Alaa A Elmoursi

US Patent:

6808817, Oct 26, 2004

Filed:

Mar 15, 2002

Appl. No.:

10/098800

Inventors:

Donald T. Morelli - White Lake MI
Alaa A. Elmoursi - Troy MI
Thomas H. Van Steenkiste - Ray MI
Brian K. Fuller - Rochester Hills MI
Bryan A. Gillispie - Warren MI
Daniel W. Gorkiewicz - Washington MI

Assignee:

Delphi Technologies, Inc. - Troy MI

International Classification:

B32B 310

US Classification:

428469, 428698, 428702, 4273762, 427421

Abstract:

Disclosed is a method for forming a heat sink laminate and a heat sink laminate formed by the method. In the method a particle mixture is formed from a metal, an alloy or mixtures thereof with a ceramic or mixture of ceramics. The mixture is kinetically sprayed onto a first side of a dielectric material to form a metal matrix composite layer. The second side of the dielectric material is thermally coupled to a heat sink baseplate, thereby forming the heat sink laminate.

US Patent:

6896933, May 24, 2005

Filed:

Apr 5, 2002

Appl. No.:

10/116927

Inventors:

Thomas Hubert Van Steenkiste - Ray MI, US
John R. Smith - Birmingham MI, US
Daniel William Gorkiewicz - Washington MI, US
Alaa A. Elmoursi - Troy MI, US
Bryan A. Gillispie - Warren MI, US
Nilesh B. Patel - Macomb Township MI, US

Assignee:

Delphi Technologies, Inc. - Troy MI

International Classification:

B05D001/02

US Classification:

427422, 427446, 427450, 427451, 427452, 427453, 427455, 427456, 427427, 427189, 427190, 427191, 427192, 427193

Abstract:

A method of maintaining a non-obstructed interior opening in a kinetic spray nozzle is disclosed. The method includes the steps of providing a mixture of particles including first particle population and a second particle population; entraining the mixture of particles into a flow of a gas at a temperature below the melt temperature of the particle populations; and directing the mixture of particles entrained in the flow of gas through a supersonic nozzle to accelerate the first particle population to a velocity sufficient to result in adherence of the first particle population on a substrate positioned opposite the nozzle. The operating conditions of the kinetic spray system are selected such that the second particle population is not accelerated to a velocity sufficient to result in adherence when it impacts the substrate. The inclusion of the second particle population maintains the supersonic nozzle in a non-obstructed condition and also enables one to raise the main gas operating temperature to a much higher level, thereby increasing the deposition efficiency of the first particle population.

US Patent:

6949300, Sep 27, 2005

Filed:

Apr 16, 2003

Appl. No.:

10/418244

Inventors:

Bryan A. Gillispie - Warren MI, US
Zhibo Zhao - Ann Arbor MI, US
John Robert Smith - Birmingham MI, US
Thomas Hubert Van Steenkiste - Ray MI, US
Alaa A. Elmoursi - Troy MI, US
Yang Luo - East Amherst NY, US
Hartley F. Hutchins - Lockport NY, US

Assignee:

Delphi Technologies, Inc. - Troy MI

International Classification:

B32B015/01
B05D001/02

US Classification:

428654, 148516, 427180, 427189, 427191, 427192, 427201, 427202, 427203, 427205, 427310, 427406, 428546, 428548, 428553, 428557, 428615, 428636, 428650, 428658, 428937, 428940

Abstract:

The present invention is directed to a process for preparing aluminum and aluminum alloy surfaces in heat exchangers for brazing by depositing thereon a kinetic sprayed brazing composition. The process simultaneously deposits monolith or composite coatings that can include all braze materials and corrosion protection materials used in the brazing of aluminum fins to plates and tubes in a single stage.

US Patent:

7081376, Jul 25, 2006

Filed:

Oct 25, 2004

Appl. No.:

10/972919

Inventors:

Donald T. Morelli - White Lake MI, US
Alaa A. Elmoursi - Troy MI, US
Thomas H. Van Steenkiste - Ray MI, US
Brian K. Fuller - Rochester Hills MI, US
Bryan A. Gillispie - Warren MI, US
Daniel W. Gorkiewicz - Washington MI, US

Assignee:

Delphi Technologies, Inc. - Troy MI

International Classification:

H01L 21/44

US Classification:

438122, 438784

Abstract:

Disclosed is a method for forming a heat sink laminate and a heat sink laminate formed by the method. In the method a particle mixture is formed from a metal, an alloy or mixtures thereof with a ceramic or mixture of ceramics. The mixture is kinetically sprayed onto a first side of a dielectric material to form a metal matrix composite layer. The second side of the dielectric material is thermally coupled to a heat sink baseplate, thereby forming the heat sink laminate.

