Jeffrey Karker - Cazenovia NY, US Kirankumar Dalal - N. Andover MA, US Norbert Adams - Syracuse NY, US Charles Mead - Newbury MA, US Juan Sepulveda - Tucson AZ, US
A carrier sub-assembly having improved dimensional stability for applications in electronic and optoelectronic industries is disclosed. The carrier sub-assembly, when housed in an optoelectronic package, for example, includes a metal substrate and an insert which support optoelectronic devices that are optically coupled to one another. The insert allows for the attachment, for example, via laser spot welding, of electronic and optoelectronic devices where direct attachment of a device to the metal substrate is not practical. In one embodiment of the present invention, the carrier sub-assembly includes Kovar™ insert that is attached to copper/tungsten metal substrate in a recess of the metal substrate so that at least a portion of the insert is attached to the metal substrate in three dimensions. A fiber optic assembly is secured to the insert by a Kovar™ clip. When the carrier sub-assembly is exposed to temperature excursions and thermal cycling, dimensional stability in the insert and metal substrate materials is maintained thereby yielding improved optical efficiency between the laser and the fiber optic assembly devices.