Densen B Cao

US Patent:

6465961, Oct 15, 2002

Filed:

Aug 24, 2001

Appl. No.:

09/939340

Inventors:

Densen Cao - Sandy UT

Assignee:

Cao Group, Inc. - Sandy UT

International Classification:

B60Q 102

US Classification:

315 58, 362 831, 362235

Abstract:

A semiconductor light source for illuminating a physical space has been invented. In various embodiments of the invention, a semiconductor such as and LED chip, laser chip, LED chip array, laser array, an array of chips, or a VCSEL chip is mounted on a heat sink. The heat sink may have multiple panels for mounting chips in various orientations. The chips may be mounted directly to a primary heat sink which is in turn mounted to a multi-panel secondary heat sink. A TE cooler and air circulation may be provided to enhance heat dissipation. An AC/DC converter may be included in the light source fitting.

US Patent:

6498108, Dec 24, 2002

Filed:

Feb 12, 2001

Appl. No.:

09/782343

Inventors:

Densen Cao - Sandy UT
Becky Losee - Lehi UT

Assignee:

Fairchild Semiconductor Corporation - South Portland ME

International Classification:

H01L 21302

US Classification:

438706, 438720, 134 1

Abstract:

A method for removing contaminants on a semiconductor substrate is disclosed. In one embodiment, the method includes forming a dielectric structure on the semiconductor substrate. A portion of an electrically conducting region to a side of the dielectric structure is etched, and a conductive material is deposited on the etched electrically conducting region.

US Patent:

6634770, Oct 21, 2003

Filed:

Aug 24, 2001

Appl. No.:

09/938876

Inventors:

Densen Cao - Sandy UT 84109

International Classification:

F21V 2900

US Classification:

362294, 362800, 362545, 362373, 362547, 362230

Abstract:

A semiconductor light source for illuminating a physical space has been invented. In various embodiments of the invention, a semiconductor such as and LED chip, laser chip, LED chip array, laser array, an array of chips, or a VCSEL chip is mounted on a heat sink. The heat sink may have multiple panels for mounting chips in various orientations. The chips may be mounted directly to a primary heat sink which is in turn mounted to a multi-panel secondary heat sink. A TE cooler and air circulation may be provided to enhance heat dissipation. An AC/DC converter may be included in the light source fitting.

US Patent:

6634771, Oct 21, 2003

Filed:

Aug 24, 2001

Appl. No.:

09/939488

Inventors:

Densen Cao - Sandy UT 84109

International Classification:

F21V 2900

US Classification:

362294, 362373, 362800, 362545, 362547, 362230

Abstract:

A semiconductor light source for illuminating a physical space has been invented. In various embodiments of the invention, a semiconductor such as and LED chip, laser chip, LED chip array, laser array, an array of chips, or a VCSEL chip is mounted on a heat sink. The heat sink may have multiple panels for mounting chips in various orientations. The chips may be mounted directly to a primary heat sink which is in turn mounted to a multi-panel secondary heat sink. A TE cooler and air circulation may be provided to enhance heat dissipation. An AC/DC converter may be included in the light source fitting.

US Patent:

6700158, Mar 2, 2004

Filed:

Aug 18, 2000

Appl. No.:

09/642071

Inventors:

Densen B. Cao - Sandy UT
Dean Probst - West Jordan UT
Donald J. Roy - West Jordan UT

Assignee:

Fairchild Semiconductor Corporation - South Portland ME

International Classification:

H01L 2976

US Classification:

257330, 257333, 257401, 257510, 257512, 257513

Abstract:

A method of making a trench MOSFET structure having upper trench corner protection, the method not requiring trench corner rounding or sacrificial oxide/strip steps. The trench MOSFET structure fabricated according to the method of the present invention exhibits higher oxide breakdown voltage and lower gate-to-source capacitance.

US Patent:

6719446, Apr 13, 2004

Filed:

Aug 24, 2001

Appl. No.:

09/938777

Inventors:

Densen Cao - Sandy UT 84109

International Classification:

B60Q 100

US Classification:

362547, 362230, 362294, 362373, 362545, 362800

Abstract:

A semiconductor light source for illuminating a physical space has been invented. In various embodiments of the invention, a semiconductor such as and LED chip, laser chip, LED chip array, laser array, an array of chips, or a VCSEL chip is mounted on a heat sink. The heat sink may have multiple panels for mounting chips in various orientations. The chips may be mounted directly to a primary heat sink which is in turn mounted to a multi-panel secondary heat sink. A TE cooler and air circulation may be provided to enhance heat dissipation. An AC/DC converter may be included in the light source fitting.

US Patent:

6719558, Apr 13, 2004

Filed:

Feb 11, 2002

Appl. No.:

10/073819

Inventors:

Densen Cao - Sandy UT 84109

International Classification:

A61C 300

US Classification:

433 29, 362800, 362804

Abstract:

A curing light system useful for curing light activated composite materials is disclosed. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them.

US Patent:

6719559, Apr 13, 2004

Filed:

Feb 12, 2002

Appl. No.:

10/076128

Inventors:

Densen Cao - Sandy UT 84109

International Classification:

A61C 100

US Classification:

433 29, 362800, 362804

Abstract:

A curing light system useful for curing light activated composite materials is disclosed. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them.