Todd A Albertson

US Patent:

20220313069, Oct 6, 2022

Filed:

Jun 21, 2022

Appl. No.:

17/845006

Inventors:

- Scottsdale AZ, US
Todd Albertson - Portland OR, US

International Classification:

A61B 1/00
H01R 12/65
H01R 13/405
H01R 13/52
H01B 7/20
H01B 7/02
H01B 3/44
H01B 13/06
H01B 13/004

Abstract:

A cable assembly, comprising a component, a cable, a rigid adhesive and a flexible adhesive. The cable may be coupled to the component. The rigid adhesive may be applied to cover the connection of the cable to the component. The flexible adhesive may be applied to cover the rigid adhesive. The component may comprise a ball grid array (BGA) and the cable may be coupled to the BGA. A hypodermic tubing may be applied over a portion of the rigid adhesive.

US Patent:

20210153344, May 20, 2021

Filed:

Jan 28, 2021

Appl. No.:

17/160675

Inventors:

- Scottsdale AZ, US
Todd Albertson - Portland OR, US

International Classification:

H05K 1/02
H01R 12/59
H05K 1/03

Abstract:

A foldable modular flex circuit for attaching to at least one component. The flex circuit may comprise a central area and at least one tab depending from the central area. The central area may comprise a cable attachment section configured to electrically couple to at least one coaxial cable. A first tab may depend from the central area and is configured to electrically couple to a ball grid array (BGA) of the component. A second pair of tabs may depend from the central area and are configured to electrically couple to an additional at least one component, wherein each tab depends substantially perpendicular from the central area.

US Patent:

20210052142, Feb 25, 2021

Filed:

Aug 23, 2020

Appl. No.:

17/000333

Inventors:

- Scottsdale AZ, US
Todd Albertson - Portland OR, US

International Classification:

A61B 1/00
A61M 39/08
A61M 39/10
A61B 1/05
A61B 1/045

Abstract:

A cable attachment system and method for use with micro sensing component in a sterile environment. The cable attachment system may comprise a sensor, a cable connected to the sensor at a first end, a connector coupled to a second end of the cable, and a board coupled to the connector. A medical grade tubing may encase the connection of the sensor to the cable and a medical grade housing may encase the connection of the board to the connector and connected to the tubing. The medical grade housing and tubing are configured to create a sealed internal volume in the sterile environment.

US Patent:

20210050691, Feb 18, 2021

Filed:

Aug 4, 2020

Appl. No.:

16/984649

Inventors:

- Scottsdale AZ, US
Todd Albertson - Portland OR, US

International Classification:

H01R 13/6581
H01R 13/24
H01R 13/6598
H05K 3/34
H01R 12/52

Abstract:

A shield for a cable attachment system for attaching a cable to a component having a ball grid array (BGA). The shield may comprise an outer conductive surface, a first end configured to be coupled to a surface of the component, a second end that receives the cable, and an inner non-conductive material received within the shield adjacent the first end and encasing the connection of the cable to the BGA of the component. The cable may be configured to be coupled to the BGA of the component.

US Patent:

20200309818, Oct 1, 2020

Filed:

Mar 27, 2019

Appl. No.:

16/366197

Inventors:

Anil Kaza - Hillsboro OR, US
Donald E. Edenfeld - Beaverton OR, US
Todd P. Albertson - Warren OR, US
Patrick Whiting - Beaverton OR, US

International Classification:

G01R 1/073
G01R 1/067

Abstract:

A probe head may be utilized to test an electronic device. The probe head may include a probe axis extending along a length of the probe head. The probe head may include a probe core including a first metal. The probe core may include a core surface having a first dimension. The first dimension may be perpendicular to the probe axis. The probe core may include a probe tip, for instance extending from the core surface along the probe axis. The probe tip has a second dimension that may be perpendicular to the probe axis. The second dimension may be less than the first dimension of the core surface. The probe head may include a cladding layer that includes a second metal. The cladding layer may be coupled around a perimeter of the probe core. The probe tip may extend beyond the cladding layer.

US Patent:

20200260575, Aug 13, 2020

Filed:

Feb 10, 2020

Appl. No.:

16/786043

Inventors:

- Scottsdale AZ, US
Todd Albertson - Portland OR, US

International Classification:

H05K 1/02
H01R 12/59

Abstract:

A foldable modular flex circuit for attaching to at least one component. The flex circuit may comprise a central area and at least one tab depending from the central area. The central area may comprise a cable attachment section configured to electrically couple to at least one coaxial cable. A first tab may depend from the central area and is configured to electrically couple to a ball grid array (BGA) of the component. A second pair of tabs may depend from the central area and are configured to electrically couple to an additional at least one component, wherein each tab depends substantially perpendicular from the central area.

US Patent:

20200209280, Jul 2, 2020

Filed:

Mar 12, 2020

Appl. No.:

16/817480

Inventors:

- Santa Clara CA, US
David Craig - Hillsboro OR, US
Todd P. Albertson - Warren OR, US
Mohit Mamodia - Chandler AZ, US
Dingying Xu - Chandler AZ, US

Assignee:

INTEL CORPORATION - Santa Clara CA

International Classification:

G01R 1/073
G01R 1/067
G01R 3/00

Abstract:

A prober head to interface an E-testing apparatus to a device under test, which may be an unpackaged die, for example. In some embodiments, the prober head includes an array of conductive pins, each of the pins extending outwardly from a first pin end anchored to a substrate. At least a partial length of each of the pins is coated with a hydrophobic monolayer. The conductive pins may be composite metal wires including a core metal encased by one or more peripheral metal. At a tip of the pins, opposite the first pin end anchored to the substrate, the peripheral metals are recessed from the core metal. In further embodiments, the hydrophobic monolayer is disposed on an outer surface of the peripheral metals, but is substantially absent from a surface of the core metal exposed at the tip.

US Patent:

20170276700, Sep 28, 2017

Filed:

Mar 28, 2016

Appl. No.:

15/083082

Inventors:

Joseph D. Stanford - Portland OR, US
David Craig - Hillsboro OR, US
Todd P. Albertson - Warren OR, US
Mohit Mamodia - Chandler AZ, US
Dingying Xu - Chandler AZ, US

International Classification:

G01R 1/073
G01R 31/28
G01R 3/00

Abstract:

A prober head to interface an E-testing apparatus to a device under test, which may be an unpackaged die, for example. In some embodiments, the prober head includes an array of conductive pins, each of the pins extending outwardly from a first pin end anchored to a substrate. At least a partial length of each of the pins is coated with a hydrophobic monolayer. The conductive pins may be composite metal wires including a core metal encased by one or more peripheral metal. At a tip of the pins, opposite the first pin end anchored to the substrate, the peripheral metals are recessed from the core metal. In further embodiments, the hydrophobic monolayer is disposed on an outer surface of the peripheral metals, but is substantially absent from a surface of the core metal exposed at the tip.