Apoorva Murarka

US Patent:

20100188796, Jul 29, 2010

Filed:

Dec 13, 2009

Appl. No.:

12/636757

Inventors:

Vladimir Bulovic - Lexington MA, US
Corinne Evelyn Packard - Somerville MA, US
Jennifer Jong-Hua Yu - Palo Alto CA, US
Apoorva Murarka - Cambridge MA, US
LeeAnn Kim - Somerville MA, US

Assignee:

Massachusetts Institute of Technology - Cambridge MA

International Classification:

H01G 7/00
B29C 63/00

US Classification:

361280, 156344

Abstract:

The embodiments disclosed herein are directed to fabrication methods useful for creating MEMS via microcontact printing by using small organic molecule release layers. The disclose method enables transfer of a continuous metal film onto a discontinuous platform to form a variable capacitor array. The variable capacitor array can produce mechanical motion under the application of a voltage. The methods disclosed herein eliminate masking and other traditional MEMS fabrication methodology. The methods disclosed herein can be used to form a substantially transparent MEMS having a PDMS layer interposed between an electrode and a graphene diaphragm.

US Patent:

20120069488, Mar 22, 2012

Filed:

Sep 29, 2011

Appl. No.:

13/248901

Inventors:

Vladimir Bulovic - Lexington MA, US
Corinne Evelyn Packard - Somerville MA, US
Jennifer Jong-Hua Yu - Palo Alto CA, US
Apoorva Murarka - Cambridge MA, US
LeeAnn Kim - Somerville MA, US

Assignee:

MASSACHUSETTS INSTITUTE OF TECHNOLOGY - Cambridge MA

International Classification:

H01G 4/06

US Classification:

361311, 29 2542

Abstract:

The embodiments disclosed herein are directed to fabrication methods useful for creating MEMS via microcontact printing by using small organic molecule release layers. The disclose method enables transfer of a continuous metal film onto a discontinuous platform to form a variable capacitor array. The variable capacitor array can produce mechanical motion under the application of a voltage. The methods disclosed herein eliminate masking and other traditional MEMS fabrication methodology. The methods disclosed herein can be used to form a substantially transparent MEMS having a PDMS layer interposed between an electrode and a graphene diaphragm.

US Patent:

20140054732, Feb 27, 2014

Filed:

Sep 5, 2012

Appl. No.:

13/604613

Inventors:

Apoorva MURARKA - Cambridge MA, US
Vladimir BULOVIC - Lexington MA, US

Assignee:

MASSACHUSETTS INSTITUTE OF TECHNOLOGY - Cambridge MA

International Classification:

B81C 1/00
B81B 3/00

US Classification:

257419, 438 53

Abstract:

The disclosure provides methods and apparatus for release-assisted microcontact printing of MEMS. Specifically, the principles disclosed herein enable patterning diaphragms and conductive membranes on a substrate having articulations of desired shapes and sizes. Such diaphragms deflect under applied pressure or force (e.g., electrostatic, electromagnetic, acoustic, pneumatic, mechanical, etc.) generating a responsive signal. Alternatively, the diaphragm can be made to deflect in response to an external bias to measure the external bias/phenomenon. The disclosed principles enable transferring diaphragms and/or thin membranes without rupturing.

US Patent:

20160380404, Dec 29, 2016

Filed:

Apr 27, 2016

Appl. No.:

15/140282

Inventors:

- Cambridge MA, US
Jeffrey Hastings LANG - Sudbury MA, US
Apoorva MURARKA - Cambridge MA, US
Annie I-Jen WANG - Cambridge MA, US
Wendi CHANG - Annandale VA, US

International Classification:

H01S 3/105
H01S 3/0933
G01L 1/24
H01S 3/16
B81C 1/00
H01S 3/08
H01S 3/094

Abstract:

The disclosure relates to method and apparatus for micro-contact printing of micro-electromechanical systems (“MEMS”) in a solvent-free environment. The disclosed embodiments enable forming a composite membrane over a parylene layer and transferring the composite structure to a receiving structure to form one or more microcavities covered by the composite membrane. The parylene film may have a thickness in the range of about 100 nm-2 microns; 100 nm-1 micron, 200-300 nm, 300-500 nm, 500 nm to 1 micron and 1-30 microns. Next, one or more secondary layers are formed over the parylene to create a composite membrane. The composite membrane may have a thickness of about 100 nm to 700 nm to several microns. The composite membrane's deflection in response to external forces can be measured to provide a contact-less detector. Conversely, the composite membrane may be actuated using an external bias to cause deflection commensurate with the applied bias. Applications of the disclosed embodiments include tunable lasers, microphones, microspeakers, remotely-activated contact-less pressure sensors and the like.

