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Bhret R Graydon

age ~64

from San Jose, CA

Bhret Graydon Phones & Addresses

  • 5243 Graves Ave, San Jose, CA 95129
  • Santa Clara, CA
  • Campbell, CA

Work

  • Position:
    Clerical/White Collar

Education

  • Degree:
    High school graduate or higher

Emails

Us Patents

  • System And Method For Mounting An Image Capture Device On A Flexible Substrate

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  • US Patent:
    7714931, May 11, 2010
  • Filed:
    Jun 25, 2004
  • Appl. No.:
    10/877816
  • Inventors:
    Harpuneet Singh - Dublin CA, US
    Nicholas E. Brathwaite - Hayward CA, US
    Bhret R. Graydon - San Jose CA, US
  • Assignee:
    Flextronics International USA, Inc. - San Jose CA
  • International Classification:
    H04N 5/225
  • US Classification:
    348374
  • Abstract:
    A digital camera module includes an image capture device mounted on a flexible circuit substrate. In one embodiment of the digital camera module, the image capture device is mounted directly (e. g. , by an adhesive) on the flexible circuit substrate. A stiffener (e. g. , a piece of circuit board material) is mounted to the back of the flexible circuit substrate to support wire bonding of the image capture device onto the flexible circuit substrate and/or to support the mounting of additional components (e. g. , a lens housing).
  • Embedding An Electronic Component Between Surfaces Of A Printed Circuit Board

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  • US Patent:
    7782629, Aug 24, 2010
  • Filed:
    Jul 25, 2007
  • Appl. No.:
    11/828196
  • Inventors:
    Bhret Graydon - San Jose CA, US
    William Kuang-Hua Shu - Sunnyvale CA, US
  • Assignee:
    Flextronics AP, LLC - Broomfield CO
  • International Classification:
    H05K 1/18
  • US Classification:
    361761, 361760, 361763, 361766, 361782, 174262, 174265
  • Abstract:
    A pre-drilled hole, providing a passageway between an upper and a lower surface of a printed circuit board layer, receives a passive component, for example a resistor or a capacitor. In one embodiment the component is cylindrical, with an electrically conductive contact point at each end. The hole diameter is approximately the same as the diameter of the cylindrical component. The hole is similar to a via in a printed circuit board, except that the hole is not plated through (such would cause an electrical short). Electrically conductive lines are provided to the openings of the hole on the upper and the lower surfaces of the PCB. The area of the exposed end of the cylindrical component and the termination of the conducting line is less than the area of a surface mounted component equivalent to the cylindrical component. In some embodiments the hole and inserted component are located directly below a pin pad for a surface mounted device, for example an integrated circuit, providing the equivalent of zero wire and line lengths with no net increase in printed circuit board area.
  • Electronic Component Structure And Method Of Making

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  • US Patent:
    7867806, Jan 11, 2011
  • Filed:
    May 22, 2007
  • Appl. No.:
    11/752181
  • Inventors:
    Bhret Graydon - San Jose CA, US
    William Kuang-Hue Shu - Sunnyvale CA, US
  • Assignee:
    Flextronics AP, LLC - Broomfield CO
  • International Classification:
    H01L 21/00
    H01L 21/50
    H01L 33/00
  • US Classification:
    438 64, 438 67, 438107, 257E21499, 257E33057
  • Abstract:
    An external component, typically a surface mount passive, is attached to a semiconductor die. In some embodiments the passive is placed directly over exposed pads on the semiconductor die and attached using conductive tape or conductive epoxy. In some embodiments the passive is attached to the semiconductor die using non-conductive adhesive and wire bonded to bond pads on the semiconductor die and/or to pads on a substrate to which the semiconductor die is attached.
  • Substrate Device Or Package Using Embedded Layer Of Voltage Switchable Dielectric Material In A Vertical Switching Configuration

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  • US Patent:
    8203421, Jun 19, 2012
  • Filed:
    Apr 2, 2009
  • Appl. No.:
    12/417589
  • Inventors:
    Lex Kosowsky - San Jose CA, US
    Robert Fleming - San Jose CA, US
    Bhret Graydon - San Jose CA, US
  • Assignee:
    Shocking Technologies, Inc. - San Jose CA
  • International Classification:
    H01C 7/10
  • US Classification:
    338 21
  • Abstract:
    A substrate device includes an embedded layer of VSD material that overlays a conductive element or layer to provide a ground. An electrode, connected to circuit elements that are to be protected, extends into the thickness of the substrate to make contact with the VSD layer. When the circuit elements are operated under normal voltages, the VSD layer is dielectric and not connected to ground. When a transient electrical event occurs on the circuit elements, the VSD layer switches instantly to a conductive state, so that the first electrode is connected to ground.
  • Substrates Having Voltage Switchable Dielectric Materials