US Patent:

7351450, Apr 1, 2008

Filed:

Oct 2, 2003

Appl. No.:

10/677869

Inventors:

Brian K Fuller - Rochester Hills MI, US
Alaa A. Elmoursi - Troy MI, US
Kenneth M Rahmoeller - West Bloomfield MI, US

Assignee:

Delphi Technologies, Inc. - Troy MI

International Classification:

C23C 4/12
B05D 1/12

US Classification:

427456, 427446, 427448, 427455, 427142, 427140, 427180, 427203, 427205, 427422

Abstract:

Disclosed is a method for repairing defects in kinetically sprayed surfaces. The typical defects comprise isolated or connected conical shaped holes in the kinetic spray coating. The repair involves thermally spraying a molten material into the defective area to fill in the cone followed by continued kinetic spraying to complete the coating.

US Patent:

7476422, Jan 13, 2009

Filed:

May 23, 2002

Appl. No.:

10/154342

Inventors:

Alaa A. Elmoursi - Troy MI, US
Frans P. Lautzenhiser - Collegeville PA, US
Albert B. Campbell - Detroit MI, US
John R. Smith - Birmingham MI, US

Assignee:

Delphi Technologies, Inc. - Troy MI

International Classification:

B05D 5/12
B05D 1/08
C23C 4/08

US Classification:

427446, 427 961, 427448, 427455

Abstract:

The invention concerns a copper-based circuit having an electrically insulative substrate, a bond layer including silver formed over select portions of the substrate according to a desired shape of the circuit, and an electrically conductive layer including plastically deformed particles of copper deposited on the bond layer. Furthermore, the invention also concerns a process for forming a copper-based circuit, wherein the process includes the steps of providing an electrically insulative substrate, forming a bond layer including silver over select portions of the substrate according to a desired shape of the circuit, and depositing copper on the bond layer by the steps of introducing copper particles into a pressurized carrier gas, forming the pressurized carrier gas and the copper particles into a supersonic jet, and directing the jet toward the bond layer formed over the substrate such that the jet has a velocity sufficient to cause plastic deformation of the copper particles onto the bond layer, thereby forming an electrically conductive layer on the bond layer.

US Patent:

7862342, Jan 4, 2011

Filed:

Mar 18, 2009

Appl. No.:

12/406509

Inventors:

Xin Zhou - Franklin Park PA, US
Alaa Abdel-Azim Elmoursi - Troy MI, US
Javed Abdurrazzaq Mapkar - Farmington Hills MI, US
James Jeffery Benke - Pittsburgh PA, US
William E. Beatty - Beaver PA, US
Robert W. Mueller - Aliquippa PA, US

Assignee:

Eaton Corporation - Cleveland OH

International Classification:

H01R 12/00

US Classification:

439 60

Abstract:

An electrical interface includes a nano-particle layer. The electrical interface also includes a first conductor and a second conductor. The nano-particle layer and the first and second conductors are electrically coupled together.

US Patent:

8039096, Oct 18, 2011

Filed:

Jun 29, 2009

Appl. No.:

12/493713

Inventors:

Dong Zhu - Farmington Hills MI, US
Robert Milner - Warren MI, US
Alaa AbdelAzim Elmoursi - Troy MI, US

Assignee:

Eaton Corporation - Cleveland OH

International Classification:

B32B 5/14
B32B 5/00
B05D 3/00
B05D 3/10
C23C 14/34

US Classification:

428220, 428332, 427299, 427307, 20419211

Abstract:

A coating includes a first layer of a ceramic alloy and a second layer disposed on the first layer and including carbon. The coating has a hardness of from 10 to 20 GPa and a coefficient of friction of less than or equal to 0. 12. A method of coating a substrate includes cleaning the substrate, forming the first layer on the substrate, and depositing the second layer onto the first layer to thereby coat the substrate.