Daehwan Jung

US Patent:

20210208336, Jul 8, 2021

Filed:

May 24, 2019

Appl. No.:

17/058057

Inventors:

- Oakland CA, US
Arthur GOSSARD - Santa Barbara CA, US
Daehwan JUNG - Goleta CA, US
Justin NORMAN - Goleta CA, US
Chen SHANG - Goleta CA, US
Yating WAN - Goleta CA, US

International Classification:

G02B 6/12
G02B 6/13
G02B 6/122

Abstract:

A photonic integrated circuit (PIC) includes a semiconductor substrate, one or more passive components, and one or more active components. The one or more passive components are fabricated on the semiconductor substrate, wherein the passive components are fabricated in a III-V type semiconductor layer. The one or more active components are fabricated on top of the one or more passive components, wherein optical signals are communicated between the one or more active components via the one or more passive components.

US Patent:

20200166703, May 28, 2020

Filed:

Sep 19, 2019

Appl. No.:

16/575820

Inventors:

- Albany NY, US
- Oakland CA, US
Douglas COOLBAUGH - Albany NY, US
Daehwan JUNG - Santa Barbara CA, US
Jonathan KLAMKIN - Santa Barbara CA, US
Douglas La Tulipe - Albany NY, US
Songtao LIU - Santa Barbara CA, US
Justin NORMAN - Santa Barbara CA, US

International Classification:

G02B 6/12
G02B 6/132
G02B 6/13

Abstract:

There is set forth herein a method including a substrate; a dielectric stack disposed on the substrate; one or more photonics device integrated in the dielectric stack; and a laser light source having a laser stack including a plurality of structures arranged in a stack, wherein structures of the plurality of structures are integrated in the dielectric stack, wherein the laser stack includes an active region configured to emit light in response to the application of electrical energy to the laser stack.