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  • US Patent:
    8272123, Sep 25, 2012
  • Filed:
    Jan 19, 2011
  • Appl. No.:
    13/009802
  • Inventors:
    Robert Fleming - San Jose CA, US
    Lex Kosowsky - San Jose CA, US
    Shurui Shang - San Jose CA, US
    Bhret Graydon - San Jose CA, US
    Xiaofeng Chen - San Jose CA, US
    Glen Irvin - Newark CA, US
  • Assignee:
    Shocking Technologies, Inc. - San Jose CA
  • International Classification:
    H01R 43/00
  • US Classification:
    29825, 29829, 29846, 361 56
  • Abstract:
    A method for designing a printed circuit board to meet a specification is described. A first voltage switchable dielectric material is placed in apposition with a first copper foil. A second voltage switchable dielectric material is placed in apposition with a second copper foil. An arcuate portion of the first copper foil is placed in apposition with a first side of an aluminum member, an adhesive substance being situated between the first copper foil and the first side of the aluminum member. An arcuate portion of the second copper foil in is placed apposition with a second side of the aluminum member, an adhesive substance being situated between the second copper foil and the second side of the aluminum member.
  • Substrates Having Voltage Switchable Dielectric Materials

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  • US Patent:
    8399773, Mar 19, 2013
  • Filed:
    Jan 27, 2010
  • Appl. No.:
    12/694702
  • Inventors:
    Lex Kosowsky - San Jose CA, US
    Bhret Graydon - San Jose CA, US
    Shurui Shang - San Jose CA, US
    Robert Fleming - San Jose CA, US
  • Assignee:
    Shocking Technologies, Inc. - San Jose CA
  • International Classification:
    H05K 9/00
    G06F 17/50
    B05D 5/12
    H05K 1/11
  • US Classification:
    174250, 174255, 174256, 361748, 361750, 361762, 361795, 428209, 428212
  • Abstract:
    Various aspects provide for incorporating a VSDM into a substrate to create an ESD-protected substrate. In some cases, a VSDM is incorporated in a manner that results in the ESD-protected substrate meeting one or more specifications (e. g. , thickness, planarity, and the like) for various subsequent processes or applications. Various aspects provide for designing a substrate (e. g. , a PCB) incorporating a VSDM, and adjusting one or more aspects of the substrate to design a balanced, ESD-protected substrate. Certain embodiments include molding a substrate having a VSDM layer into a first shape.
  • Conductive Stiffener For A Flexible Substrate

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  • US Patent:
    20070254117, Nov 1, 2007
  • Filed:
    May 1, 2006
  • Appl. No.:
    11/381093
  • Inventors:
    Bhret Graydon - San Jose CA, US
    Steve Frandrup - Hampton MN, US
  • International Classification:
    B32B 37/12
    B31B 45/00
  • US Classification:
    428034100, 156320000, 428343000
  • Abstract:
    A structure is disclosed for connecting an electrically-connectable metal stiffener to a ground connection within a flexible substrate, the stiffener comprising nickel-gold plated stainless steel. In one embodiment the stiffener is secured to the flexible substrate by a non-conducting adhesive which includes an opening over a ground connection, the adhesive opening being filled by a conductive epoxy. A sequence for applying the disclosed materials discloses a method for attaching the stiffening structure to the flexible substrate.
  • Components Having Voltage Switchable Dielectric Materials

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  • US Patent:
    20100243302, Sep 30, 2010
  • Filed:
    Mar 25, 2010
  • Appl. No.:
    12/731557
  • Inventors:
    Lex Kosowsky - San Jose CA, US
    Bhret Graydon - San Jose CA, US
    Robert Fleming - San Jose CA, US
  • International Classification:
    H05K 1/11
    H05K 1/09
  • US Classification:
    174257, 174261, 174266
  • Abstract:
    Various aspects provide for structures and devices to protect against spurious electrical events (e.g., electrostatic discharge). Some embodiments incorporate a voltage switchable dielectric material (VSDM) bridging a gap between two conductive pads. Normally insulating, the VSDM may conduct current from one pad to the other during a spurious electrical event (e.g., shunting current to ground). Some aspects include gaps having a gap width that is greater than 50% of a spacing between electrical leads connected to the pads. Some devices include single layers of VSDM. Some devices include multiple layers of VSDM. Various devices may be designed to increase a ratio of active volume (of VSDM) to inactive volume.

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