Christopher Andrew Case

US Patent:

62174274, Apr 17, 2001

Filed:

Apr 6, 1999

Appl. No.:

9/286430

Inventors:

Christopher J. Case - New Providence NJ
Carlye B. Case - New Providence NJ

Assignee:

Agere Systems Inc. - Murray Hill NJ

International Classification:

B24B 2100

US Classification:

451296

Abstract:

A tool for the linear polishing of substrates includes an endless belt of continuous strength wrapped substantially as a helix of predetermined length and width with a 180 degree twist along the length to increase by a factor of 2. times. the time interval between which belt changes need to be made because of wear-and-tear, significantly reducing the costs associated with the polishing because of reduced down time. In a preferred embodiment for the chemical-mechanical polishing of silicon wafer substrates used in fabricating integrated circuits, the endless belt is constructed as a Mobius strip of a rubberized, urethane composition to be flexible, but yet strong enough to withstand the applied pressure between the polishing belt and the substrate.

US Patent:

50082175, Apr 16, 1991

Filed:

Jun 8, 1990

Appl. No.:

7/534772

Inventors:

Christopher J. Case - New Providence NJ
Kin P. Cheung - Hoboken NJ
Ruichen Liu - Warren NJ
Ronald J. Schutz - Warren NJ
Richard S. Wagner - Bernardsville NJ

Assignee:

AT&T Bell Laboratories - Murray Hill NJ

International Classification:

H01L 21441

US Classification:

437195

Abstract:

Direct contact to shallow junctions in integrated circuits and interconnection between these contacts is achievable by utilizing a specific aluminum CVD process. In this process the aluminum is deposited utilizing a triisobutyl aluminum precursor onto a substrate having a nucleation layer, e. g. a titanium nitride layer. By appropriate choice of this nucleation layer to control the nucleation of the depositing aluminum, suitable contact is made while avoiding void defects present in the absence of such layer.