Ron van Os - Sunnyvale CA William J. Durbin - Capitola CA Richard H. Matthiesen - San Jose CA Dennis C. Fenske - Felton CA Eric D. Ross - Santa Cruz CA
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
C23C 1600
US Classification:
118728, 118500
Abstract:
An apparatus for processing a substrate comprising a processing chamber and a substrate support system comprising an electrostatic chuck having a body portion and a substrate support surface and one or more arms extending from the body portion to mount the electrostatic chuck to a side wall portion of the processing chamber is provided.
Plasma Enhanced Chemical Processing Reactor And Method
Ron van Os - Sunnyvale CA, US William Durbin - Capitola CA, US Richard Matthiesen - Scotts Valley CA, US Dennis Fenske - Felton CA, US Eric Ross - Santa Cruz CA, US
Assignee:
Applied Materials , Inc.
International Classification:
C23C016/00 C23F001/00
US Classification:
118/72300I, 118/7230MW, 156/345410, 156/345480
Abstract:
A plasma enhanced chemical processing reactor and method. The reactor includes a plasma chamber including a first gas injection manifold and a source of electromagnetic energy. The plasma chamber is in communication with a process chamber which includes a wafer support and a second gas manifold. The plasma generated in the plasma chamber extends into the process chamber and interacts with the reactive gases to deposit a layer of material on the wafer. The reactor also includes a vacuum system for exhausting the reactor. The method includes the steps of generating a plasma within the plasma chamber, introducing at least one gaseous chemical into the process chamber proximate to the wafer support and applying r.f. gradient to induce diffusion of the plasma to the area proximate the wafer support.
Ron van Os - Sunnyvale CA William J. Durbin - Capitola CA Richard H. Matthiesen - San Jose CA Dennis C. Fenske - Felton CA Eric D. Ross - Santa Cruz CA
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
C23C 1600
US Classification:
118723R
Abstract:
A plasma enhance chemical processing reactor and method. The reactor includes a plasma chamber and a source of electromagnetic energy. The plasma chamber is in communication with a process chamber which includes a wager support and a gas manifold. The plasma generated in the plasma chamber extends into the process chamber and interacts with the reactive gases to deposit a layer of material on the wafer. The reactor also includes a vacuum system for exhausting the reactor. The method includes the steps of generating a plasma within the plasma chamber, introducing at least one gaseous chemical into the process chamber proximate to the wafer support and applying r. f. gradient to induce diffusion of the plasma to the area proximate the wafer support.
Plasma Enhanced Chemical Processing Reactor And Method
Ron van Os - Sunnyvale CA William J. Durbin - Capitola CA Richard H. Matthiesen - Scotts Valley CA Dennis C. Fenske - Felton CA Eric D. Ross - Santa Cruz CA
Assignee:
Watkins-Johnson Company - Palo Alto CA
International Classification:
C23C 1600
US Classification:
118723IR
Abstract:
A plasma enhanced chemical processing reactor and method. The reactor includes a plasma chamber including a first gas injection manifold and a source of electromagnetic energy. The plasma chamber is in communication with a process chamber which includes a wafer support and a second gas manifold. The plasma generated in the plasma chamber extends into the process chamber and interacts with the reactive gases to deposit a layer of material on the wafer. The reactor also includes a vacuum system for exhausting the reactor. The method includes the steps of generating a plasma within the plasma chamber, introducing at least one gaseous chemical into the process chamber proximate to the wafer support and applying r. f. gradient to induce diffusion of the plasma to the area proximate the wafer support.
Ron van Os - Sunnyvale CA William J. Durbin - Capitola CA Richard H. Matthiesen - San Jose CA Dennis C. Fenske - Felton CA Eric D. Ross - Santa Cruz CA
Assignee:
Watkins-Johnson Company - Palo Alto CA
International Classification:
B44C 122 C03C 1500
US Classification:
216 67
Abstract:
A plasma enhanced chemical processing reactor and method. The reactor includes a plasma chamber including a first gas injection manifold and a source of electromagnetic energy. The plasma chamber is in communication with a process chamber which includes a wafer support and a second gas manifold. The reactor also includes a vacuum system for exhausting the reactor. The method includes the steps of generating a plasma within the plasma chamber, introducing at least one gaseous chemical into the process chamber proximate to the wafer support, applying r. f. gradient to induce diffusion of the plasma to the area proximate the wafer support, and exhausting the reactor in a substantially symmetrical manner.