MA, US

Assignee:

ASPEN COMPRESSOR, LLC - Marlborough MA

International Classification:

F04C 29/06
F04C 29/00
F04C 18/356

Abstract:

The present disclosure relates to a low noise, compact rotary compressor configured to damp noise and vibration generated from internal components. The compressor may include a stator holder coupled to the stator and the pump, providing physical separation between the stator and the casing. The compressor may also include a pump holder coupled to the pump and the casing, providing physical separation between the pump and the casing. Additional damping components may be placed at various coupling points within and around the stator holder and/or pump holder. The suction line connection may also be configured to reduce noise and vibration. Aspects of the present disclosure may be applicable for reducing the noise and vibration in a number of fluid displacement devices and BLDC motors.