Alin Ila

US Patent:

7455526, Nov 25, 2008

Filed:

Sep 28, 2007

Appl. No.:

11/863810

Inventors:

Alin Ila - Phoenix AZ, US
Mehdi Imaninejad - Phoenix AZ, US
Xiaoqing Ma - Gilbert AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01R 13/60

US Classification:

439 41, 439940

Abstract:

Disclosed is an electrical connector assembly. The electrical connector assembly comprises a land grid array socket and the pick-and-placed (PnP) cap. The land grid array socket comprises a socket body and a loading mechanism. The PnP cap is removably attached to the peripheral edge of the socket body for covering a first surface of the socket body. The loading mechanism comprising a loading plate is mounted over the socket body and the PnP cap. The PnP cap detachably engages the loading plate, when the loading plate is mounted over the PnP cap.

US Patent:

20070297143, Dec 27, 2007

Filed:

Jun 27, 2006

Appl. No.:

11/426929

Inventors:

Robert R. Martinson - Hillsboro OR, US
Alin Ila - Phoenix AZ, US
Mandy Mistkawi - Portland OR, US

International Classification:

H05K 7/20

US Classification:

361719, 361700

Abstract:

Embodiments of the invention provide single loading mechanism that both pushes a semiconductor package against a socket and pushes a cooling solution against the semiconductor package. This loading mechanism may take up less motherboard real estate than if two different attachment and loading mechanisms were used.

US Patent:

20080218972, Sep 11, 2008

Filed:

Mar 6, 2007

Appl. No.:

11/714333

Inventors:

Ioan Sauciuc - Phoenix AZ, US
Seri Lee - Beaverton OR, US
Alin Ila - Phoenix AZ, US
Steven Girouard - Maricopa AZ, US
Javier Leija - Chandler AZ, US
Behre Mulugeta - Union City CA, US

International Classification:

H05K 7/20
F28F 13/00

US Classification:

361704, 165185

Abstract:

A cooling device includes a heat sink () having a plurality of fins () and a piezoelectric assembly () having an actuator () and a plurality of blades () coupled to the actuator. The actuator includes a plurality of metal electrodes () and a plurality of piezoelectric layers (). The fins of the heat sink are intertwined with the blades of the piezoelectric assembly.

US Patent:

20190006251, Jan 3, 2019

Filed:

Jun 30, 2017

Appl. No.:

15/638704

Inventors:

- Santa Clara CA, US
John Lofgren - Gilbert AZ, US
Santosh Pabba - Aloha OR, US
Kevin Pounds - Aloha OR, US
Alin Ila - Phoenix AZ, US

International Classification:

H01L 23/13
H01L 23/31
H01L 23/00
H05K 13/00

Abstract:

A carrier medium for a semiconductor die includes a carrier tape with at least one pocket for the die to sit in and a selectively applied non-activated adhesive on the carrier tape.

US Patent:

20180376631, Dec 27, 2018

Filed:

Jun 22, 2017

Appl. No.:

15/629908

Inventors:

- Santa Clara CA, US
Alin ILA - Phoenix AZ, US
Nathan P. HECKATHORNE - Chandler AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 13/04
G01R 31/26
H05K 3/32
B23P 19/00
B25J 15/00

Abstract:

Described herein are pick and place devices having reconfigurable nozzle subassemblies, as well as related devices and methods. In some embodiments, a pick and place device may have a reusable base plate, and a plurality of reusable vacuum nozzle subassemblies that are removably coupled to the base plate in a first configuration. In some embodiments, plurality of vacuum nozzle subassemblies may be removed, then removably re-coupled to the base plate in a second configuration. In some embodiments, a pick and place device may include a base plate, a plurality of nozzle subassemblies removably attached to the base plate, where individual nozzle subassemblies include a vacuum nozzle, a vacuum connection, and a base; and a top plate coupled to the base plate, where the top plate includes a plurality of openings configured to seat the plurality of nozzle subassemblies.