David S Auyeung

US Patent:

20140029253, Jan 30, 2014

Filed:

Mar 15, 2013

Appl. No.:

13/836612

Inventors:

DAVID SIUCHEONG AUYEUNG - Carrollton TX, US

Assignee:

ULTRAVISION HOLDINGS, LLC - Dallas TX

International Classification:

F21V 5/02

US Classification:

362235

Abstract:

An optics panel for use in a light emitting diode (LED) lighting is disclosed. A plurality of LEDs is disposed on a substrate and directed outward therefrom. A substantially transparent substrate is disposed over the plurality of LEDs and configured to direct light from each of the plurality of LEDs of the lighting assembly onto a surface having a predetermined bounded area. Light from each of the LEDs is directed by the transparent substrate across the entire area of the surface so that each LED illuminates substantially the entire surface with a substantially equal level of illumination per LED.

US Patent:

20140029259, Jan 30, 2014

Filed:

Mar 15, 2013

Appl. No.:

13/836517

Inventors:

DAVID SIUCHEONG AUYEUNG - Carrollton TX, US

Assignee:

ULTRAVISION HOLDINGS, LLC - Dallas TX

International Classification:

F21V 29/00

US Classification:

36224902

Abstract:

A back panel for use in a light emitting diode (LED) lighting assembly is disclosed. An extruded substrate formed of a thermally conductive material is provided, the substrate having a plurality of fins extending from a first side of the substrate, each of the fins having a substantially rectangular shape oriented so that a longitudinal axis of the fin is substantially parallel to a longitudinal axis of the substrate. At least some of the fins include a hole formed through the fin to enable heated air to rise through the fins. A plurality of LEDs are mounted on a second side of the substrate, and oriented in a longitudinal orientation with the fins oriented parallel to the bottom edge of a surface to be illuminated, such that heat rises perpendicular to the surface of the fin.

US Patent:

20140029274, Jan 30, 2014

Filed:

Mar 15, 2013

Appl. No.:

13/836710

Inventors:

DAVID SIUCHEONG AUYEUNG - Carrollton TX, US

Assignee:

ULTRAVISION HOLDINGS, LLC - Dallas TX

International Classification:

F21K 99/00

US Classification:

362382

Abstract:

A light emitting diode (LED) lighting assembly is disclosed. A first panel having a front surface with a protrusion extending therefrom is provided. A second panel is coupled to the first panel directly below the protrusion, wherein the second panel includes at least one LED. A third substantially transparent panel having a cavity formed therein is provided, wherein the cavity is sized to fit over the second panel, wherein the third panel includes a beveled edge that abuts the first panel at a joint directly below the protrusion, and wherein the protrusion and beveled edge are configured to direct moisture away from the joint.

US Patent:

52545008, Oct 19, 1993

Filed:

Jul 6, 1992

Appl. No.:

7/908987

Inventors:

David S. AuYeung - Austin TX

Assignee:

Advanced Micro Devices, Inc. - Sunnyvale CA

International Classification:

H01L 2156
H01L 2158
H01L 2160

US Classification:

437214

Abstract:

A method of making a molded heat sink for plastic packages constructed for housing semi-conductor devices. Heat is removed from the semiconductor device by direct heat transfer from the device through upstanding members integrally molded in the top of the plastic housing. The integrally molded heat dissipation members facilitate cooling of the semi-conductor die which is not available by normal dissipation by convection and radiation through a generally planar external surface of the package. The molded members permit effective heat dissipation without the thermal coefficient of expansion mismatch which may occur between conventional molded packages and heat sinks secured thereto.

US Patent:

51555794, Oct 13, 1992

Filed:

Feb 5, 1991

Appl. No.:

7/650626

Inventors:

David S. AuYeung - Austin TX

Assignee:

Advanced Micro Devices - Austin TX

International Classification:

H01L 2302
H01L 2348

US Classification:

357 81

Abstract:

A molded heat sink for plastic packages constructed for housing semi-conductor devices. Heat is removed from the semiconductor device by direct heat transfer from the device through upstanding members integrally molded in the top of the plastic housing. The integrally molded heat dissipation members facilitate cooling of the semi-conductor die which is not available by normal dissipation by convection and radiation through a generally planar external surface of the package. The molded members permit effective heat dissipation without the thermal coefficient of expansion mismatch which may occur between conventional molded packages and heat sinks secured thereto.

US Patent:

20160125773, May 5, 2016

Filed:

Jan 11, 2016

Appl. No.:

14/992680

Inventors:

- Dallas TX, US
David Siucheong Auyeung - Carrollton TX, US

International Classification:

G09F 13/22
G09F 13/02

Abstract:

A forty-eight foot wide outdoor billboard can be illuminated at night using only two lighting assemblies. First and second areas of a display surface of the billboard are simultaneously illuminated by emitting light from a number of LEDs mounted in a common plane and redirecting the light toward the display surface using a plurality of optical elements. Each optical element is disposed over only one associated LED and includes a first portion, a second portion and a third portion arranged to direct the light toward the first area of the display surface so that visual media content of the display surface is visible without any additional light.

US Patent:

20160102836, Apr 14, 2016

Filed:

Dec 14, 2015

Appl. No.:

14/968520

Inventors:

- Dallas TX, US
David Siucheong Auyeung - Carrollton TX, US

International Classification:

F21V 5/00
G09F 13/02
G09F 13/22
G09F 15/00
F21K 99/00
F21S 6/00

Abstract:

A lighting assembly can be used for illuminating a predetermined area. The assembly includes a number of LEDs directed toward the predetermined area and a number of lenses. Each lens is disposed over only one associated LED and is configured to direct light from that LED toward the predetermined area, such that the light from each lens is directed across the entire predetermined area. The light intensity from each lens is substantially uniform across the entire predetermined area.

US Patent:

20150241019, Aug 27, 2015

Filed:

May 7, 2015

Appl. No.:

14/706634

Inventors:

- Dallas TX, US
David S. Auyeung - Carrollton TX, US

International Classification:

F21V 5/00
F21V 29/74
G09F 13/02
F21V 29/15
G09F 13/22
F21V 33/00
F21V 29/503

Abstract:

A lighting assembly can be used for illuminating a predetermined area. The assembly includes a number of LEDs directed toward the predetermined area and a number of lenses. Each lens is disposed over only one associated LED and is configured to direct light from that LED toward the predetermined area, such that the light from each lens is directed across the entire predetermined area. The light intensity from each lens is substantially uniform across the entire predetermined area.