US Patent:

20160130138, May 12, 2016

Filed:

Nov 13, 2014

Appl. No.:

14/541065

Inventors:

- Cambridge MA, US
Jeffrey Hastings LANG - Sudbury MA, US
Annie I-Jen WANG - Cambridge MA, US
Apoorva MURARKA - Cambridge MA, US
Wendi CHANG - Annandale VA, US

International Classification:

B81C 1/00
H01S 5/06
H01S 5/10
B81C 3/00
H01S 5/187

Abstract:

The disclosure relates to method and apparatus for micro-contact printing of micro-electromechanical systems (“MEMS”) in a solvent-free environment. The disclosed embodiments enable forming a composite membrane over a parylene layer and transferring the composite structure to a receiving structure to form one or more microcavities covered by the composite membrane. The parylene film may have a thickness in the range of about 100 nm-2 microns; 100 nm-1 micron, 200-300 nm, 300-500 nm, 500 nm to 1 micron and 1-30 microns. Next, one or more secondary layers are formed over the parylene to create a composite membrane. The composite membrane may have a thickness of about 100 nm to 700 nm to several microns. The composite membrane's deflection in response to external forces can be measured to provide a contact-less detector. Conversely, the composite membrane may be actuated using an external bias to cause deflection commensurate with the applied bias. Applications of the disclosed embodiments include tunable lasers, microphones, microspeakers, remotely-activated contact-less pressure sensors and the like.

US Patent:

20150357142, Dec 10, 2015

Filed:

Jan 28, 2014

Appl. No.:

14/763681

Inventors:

- Cambridge MA, US
Jeffrey H. Lang - Sudbury MA, US
Hae-Seung Lee - Lexington MA, US
Timothy M. Swager - Newton MA, US
Trisha L. Andrew - Madison WI, US
Matthew Eric D'Asaro - Cambridge MA, US
Parag Deotare - Medford MA, US
Apoorva Murarka - Cambridge MA, US
Farnaz Niroui - Ontario, CA
Ellen Sletten - Somerville MA, US
Annie I-Jen Wang - Cambridge MA, US

Assignee:

Massachusetts Institute of Technology - Cambridge MA

International Classification:

H01H 59/00
H01H 49/00

Abstract:

Electromechanical devices described herein may employ tunneling phenomena to function as low-voltage switches. Opposing electrodes may be separated by an elastically deformable layer which, in some cases, may be made up of a non-electrically conductive material. In some embodiments, the elastically deformable layer is substantially free of electrically conductive material. When a sufficient actuation voltage and/or force is applied, the electrodes are brought toward one another and, accordingly, the elastically deformable layer is compressed. Though, the elastically deformable layer prevents the electrodes from making direct contact with one another. Rather, when the electrodes are close enough to one another, a tunneling current arises therebetween. The elastically deformable layer may exhibit spring-like behavior such that, upon release of the actuation voltage and/or force, the separation distance between electrodes is restored. Thus, the electromechanical device may be actuated between open and closed switch positions.

US Patent:

20150311664, Oct 29, 2015

Filed:

Nov 13, 2014

Appl. No.:

14/541071

Inventors:

- Cambridge MA, US
Jeffrey Hastings LANG - Sudbury MA, US
Apoorva MURARKA - Cambridge MA, US
Annie I-Jen WANG - Cambridge MA, US
Wendi CHANG - Annandale VA, US

International Classification:

H01S 3/106
H01S 3/0941
H01S 3/07
G02B 26/00
H01S 3/16
H01S 3/13
H01S 3/105
H01S 3/0933
H01S 3/08

Abstract:

The disclosure relates to method and apparatus for micro-contact printing of micro-electromechanical systems (“MEMS”) in a solvent-free environment. The disclosed embodiments enable forming a composite membrane over a parylene layer and transferring the composite structure to a receiving structure to form one or more microcavities covered by the composite membrane. The parylene film may have a thickness in the range of about 100 nm-2 microns; 100 nm-1 micron, 200-300 nm, 300-500 nm, 500 nm to 1 micron and 1-30 microns. Next, one or more secondary layers are formed over the parylene to create a composite membrane. The composite membrane may have a thickness of about 100 nm to 700 nm to several microns. The composite membrane's deflection in response to external forces can be measured to provide a contact-less detector. Conversely, the composite membrane may be actuated using an external bias to cause deflection commensurate with the applied bias. Applications of the disclosed embodiments include tunable lasers, microphones, microspeakers, remotely-activated contact-less pressure sensors and the like.