Christopher M Neill

US Patent:

20070158181, Jul 12, 2007

Filed:

Jan 12, 2006

Appl. No.:

11/330200

Inventors:

Chang Yi - Fremont CA, US
Tatsuru Tanaka - Campbell CA, US
Thomas Greenberg - Berkeley CA, US
Christopher Neill - San Jose CA, US

International Classification:

C23C 14/00

US Classification:

204192120, 204298010

Abstract:

A method of sputter depositing a substantially circumferentially uniform thin film on a surface of a circular, planar disk-shaped substrate, comprising steps of: (a) providing a cathode sputtering apparatus including: a vacuum chamber; a cathode sputtering source comprising a circularly-shaped sputtering target assembly with a first target having a planar sputtering surface and a circumferentially extending edge; and a circular disk-shaped substrate with a planar surface positioned in spaced opposition to the sputtering surface; and (b) sputter depositing the thin film on the substrate surface while providing the chamber with a substantially uniform flow of at least one process gas around the entirety of the circumferentially extending edge of the sputtering target assembly.