A system and method for assembly of semiconductor dies to flexible circuits, wherein the present invention utilizes UV release tape as a temporary, removable carrier for precisely aligning, and maintaining the alignment of, a semiconductor die, and more specifically, the interconnecting pads thereof, with the conducting leads of a flexible circuit; thereby, expediting subsequent permanent affixation of same via thermo-sonic TAB bonding processes, or the like.
Synatec GoA since 2011
Business Development Manager
Synatec GoA since Jan 2010
Project Manager
Siemens Electronic Assembly Systems LLC 2006 - 2009
Business Manager
Besi 2002 - 2006
General Manager (Datacon North America)
Kulicke and Soffa 1998 - 2002
Product Manager of Die Attach
Education:
Temple University
Skills:
Manufacturing Business Development Product Development Cross Functional Team Leadership Electronics Automotive Semiconductors Product Management Engineering Leadership Engineering Management Product Marketing Sales Management Six Sigma Lean Manufacturing Account Management